Patent Application
20130000846
The present invention relates to the formation of semiconductor devices. More specifically, the present invention relates to etching through a patterned mask.
During semiconductor wafer processing, features of the semiconductor device are defined in the wafer using well-known patterning and etching processes. In these processes, a photoresist (PR) material is deposited on the wafer and then is exposed to light filtered by a reticle. The reticle is generally a glass plate that is patterned with exemplary feature geometries that block light from propagating through the reticle.
After passing through the reticle, the light contacts the surface of the photoresist material. The light changes the chemical composition of the photoresist material such that a developer can remove a portion of the photoresist material. In the case of positive photoresist materials, the exposed regions are removed, and in the case of negative photoresist materials, the unexposed regions are removed. Thereafter, the wafer is etched to remove the underlying material from the areas that are no longer protected by the photoresist material, and thereby define the desired features in the wafer.
Various generations of photoresist are known. Deep ultra violet (DUV) photoresist is exposed by 248 nm light. Presently, for 248 nm photoresist a typical critical dimension (CD) for the photoresist may be 130-250 nm using conventional processes. Due to optical properties dependent on wavelength, photoresist exposed by longer wavelength light has larger theoretical minimal critical dimensions. In order to provide features with smaller CD, features formed using shorter wavelength light are being pursued. 193 nm photoresist is exposed by 193 nm light. Using phase shift reticles and other technology, a 55-100 nm CD photoresist pattern may be formed using 193 nm photoresist. This would be able to provide a feature with a CD of 90-100 nm. 193 nm Immerrsion photoresist is exposed by 193nm light with water in direct contact with the wafer surface. Using phase shift reticles and other technology 55 nm CD photoresist patterns may be formed and this will be extended in the future. This would be able to provide a feature with a sub 90 nm CD. EUV (13 nm) photoresist is exposed by 13nm light. Using this technology sub 22 nm CD photoresist patterns may be formed. This would be able to provide a feature with a sub 55 nm CD.
The use of shorter wavelength photoresists may provide additional problems over photoresists using longer wavelengths. To obtain CD's close to the theoretical limit, the lithography apparatus should be more precise, which would require more expensive lithography equipment. Shorter wavelength photoresists may not have selectivities as high as longer wavelength photoresists and may more easily deform under plasma etch conditions (except for EUV photoresists which typically use 248 nm based backbones for their base polymers).
For photolithography printing, 193 nm immersion scanners for PR patterns have reached their limit in terms of the size of the optics which determines the maxim resolution, i.e., the minimum pattern size they can print. In order to go beyond the optical limit, for example, to achieve a half-pitch pattern, the design pattern may be split into two masks. For example, in a dual line approach, a first PR mask pattern (with a first set of lines) is printed using a first mask, and then a second PR pattern (with a second set of lines) is printed using a second mask. The combination of the first and second sets of lines will reduce the line pitch to a one-half. Such an approach is referred to as “double patterning” or “litho-etch-litho-etch” process. Conventional litho-etch-litho-etch process typically involves etching a hardmask twice: first through the first PR mask and then through the second PR mask. Certain litho-etch-litho-etch processes use two layers of hardmasks; the first hardmask etched through the first PR mask; and the second hardmask selectively etched through the second PR mask. In either case, the first PR mask is stripped before the second PR mask is formed.
An alternative approach of double patterning uses a protective layer for a first PR mask, which is formed before applying a second PR material onto the first PR mask. In general, when a liquid PR material is applied onto a wafer having a patterned PR mask, the polymer of the patterned PR mask would dissolve when it comes in contact with most organic solvents. Thus, another type of formulated system, such as a water soluble, acid cross-linkable coating material, can be used to form a protective layer onto the first PR mask so as to prevent the patterned PR mask from dissolving into an organic solvent of the second PR material. It is preferable that the solvent of the protective coating material does not dissolve the first PR so that the coating does not disturb the first patterned PR significantly. Suitable solvents may be water, fluorosolvents, silicon solvents, or polar solvents like methanol, ethanol or other similar alcohols. When a water-soluble, acid cross-linkable protective layer is applied on to the first PR mask and baked, the water is driven out and the residual amount of acid comes out from the first PR mask to its surface. Since the coating material is acid cross-linkable, a cross-linked polymer coat is formed on the surface of the first PR mask. Then, the coating material that is not cross-linked can be washed away, leaving the first PR pattern with the cross-linked polymer coat. This process may be referred to as “chemical freeze” of the first PR mask pattern as it “freezes” the shape of the first PR mask.
