Claims
- 1. A polishing apparatus comprising:a rotatable sample holder for holding a substrate; a rotatable polishing table; a polishing cloth covering said polishing table; a supply unit supplying a polishing reagent between said polishing cloth and the substrate which is held on said sample holder; and an elastic member arranged between said polishing table and said polishing cloth, said elastic member being provided with elasticity by a fluid encapsulated therein, wherein said polishing cloth includes a central portion and a peripheral portion, said polishing cloth being fixed to said polishing table only at said central portion and said peripheral portion of said polishing cloth.
- 2. A polishing apparatus comprising:a rotatable sample holder for holding a substrate; a rotatable polishing table; a polishing cloth covering said polishing table; a supply unit supplying a polishing reagent between said polishing cloth and the substrate which is held on said sample holder; and an elastic member arranged between said polishing table and said polishing cloth, said elastic member being provided with elasticity by a fluid encapsulated therein, wherein said polishing cloth includes a peripheral portion, said peripheral portion of said polishing cloth being secured between a pair of fixing rings, said fixing rings being secured to said polishing table to fix said polishing cloth to said polishing table.
- 3. The polishing apparatus according to claim 2, wherein said fixing rings are secured to said polishing table by bolts.
- 4. The polishing apparatus according to claim 2, wherein said polishing cloth includes a central portion, said central portion of said polishing cloth being fixed to said polishing table by way of a fixing plate so that the polishing cloth is positioned between said polishing table and said fixing plate.
- 5. The polishing apparatus according to claim 4, wherein said fixing plate is secured to said polishing cloth by way of a bolt.
- 6. A polishing apparatus comprising:a rotatable sample holder for holding a substrate; a rotatable polishing table; a polishing cloth covering said polishing table; a supply unit supplying a polishing reagent between said polishing cloth and the substrate which is held on said sample holder; and an elastic member arranged between said polishing table and said polishing cloth, said elastic member being provided with elasticity by a fluid encapsulated therein, wherein said polishing cloth includes a central portion, said central portion of said polishing cloth being fixed to said polishing table by way of a fixing plate so that the polishing cloth is positioned between said polishing table and said fixing plate.
- 7. The polishing apparatus according to claim 6, wherein said fixing plate is secured to said polishing cloth by way of a bolt.
- 8. A polishing apparatus, comprising:a rotatable sample holder for holding a substrate; a rotatable polishing table; a polishing cloth covering said polishing table; a supply unit supplying a polishing reagent between said polishing cloth and the substrate which is held on said sample holder; an elastic member arranged between said polishing table and said polishing cloth, said elastic member being provided with elasticity by a fluid encapsulated therein; and a control unit controlling a pressure of the fluid encapsulated in said elastic member.
- 9. The polishing apparatus according to claim 8, wherein said elastic member comprises an encapsulating bag which is inserted between the polishing table and the polishing cloth and having an interior into which the encapsulated fluid is supplied.
- 10. A polishing apparatus comprising:a rotatable sample holder for holding a substrate; a rotatable polishing table; a polishing cloth covering said polishing table; a supply unit supplying a polishing reagent between said polishing cloth and the substrate which is held on said sample holder; and an elastic member arranged between said polishing table and said polishing cloth, said elastic member being provided with elasticity by a fluid encapsulated therein, wherein said elastic member is positioned in a groove formed in the polishing table.
- 11. The polishing apparatus according to claim 8, including resin pellets embedded in said polishing cloth.
- 12. The polishing apparatus according to claim 8, including resin pellets attached to said polishing cloth.
- 13. The polishing apparatus according to claim 8, wherein the polishing cloth is fixed to the polishing table in a tensioned state without being adhered to said elastic member.
- 14. The polishing apparatus according to claim 8, wherein only a portion of the polishing cloth is fixed to said polishing table.
Priority Claims (2)
Number |
Date |
Country |
Kind |
4-59292 |
Feb 1992 |
JP |
|
5-23035 |
Feb 1993 |
JP |
|
Parent Case Info
This application is a continuation-in-part application of application Ser. No. 08/626,351 filed on Apr. 2, 1996 , now abandoned which is a continuation of application Ser. No. 08/133,068 filed on Jan. 10, 1994, now abandoned.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
08/133068 |
Jan 1994 |
US |
Child |
08/626351 |
|
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08/626351 |
Apr 1996 |
US |
Child |
08/993578 |
|
US |