Patent Application
20080037768
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is of the best-contemplated mode of carrying out the invention. This description is provided for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims. The electronic apparatus with the microphone module of the invention will be described in the following with reference to the accompanying drawings.
The microphones 104 and the processing chip 102 are substantially arranged in a line, in which the processing chip 102 is located between the microphones 104. In some embodiments, the microphones 104 and the processing chip 102 may have various arrangement.
Both microphones 104 are respectively coupled to the processing chip 102 by bumps 104a and 102a through the carrier 100. Both microphones 104 may be unidirectional type, omnidirectional type, or both types. Moreover, the microphone 104 may be a micro-electro-mechanical system (MENS) microphone or an electret condenser microphone (ECM). Additionally, the processing chip 102 may comprise an analog-to-digital converter (ADC). Moreover, the processing chip 102 may further comprise a digital signal processing (DSP) circuit.
Next, a sound isolated material 106, such as silicone elastomer, liquid encapsulant, PVB (Poly vinyl butyral), EVA (Ethylene vinyl acetate) etc., serves as an encapsulant to encapsulate each microphone 104 and the processing chip 102, thereby forming two isolating chamber 106a and 106b for preventing the microphones 104 from mutual interference. Note that when the microphone 104 is unidirectional type, an opening 103 must be further formed in the encapsulant 106 above the microphone 104 to expose thereof, as shown in
Additionally, each microphone 104 may be optionally capped with a metal housing 108 for radio frequency (RF) shielding, prior to encapsulation of the microphones 104 and the processing chip 102. That is, each metal housing 108 is inside the encapsulant 106 and between the encapsulant 106 and the microphone 108. In some embodiments, the encapsulant 106 may be optionally capped with a metal housing 110 after encapsulation. That is, the metal housing 110 entirely covers the encapsulant 106.
A phone PCB 306 is provided and placed into the phone housing 302. The phone PCB 306 has a rear side 306b having electronic components (not shown) disposed thereon and a front side 306a facing the keypads 304 and the acoustic hole 303 of the phone housing 302. Moreover, the phone PCB 306 comprises at least one through hole 307 substantially aligned the acoustic hole 303 of the phone housing 302.
A display device 310, such as an LCD or organic lighting emitting display (OLED) device is placed in the phone housing 302, corresponding to the display window 305 and coupled to the PCB 306.
A rubber gasket 308 is provided and placed between the phone hosing 302 and the front side 306a of the phone PCB 306. Moreover, the rubber gasket 308 has at least one through hole 309 substantially aligned the acoustic hole 303. The rubber gasket 308 can prevent the cellular phone 300 from moisture damage and block lateral propagation of sound wave, thereby improving phone reliability and sound receipt.
A microphone module 200 shown in
According to the invention, since two different directional types of microphones and a processing chip may be integrated in a microphone module, the functions of echo cancellation, noise suppression and beam-forming may be accomplished by the microphone module, thereby increasing microphone performance. Moreover, since is the microphone module is mounted on the rear side of the phone PCB, the thickness of the cellular phone can be further reduced. That is, an extra-thin design for cellular phones can be accomplished.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