However, although it is water soluble polymer, the cross-linked protective layer coat still has affinity with the organic solvent. Thus, when the second PR material is liquid-applied on top of the coated first PR mask, the organic solvent of the liquid PR material causes the cross-linked area to form a “gel” and the first PR pattern swells and/or deforms, which in turn causes line-edge roughness (LER), line distortion and/or line lifting and defects. In addition, in order to preserve the original critical dimension (CD), it is preferable that the cross-linked coat on the first PR pattern is as thin as possible, but this exacerbates the deformation problems
To achieve the foregoing and in accordance with the purpose of the present invention a method for etching an etch layer formed on a substrate is provided. A first photoresist (PR) mask with it's first masked features is provided on the etch layer. A protective coating is provided on the first PR mask by a process including at least one cycle. Each cycle includes (a) a deposition phase for depositing a deposition layer over the surface of the first mask features using a deposition gas, and (b) a profile shaping phase for shaping the profile of the deposition layer using a profile shaping gas. A liquid PR material is applied over the first PR mask having the protective coating. The PR material is patterned into a second mask features, where the first and second mask features form a second PR mask. The etch layer is etched though the second PR mask
In another embodiment of the invention an apparatus for providing a protective coating layer on a patterned photoresist (PR) mask with first mask features formed on an etch layer disposed on a substrate is provided. The apparatus includes a plasma processing chamber, comprising a chamber wall forming a plasma processing chamber enclosure, a substrate support for supporting a substrate within the plasma processing chamber enclosure, a pressure regulator for regulating the pressure in the plasma processing chamber enclosure, at least one electrode for providing power to the plasma processing chamber enclosure for sustaining a plasma, at least one RF power source electrically connected to the at least one electrode, a gas inlet for providing gas into the plasma processing chamber enclosure, and a gas outlet for exhausting gas from the plasma processing chamber enclosure. The apparatus further includes a gas source in fluid connection with the gas inlet, the gas source comprising a deposition gas source and a profile shaping gas source. A controller is controllably connected to the gas source and the at least one RF power source. The controller includes at least one processor and computer readable media. The computer readable media comprises computer readable code for providing a protective coating on a patterned PR mask comprising at least one cycle, the patterned mask having first mask features, wherein computer readable code for each cycle comprises computer readable code for flowing a deposition gas into the plasma chamber, computer readable code for forming a plasma from the deposition gas so as to deposit a deposition layer over the surface of the first mask features, computer readable code for stopping the flow of the deposition gas, computer readable code for flowing a profile shaping gas into the plasma chamber, computer readable code for forming a plasma from the profile shaping gas so as to shape the profile of the deposition layer; and computer readable code for stopping the flow of the deposition gas.
These and other features of the present invention will be described in more detail below in the detailed description of the invention and in conjunction with the following figures.
The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
The present invention will now be described in detail with reference to a few preferred embodiments thereof as illustrated in the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process steps and/or structures have not been described in detail in order to not unnecessarily obscure the present invention.
The invention provides a novel “freeze” process for a PR mask which may be used, for example, in double-patterning process. To facilitate understanding,
The first PR mask 208 may be patterned using a photolithography process, for example, the 193 nm water immersion lithography. However, the preset invention is also applicable to other lithography processes. Forming the first PR mask 208 may include liquid application of a PR material onto the wafer (by spin coating, for example), exposure to the light (scanning) using a first reticle, bake, and development. The water-soluble PR material may be washed away after the development. The first PR mask features 210 may have a typical critical dimension (CD), which may be the width of the space 212 between adjacent mask feature pattern 210, about 55 nm to 100 nm, using conventional photolithography processes.
A protective coating is then formed on the first PR mask 208 (step 104).
In the profile shaping phase 304, the deposition layer 215 is shaped or etched back using a profile shaping gas, such that at least the deposition layer 215 on the bottom of the mask features 210 is removed. The profile shaping phase 304 includes providing an profile shaping gas and generating an profile shaping plasma from the profile shaping gas to shape the profile of the deposition layer. The profile shaping gas is different from the deposition gas. As illustrated in
Within plasma processing chamber 400, the substrate 202 is positioned upon the lower electrode 408. The lower electrode 408 incorporates a suitable substrate chucking mechanism (e.g., electrostatic, mechanical clamping, or the like) for holding the substrate 202. The reactor top 428 incorporates the upper electrode 404 disposed immediately opposite the lower electrode 408. The upper electrode 404, lower electrode 408, and confinement rings 402 define the confined plasma volume 440. Gas is supplied to the confined plasma volume 440 by the gas source 410 and is exhausted from the confined plasma volume 440 through the confinement rings 402 and an exhaust port by the exhaust pump 420. A first RF source 444 is electrically connected to the upper electrode 404. A second RF source 448 is electrically connected to the lower electrode 408. Chamber walls 452 surround the confinement rings 402, the upper electrode 404, and the lower electrode 408. Both the first RF source 444 and the second RF source 448 may comprise a 60 MHz power source, a 27 MHz power source and a 2 MHz power source. Different combinations of connecting RF power to the electrode are possible. In the case of Lam Research Corporation's Dielectric Etch Systems such as Exelan® Series, made by LAM Research CorporationTM of Fremont, California, which may be used in a preferred embodiment of the invention, the 60 MHz, 27 MHz, and 2 MHz power sources make up the second RF power source 448 connected to the lower electrode, and the upper electrode is grounded.
