Geometry of the stack

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H01L2225/06555

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/06555Geometry of the stack

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,984,425
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ji-seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 11,929,348
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 11,869,875
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,862,605
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
- Patent number 11,823,991
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,817,422
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,810,868
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,804,475
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,791,311
- Issue date Oct 17, 2023
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatuses for aligning read data in a stacked semicon...
- Patent number 11,763,855
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Seiji Narui
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and manufacturing process thereof
- Patent number 11,742,276
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Huan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stacks and associated systems and methods
- Patent number 11,735,568
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290754
- Publication date Aug 29, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Yu-Duk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234374
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240203906
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Coupled Substrates
- Publication number 20240203851
- Publication date Jun 20, 2024
- Western Digital Technologies, Inc.
- Guru Prasada Rao Amberkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240194648
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Dawoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY MOUNTED DIE GROUPS
- Publication number 20240194644
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186277
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS
- Publication number 20240162190
- Publication date May 16, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136328
- Publication date Apr 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136329
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20240104037
- Publication date Mar 28, 2024
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D LAYOUT AND ORGANIZATION FOR ENHANCEMENT OF MODERN MEMORY SYSTEMS
- Publication number 20240088099
- Publication date Mar 14, 2024
- ADVANCED MICRO DEVICES, INC.
- Divya Madapusi Srinivas PRASAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DE...
- Publication number 20240055421
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Jun Yun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY MOUNTED DIE GROUPS
- Publication number 20240014172
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Geometry of the stack

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Singulation and bonding methods and structures formed thereby

Semiconductor device assemblies with molded support substrates

Encircling a semiconductor device with stacked frames on a substrate

Through-substrate via structure and method of manufacture

Semiconductor package and a method for manufacturing the same

Adhesive member and display device including the same

Multilayer body and method of manufacturing the same

Package structure and method of forming the same

Semiconductor package

Package structure

Semiconductor device and method of manufacturing semiconductor device

Vertically mounted die groups

Semiconductor package

Semiconductor package having a high reliability

Electronic device having a substrate-to-substrate interconnection s...

Systems and methods for releveled bump planes for chiplets

Thermal transfer structures for semiconductor die assemblies

Integrated circuit package and method of forming same

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor die connection system and method

Stacked semiconductor die assemblies with die support members and a...

Frames stacked on substrate encircling devices and manufacturing me...

Semiconductor device

Semiconductor package

Package structure and manufacturing method thereof

Semiconductor package for thermal dissipation

Electronic device

Methods and apparatuses for aligning read data in a stacked semicon...

Semiconductor package and manufacturing process thereof

Semiconductor die stacks and associated systems and methods

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device Package with Coupled Substrates

STACKED SEMICONDUCTOR PACKAGE

VERTICALLY MOUNTED DIE GROUPS

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

3D LAYOUT AND ORGANIZATION FOR ENHANCEMENT OF MODERN MEMORY SYSTEMS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES WITHOUT THICKNESS DE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

VERTICALLY MOUNTED DIE GROUPS