Claims
- 1. A heat sink/isolator for microelectronic packaging, which comprises:
- a plurality of fins stacked upon one another, each fin including a layer of a first material clad to a layer of a second material and a groove at a selected location;
- a plurality of rivets passing through the stacked fins, each rivet having a material composition substantially the same as the second material;
- material to material interfaces between adjacent stacked fins, clad layers of each fin, and the rivets and fins being diffusion bonded to one another so as to form a solidified heat sink structure.
Parent Case Info
This application is a continuation of application Ser. No. 08/182,288, filed Jan. 14, 1994, now abandoned.
US Referenced Citations (53)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0097944A2 |
Jan 1984 |
EPX |
3633907A1 |
Oct 1986 |
DEX |
3633907C1 |
Jun 1989 |
DEX |
63-89477 |
Apr 1988 |
JPX |
224242 |
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JPX |
Non-Patent Literature Citations (2)
Entry |
Karavolis, Michael, Dec. 1993, "Production of Precision Clad `Self Brazing` Materials to Achieve High Yields and Strong Joints". |
Mahaney, H. V., and Vader, D. T., "Predicted and Measured Performance of an Advanced Laminated Heat Sink for Multi-Chip Modules", Nov. 28-Dec. 3, 1993. |
Continuations (1)
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Number |
Date |
Country |
Parent |
182288 |
Jan 1994 |
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