A controller 435 is controllably connected to the RF sources 444, 448, exhaust pump 420, and the gas source 410. The Dielectric Etch System would be used when the etch layer 204 is a dielectric layer, such as silicon oxide, organo silicate glass, or TEOS. The Dielectric Etch System may also used for etching or opening hardmask. The controller 435 controls the RF sources 444, 448, exhaust pump 420, the deposition gas source 412, and the profile shaping gas source 416, and alternately performs the deposition and the profile shaping as two phases of a cycle. Using the two-phase cycle, which may be repeated more than once, the protective coating is formed so as to cover the surface of the first PR mask features without covering the bottom of the mask features.
CPU 522 is also coupled to a variety of input/output devices, such as display 504, keyboard 510, mouse 512 and speakers 530. In general, an input/output device may be any of: video displays, track balls, mice, keyboards, microphones, touch-sensitive displays, transducer card readers, magnetic or paper tape readers, tablets, styluses, voice or handwriting recognizers, biometrics readers, or other computers. CPU 522 optionally may be coupled to another computer or telecommunications network using network interface 540. With such a network interface, it is contemplated that the CPU might receive information from the network, or might output information to the network in the course of performing the above-described method steps. Furthermore, method embodiments of the present invention may execute solely upon CPU 522 or may execute over a network such as the Internet in conjunction with a remote CPU that shares a portion of the processing.
In addition, embodiments of the present invention further relate to computer storage products with a computer-readable medium that have computer code thereon for performing various computer-implemented operations. The media and computer code may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well known and available to those having skill in the computer software arts. Examples of computer-readable media include, but are not limited to: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROMs and holographic devices; magneto-optical media such as floptical disks; and hardware devices that are specially configured to store and execute program code, such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs) and ROM and RAM devices. Examples of computer code include machine code, such as produced by a compiler, and files containing higher level code that are executed by a computer using an interpreter. Computer readable media may also be computer code transmitted by a computer data signal embodied in a carrier wave and representing a sequence of instructions that are executable by a processor.
One example of the deposition gas would be a fluorocarbon chemistry and a hydrogen containing gas, such as a recipe of CF4 and H2. In this example, power is supplied at 400 watts at 2 MHz and 800 watts at 27 MHz. In each deposition phase, the deposition gas with the first chemistry is provided in the chamber, a plasma is formed from the deposition gas, and the deposition gas is stopped after the deposition.
One example of the profile shaping gas has a fluorocarbon chemistry, such as CF4, CHF3, and CH2F2. Other gases such as O2, N2, and H2 may be used. In this example, power is supplied at 0 watts at 2 MHz and 800 watts at 27 MHz. In each profile shaping phase, the profile shaping gas with the second chemistry is provided in the chamber, a plasma is formed from the profile shaping gas, and the profile shaping gas is stopped after the profile shaping.
The deposition phase 302 and the profile shaping phase 304 may be continuously performed in the same chamber without extinguishing the plasma, and the cycle may be repeated more than one, preferably 2-3 times. By controlling various parameters, such as the process times of the deposition phase 302 and the profile shaping phase 304, number of cycles, total deposition time, deposition/profile-shaping time ratio, gas chemistry ratio in each chemistry, the protective coating 214 can be formed in a desirable shape with a desirable thickness.
Referring back to
Then, the second-applied PR material is patterned into second mask features 216 (step 108). Patterning of the PR material into the second mask features may be performed in a similar manner as the patterning of the first PR mask, for example, conventional photolithography process, using a second reticle corresponding to the second mask features.
The substrate 202 is placed in the chamber, and the etch layer 204 is etched though the second PR mask (step 110).
Additional formation steps (112) may then be performed. For example, the PR mask 220 may be stripped, and/or the subsequent etch step may be performed to pattern features in the underlying layer.
While this invention has been described in terms of several preferred embodiments, there are alterations, permutations, and various substitute equivalents, which fall within the scope of this invention. It should also be noted that there are many alternative ways of implementing the methods and apparatuses of the present invention. It is therefore intended that the following appended claims be interpreted as including all such alterations, permutations, and various substitute equivalents as fall within the true spirit and scope of the present invention.
This application is a Division of U.S. application Ser. No. 12/338,947, filed on Dec. 18, 2008 and claims the benefit of priority of U.S. Provisional Application No. 61/016,404, filed on Dec. 21, 2007, which is incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 61016404 | Dec 2007 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12338947 | Dec 2008 | US |
| Child | 13609192 | US |
