Claims
- 1. A photosensitive resin composition comprising
a compound (A) having two or more polymerizable unsaturated bonds within one molecule, a photopolymerization initiator (B), water (C) and a thixotropic agent (D).
- 2. The photosensitive resin composition according to claim 1, wherein a part or the whole of the compound (A) is a compound (A′) having one or more carboxylic group within one molecule and having two or more polymerizable unsaturated bonds within one molecule.
- 3. The photosensitive resin composition according to claim 2, wherein the acid value of the compound (A′) is from 5 to 200 mgKOH/g.
- 4. The photosensitive resin composition according to claim 1, which contains, as the compound (A), a compound (A″) not having a carboxylic group and having two or more polymerizable unsaturated bonds within one molecule and a compound (A′) having one or more carboxylic group within one molecule and having two or more polymerizable unsaturated bonds within one molecule.
- 5. The photosensitive resin composition according to claim 4, wherein the ratio of the compound (A″) to the compound (A′) is from 1:20 to 1:1.
- 6. The photosensitive resin composition according to claim 1, wherein the content of the compound (A) is from 5 to 50 mass % of the photosensitive resin composition.
- 7. The photosensitive resin composition according to claim 1, which contains a stabilizing agent (E).
- 8. The photosensitive resin composition according to claim 7, wherein the stabilizing agent (E) is a water-soluble polymer.
- 9. The photosensitive resin composition according to claim 8, wherein the water-soluble polymer is selected from the group consisting of polyvinyl alcohols, modified polyvinyl alcohols, and hydroxyethyl celluloses.
- 10. The photosensitive resin composition according to claim 1, which contains an amine (F).
- 11. The photosensitive resin composition according to claim 10, wherein the amine (F) is a tertiary amine and has a cyclic structure.
- 12. The photosensitive resin composition according to claim 10, wherein the amine (F) is a morpholine-type amine.
- 13. The photosensitive resin composition according to claim 1, wherein the content of the water (C) is from 20 to 80 mass % of the photosensitive resin composition.
- 14. The photosensitive resin composition according to claim 1, wherein the thixotropic agent (D) is a silicate mineral.
- 15. The photosensitive resin composition according to claim 14, wherein the thixotropic agent (D) is an amine-modified silicate mineral.
- 16. The photosensitive resin composition according to claim 1, wherein the content of the thixotropic agent (D) is from 0.1 to 5 mass % of the photosensitive resin composition.
- 17. The photosensitive resin composition according to claim 1, which contains a solvent (G) other than water, having at least one or more hydroxyl group and wherein the content of the solvent (G) is from 5 to 40 mass % of the photosensitive resin composition.
- 18. The photosensitive resin composition according to claim 1, wherein the viscosity is from 30 to 180 mPa·s at 25° C.
- 19. The photosensitive resin composition according to claim 1, wherein the surface tension is 35 mN/m or less at 25° C.
- 20. The photosensitive resin composition according to claim 1, which contains a surfactant (H).
- 21. The photosensitive resin composition according to claim 1, wherein a flammable liquid content is 40 mass % or less of the photosensitive resin composition, a flash point of the composition is 60.5° C. or more and the burning point is 80° C. or more.
- 22. A process for producing a photosensitive resin film, comprising the steps of:
dipping an insulating substrate having thereon an electrically conductive metal layer in the photosensitive resin composition as recited in claim 1pulling up the substrate from the photosensitive resin composition, and drying the photosensitive resin composition on the substrate.
- 23. The process for producing a photosensitive resin film according to claim 22, wherein the lifting speed at the step of pulling up the substrate from the photosensitive resin composition is reduced on the way of pulling up the substrate.
- 24. The process for producing a photosensitive resin film according to claim 22, wherein at the step of pulling up the substrate from the photosensitive resin composition, the initial lifting speed is from 1 to 20 mm/second and thereafter, the lifting speed is reduced to 0.1 to 5 mm/second.
- 25. The process for producing a photosensitive resin film according to claim 22, wherein the photosensitive composition is set at a temperature of 20 to 50° C.
- 26. The process for producing a photosensitive resin film according to claim 22, wherein the photosensitive composition is overflowed from a container and the overflowed photosensitive composition is circulated again to the container.
- 27. A process for producing a printed wiring board, comprising
producing a photosensitive resin film by the process as recited in claim 22, subjecting the film to exposure of a desired pattern and development with water or an alkaline solution, etching the electrically conductive metal layer except for the pattern with an etching solution, and peeling off the pattern.
- 28. A printed wiring board produced by the process according to claim 27.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-369065 |
Dec 2001 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit pursuant to 35 U.S.C. §119(e)(1) of U.S. Provisional Application, No. 60/337,148 filed Dec. 10, 2001.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP02/12656 |
12/3/2002 |
WO |
|
Provisional Applications (1)
|
Number |
Date |
Country |
|
60337148 |
Dec 2001 |
US |