Claims
- 1. An optical module for use in an optical device, comprising:
an optical component; a relative reference mount having a registration configured to couple to a reference substrate; and a bonding material configured to fix the optical component relative to the registration feature of the relative reference mount.
- 2. The optical module of claim 1 including an optical component mount configured to fixedly couple to the optical component.
- 3. The optical module of claim 1 wherein the bonding material comprises solder.
- 4. The optical module of claim 1 wherein the bonding material is electrical conductive.
- 5. The optical module of claim 2 wherein the optical component mount comprises first and second plates with the optical element secured therebetween.
- 6. The optical module of claim 1 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 7. The optical module of claim 1 wherein the bonding material comprises adhesive.
- 8. The optical module of claim 1 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 9. The optical module of claim 8 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 10. The optical module of claim 9 wherein the bonding material is operably coupled to only one of the optical component and the relative reference mount when in a first state.
- 11. The optical module of claim 10 wherein the bonding material is activated to fill the gap.
- 12. The optical module of claim 11 wherein application or removal of heat causes a change in state of the bonding material.
- 13. The optical module of claim 11 wherein application or removal of radiation causes a change in state of the bonding material.
- 14. The optical module of claim 1 wherein the relative reference mount is substantially planar.
- 15. The optical module of claim 1 wherein the reference substrate comprises a substantially planar substrate.
- 16. The optical module of claim 1 wherein the bonding material has a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount.
- 17. The optical module of claim 2 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.
- 18. The optical module of claim 2 wherein the optical component mount includes a registration feature configured to register the optical component.
- 19. The optical module of claim 2 wherein the optical component is bonded to optical component mount.
- 20. The optical module of claim 1 wherein the bonding material is heat activated and at least one heater element is thermally coupled to the bonding material.
- 21. The optical module of claim 2 including a heater element carried on at least one of the relative reference mount and the optical component mount.
- 22. The optical module of claim 21 including electrical conductors on at least one of the relative reference mount and the optical component mount electrically coupled to the heater element.
- 23. The optical module of claim 22 including contact pads electrically coupled to the electrical conductors.
- 24. The optical module of claim 1 including a bonding pad on the relative reference mount configured to adhere to a bonding material coupled to the reference substrate.
- 25. The optical module of claim 1 wherein the relative reference mount comprises silicon.
- 26. The optical module of claim 2 wherein the optical component mount comprises silicon.
- 27. The optical module of claim 2 wherein the optical component mount includes an interface surface and the optical component is flush with the interface surface.
- 28. The optical module of claim 1 wherein the relative reference mount comprises a semiconductor.
- 29. The optical module of claim 1 wherein the relative reference mount comprises a ceramic.
- 30. The optical module of claim 1 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 31. An optical module for use in an optical device, comprising:
an optical component; a substantially planar mount plate coupled to the optical element; a substantially planar relative reference mount configured to couple to a substantially planar fixed references the reference mount bonded by a bonding material to the component mount plate.
- 32. The optical module of claim 31 wherein the bonding material comprises solder.
- 33 The optical module of claim 31 including an optical component mount coupled to the optical component.
- 34. The optical module of claim 31 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 35. The optical module of claim 31 wherein the bonding material comprises adhesive.
- 36. The optical module of claim 31 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 37. The optical module of claim 31 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 38. The optical module of claim 37 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state.
- 39. The optical module of claim 38 wherein application or removal of heat causes a change in state of the bonding material.
- 40. The optical module of claim 31 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.
- 41. The optical module of claim 31 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.
- 42. The optical module of claim 31 wherein the relative reference mount comprises silicon.
- 43. The optical module of claim 34 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 44. An optical module for use in an optical device, comprising:
an optical component; an optical component mount configured to fixedly couple to the optical component; a relative reference mount configured to couple to a reference substrate; and a fixed spacial orientation between the optical component mount and the relative reference mount.
- 45. The optical module of claim 44 including bonding material to fix the relative spacial location.
- 46. The optical module of claim 45 wherein the bonding material comprises solder.
- 47. The optical module of claim 46 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 48. The optical module of claim 47 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.
- 49. The optical module of claim 46 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 50. The optical module of claim 45 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state.
- 51. The optical module of claim 50 wherein the bonding material is activated to fix the spacial orientation.
- 52. The optical module of claim 51 wherein application or removal of heat causes a change in state of the bonding material.
- 53. The optical module of claim 44 wherein the relative reference mount is substantially planar.
- 54. The optical module of claim 44 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.
- 55. The optical module of claim 52 including a heating element carried on at least one of the relative reference mount and the optical component mount.
- 56. The optical module of claim 44 wherein the optical component mount comprises silicon.
- 57. An optical module for use in an optical device, comprising:
an optical component; a relative reference mount having a registration feature configured to couple to a substrate; and bonding material configured to fixedly secure the optical component at a orientation and position relative to the registration feature of the relative reference mount.
- 58. The optical module of claim 57 wherein the bonding material comprises solder.
- 59. The optical module of claim 57 wherein the optical component has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.
- 60. The optical module of claim 57 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.
- 61. The optical module of claim 60 wherein the bonding material has a first state in which the. spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.
- 62. The optical module of claim 61 wherein the bonding material is operably coupled to only one of the optical component mount and the relative reference mount when in a first state.
- 63. The optical module of claim 62 wherein application or removal of heat causes a change in state of the bonding material.
- 64. The optical module of claim 57 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.
- 65. The optical module of claim 57 including an optical component mount configured to couple the optical component to the relative reference mount.
Parent Case Info
[0001] This application is related to co-pending application Ser. No. ______, filed on even date herewith and entitled “OPTICAL MODULE WITH SOLDER BOND”; application Ser. No. ______, filed on even date herewith and entitled “OPTICAL DEVICE”; and application Ser. No. ______, filed on even date-herewith and entitled “OPTICAL ALIGNMENT SYSTEM”, the contents of which are hereby incorporated by reference in their entirety.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09789125 |
Feb 2001 |
US |
Child |
10352798 |
Jan 2003 |
US |