Claims
- 1. A device for conveying a sheet member having a pattern for an integrated circuit, comprising:
- a plurality of first members each for covering at least a top of one of a plurality of sheet members;
- a plurality of second members each for covering at least a bottom of one of the plurality of sheet members and each having a surface for supporting one of the plurality of sheet members at its bottom, wherein each of said second members is associated with one of said first members, wherein each of said second members is engageable with its associated first member, and wherein each of said second members is disengageable from its associated first member by movement thereof in a direction substantially parallel to said supporting surface for the sheet member;
- means for accommodating combinations of said first members and their associated second members in an array extending substantially perpendicular to said supporting surfaces; and
- conveying means for moving one of said second members together with the sheet member supported thereon in a direction substantially parallel to said supporting surface to disengage said one of said second members, together with the sheet member supported thereon, from its associated first member and for conveying said one of said second members together with the sheet member supported thereon out of said accommodating means.
- 2. A device according to claim 1, wherein each said second member has an engaging portion for engaging each said second member with an associated first member and for disengaging each said second member from said associated first member, each said engaging portion including a portion at which said associated first member and said associated second member are slidable relative to each other.
- 3. A device according to claim 1, wherein said sheet member includes a pellicle.
- 4. A device according to claim 1, wherein said conveying means includes a fork.
- 5. A device according to claim 1, further comprising a second conveying means for separating the sheet member from said second member and conveying the sheet member.
- 6. A method of conveying a sheet member having a pattern for an integrated circuit, comprising the steps of:
- covering at least the tops of a plurality of sheet members each with a respective one of a plurality of first members;
- covering at least the bottoms of the plurality of sheet members each with a respective one a plurality of second members, wherein each of said first members is associated with one second member;
- supporting each of the plurality of sheet members on a supporting surface of a different one of said plurality of second members;
- accommodating in accommodating means combinations of said first members and their associated second members in an array extending substantially perpendicular to said supporting surface;
- moving one of said plurality of said second members together with the sheet member supported thereon in a direction substantially parallel to said supporting surface to disengage said one of said plurality of second members together with the sheet member supported thereon from its associated first member and conveying said one of said second members together with the sheet member supported thereon out of said accommodating means.
- 7. A method according to claim 6, wherein the moving step includes a sliding action between said first member and said second member.
- 8. A method according to claim 6, wherein the sheet member includes a pellicle.
- 9. A method according to claim 6, wherein said one of said first and second members is restored to a place where it is located in said accommodating step.
Priority Claims (2)
Number |
Date |
Country |
Kind |
58-112928 |
Jun 1983 |
JPX |
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58-112929 |
Jun 1983 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 620,824, filed June 15, 1984, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (5)
Number |
Date |
Country |
56525 |
May 1977 |
JPX |
70828 |
Jun 1977 |
JPX |
40952 |
Mar 1982 |
JPX |
64928 |
Apr 1982 |
JPX |
183032 |
Nov 1982 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Semiconductor Production, "New Automatic Wafer Handling Equipment", Autumn, 1980, pp. 31, 33. |
Continuations (1)
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Number |
Date |
Country |
Parent |
620824 |
Jun 1984 |
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