This application is related to co-pending application Ser. No. 09/789,185, filed Feb. 20, 2001 and entitled “OPTICAL MODULE WITH SOLDER BOND”; application Ser. No. 09/789,124, filed Feb. 20, 2001 and entitled “OPTICAL DEVICE”; and application Ser. No. 09/789,317, filed Feb. 20, 2001 and entitled “OPTICAL ALIGNMENT SYSTEM”, the contents of which are hereby incorporated by reference in their entirety.
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Entry |
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“Micro-Mechanical Alignment Structures (patent pending)”, from Web Site of Axsun Technologies, 2 pages, downloaded Feb. 15, 2001. |
“An Innovative Flexible and Accurate Packaging Technique Suited to Fabricate Low Cost Micro Optoelectronic Modules”, by M. Scussat et al., Electronic Components and Technology Conference, 2000, pp. 26-32. |
U.S. patent application Ser. No. 09/894,872, filed Jun. 27, 2001, entitled “Automated Opto-Electronic Assembly Machine and Method”. |
Article from Web Site entitled “The Photonics Program and the Engineering Research Division at LLNL are Automating the Packaging of Optoelectronic Devices to Lower Costs”, 3 pages, downloaded Oct. 19, 2000. |
Article from Web Site entitled “Automated Optoelectronic Packaging”, 2 pages, downloaded Feb. 5, 2001. |
Article from Web Site entitled Micro Assembly Automation, 3 pages., downloaded Feb. 5, 2001. |