Claims
- 1. A method of manufacturing a multilayer ceramic electronic element, comprising the steps of:forming a green internal electrode portion by thermally transfer-printing, on a green dielectric layer formed on a support member, a thermal transfer conductor material by a first thermal transfer printing method; and forming a green dielectric portion by thermally transfer-printing, on a surface of said green dielectric layer at where said green internal electrode portion is not formed and which is flush with said green internal electrode portion, a thermal transfer dielectric material by a second thermal transfer printing method so that a substantially flat green internal electrode layer is formed.
- 2. A method of manufacturing a multilayer ceramic electronic element according to claim 1, wherein said green dielectric layer is formed on said support member by a third thermal transfer printing method using said thermal transfer dielectric material.
- 3. A method of manufacturing a multilayer ceramic electronic element according to claim 2, wherein said thermal transfer conductor material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a conductor layer mainly composed of thermoplastic resin, wax and conductor particles or the thermoplastic resin and the conductor particles and an adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin and said thermal transfer dielectric material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a dielectric layer mainly composed of thermoplastic resin, wax and dielectric particles or the thermoplastic resin and the dielectric particles and adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin.
- 4. A method of manufacturing a multilayer ceramic electronic element according to claim 1, wherein said thermal transfer conductor material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a conductor layer mainly composed of thermoplastic resin, wax and conductor particles or the thermoplastic resin and the conductor particles and an adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin and said thermal transfer dielectric material is formed by sequentially laminating, on said support member, a separation layer mainly composed of wax, a dielectric layer mainly composed of thermoplastic resin, wax and dielectric particles or the thermoplastic resin and the dielectric particles and adhesive layer mainly composed of thermoplastic resin and wax or the thermoplastic resin.
- 5. A method of manufacturing a multilayer ceramic electronic element according to any one of claims 1 to 3, wherein a surface of said green internal electrode layer is subjected to a calendering process so that the surface of said green internal electrode layer is flattened.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-332719 |
Dec 1997 |
JP |
|
Parent Case Info
This application is a division of application Ser. No. 09/203,400, filed Dec. 2, 1998, now abandoned.
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