Claims
- 1. An auxiliary material which is for use on a copper foil surface of a copper-clad laminate when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser by irradiating the copper foil surface with an energy of 20 to 60 mJ/pulse sufficient by means of the pulse oscillation of a carbon dioxide gas laser, and which is a coating of a water-soluble resin composition containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, having a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol, a carbon powder and metal powder.
- 2. The auxiliary material according to claim 1, wherein the sheet is a product formed by bonding a water-soluble resin composition to one surface of a thermoplastic film.
- 3. The auxiliary material according to claim 2, wherein the sheet is a product in which the total thickness of the layer of the water-soluble resin composition and the thermoplastic film is 30 to 200 μm.
- 4. The auxiliary material according to claim 2, wherein the sheet is used by disposing the layer of the water-soluble resin composition on the copper foil surface side and laminating the layer of the water-soluble resin composition to the copper foil under heat and pressure.
- 5. The auxiliary material according to claim 2, wherein the sheet is used by wetting the surface of the layer of the water-soluble resin composition 3 μm or less deep with water in advance, disposing the layer of the water-soluble resin composition on the copper foil surface side and laminating under pressure at room temperature.
- 6. A backup sheet for making a hole with a carbon dioxide gas laser, which is for use on a reverse outermost copper foil surface of a copper-clad laminate when a hole is made in the copper-clad laminate with a carbon dioxide gas laser by irradiating a front copper foil surface with an energy of 20 to 60 mJ/pulse by means of the pulse oscillation of a carbon dioxide gas laser and which comprises a 20 to 200 μm thick resin layer of a water-soluble resin composition and a metal plate.
Priority Claims (9)
Number |
Date |
Country |
Kind |
10-68357 |
Mar 1998 |
JP |
|
10-140472 |
May 1998 |
JP |
|
10-145205 |
May 1998 |
JP |
|
10-145206 |
May 1998 |
JP |
|
10-166324 |
May 1998 |
JP |
|
10-167759 |
Jun 1998 |
JP |
|
10-167760 |
Jun 1998 |
JP |
|
10-216411 |
Jul 1998 |
JP |
|
10-250447 |
Aug 1998 |
JP |
|
Parent Case Info
This is a divisional application of Ser. No. 09/271,897, filed Mar. 18, 1999, now U.S. Pat. No. 6,337,463.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
48914 |
Feb 1999 |
JP |
9820533 |
May 1998 |
WO |