Claims
- 1. A semiconductor device comprising:
- an insulating crystalline substrate of an alkali halide; and
- an epitaxial layer of PbS.sub.x Se.sub.1-x, having 0.ltoreq.x.ltoreq.1 and a minority charge-carrier lifetime greater then one nanosecond at 26.degree..+-.5.degree. Celsius, on said substrate.
- 2. The semiconducting device set forth in claim 1 wherein the layer has a P-type conductivity.
- 3. The semiconducting device set forth in claim 1 wherein the layer has a N-type conductivity.
- 4. The semiconducting device set forth in claim 1, wherein the insulating crystalline substrate is an alloy of Ba.sub.z Sr.sub.1-z F.sub.2, where 0<z<1.
- 5. The semiconducting device set forth in claim 1, further comprising:
- the epitaxial layer having a region of first type conductivity and a region of a second and opposite type conductivity contiguous to the region of the first type conductivity in said epitaxial layer, whereby a P-N type junction is formed by the contiguous surfaces of the regions in said epitaxial layer.
- 6. A semiconducting device, comprising:
- an insulating crystalline substrate of an alkali-halide;
- an epitaxial layer of a semiconducting material selected from the group consisting of lead salts and lead tin salts, deposited upon the substrate while the substrate is maintained in a vacuum at a temperature greater than 350.degree. Celsius and below the sublimitation temperature of the material.
- 7. The semiconducting device set forth in claims 1 or 6, wherein the alkali halide is an alloy of Ba.sub.z Sr.sub.1-z F.sub.2, where 0<z<1.
- 8. A semiconducting device, comprising:
- an insulating, crystalline substrate of Ba.sub.z Sr.sub.1-z F.sub.2 where 0<z<1;
- an epitaxial layer of PbS.sub.x Se.sub.1-x, wherein x varies between zero and one, deposited upon the substrate while the substrate is maintained in a vacuum at a temperature greater than 350.degree. Celsius and lower than the sublimitation temperature of PbS.sub.x Se.sub.1-x.
- 9. The semiconducting device set forth in claims 1, 6, or 8 wherein the epitaxial layer is deposited upon the substrate while the substrate is maintained in a vacuum at a temperature greater than 400.degree. Celsius.
- 10. The semiconducting device set forth in claims 1, 6, or 8 wherein
- the epitaxial layer has a thickness less than the effective miniority-charge-carrier diffusion length in the epitaxial layer.
- 11. The semiconducting device set forth in claim 10 wherein the minority charge carrier diffusion length is less than 6.1 microns.
Parent Case Info
This divisional application makes reference to my earlier filed application, Ser. No. 801,431, filed on May 27, 1977, now U.S. Pat. No. 4,154,631 now copending, for the purpose of obtaining the benefits specified under 35 U.S.C. 120.
US Referenced Citations (3)
Non-Patent Literature Citations (4)
Entry |
Hohnke et al., Appl. Phys. Lett., vol. 29, No. 2, Jul. 15, 1976, pp. 98-1 0. |
Lovecchio et al., Infared Physics, (1975) vol. 15, No. 4, pp. 295-301. |
Holloway et al., Appl. Phys. Lett., vol. 30, No. 4, Feb. 15, 1977, pp. 210-212. |
Melngailis et al., Appl. Phy. Lett., vol. 9, No. 8, Oct. 15, 1966. |
Divisions (1)
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Number |
Date |
Country |
Parent |
801431 |
May 1977 |
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