This is a divisional of application Ser. No. 08/080,453 filed on Jun. 21, 1993, now abandoned.
Number | Name | Date | Kind |
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4525921 | Carson et al. | Jul 1985 | |
4672737 | Carson et al. | Jun 1987 | |
5075253 | Sliwa, Jr. | Dec 1991 | |
5104820 | Go et al. | Apr 1992 | |
5107586 | Eicherlberger et al. | Apr 1992 | |
5279029 | Burns | Jan 1994 | |
5380681 | Hsu | Jan 1995 |
Entry |
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WO-A-93 00703 (Irvine) Claims 1,8. |
The GEC Journal of Research, vol. 7, No. 1, 1989, GB, pp. 16-27, A. D. Trigg `design and fabrication of silicon hybrid multi-chip modules`FIG. 10. |
Microelectronic Engineering, vol. 15, No. 1/4, Oct. 1991, NL, pp. 167-174, Moriya et al. `results of the three-dimensional integrated circuits project in Japan`, FIGS. 1, 2. |
Number | Date | Country | |
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Parent | 80453 | Jun 1993 |