Claims
- 1. A polymeric compound for photoresist, comprising a monomer unit represented by following Formula (I): and having a weight average molecular weight (Mw) of from about 5000 to about 50000.
- 2. The polymeric compound for photoresist according to claim 1, having a molecular weight distribution (Mw/Mn) of from about 1.8 to about 3.5.
- 3. The polymeric compound for photoresist according to claim 1, comprising the monomer unit represented by Formula (I) and at least one selected from monomer units represented by following Formulae (IIa) to (IIg): wherein R1 is a hydrogen atom or a methyl group; R2 and R3 are the same or different and are each a hydrocarbon group having from 1 to 8 carbon atoms; R4, R5 and R6 are the same or different and are each a hydrogen atom, a hydroxyl group or a methyl group; R7 and R8 are the same or different and are each a hydrogen atom, a hydroxyl group or a —COOR9 group, where R9 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group; R10 and R11 are the same or different and are each a hydrogen atom, a hydroxyl group or an oxo group; R12 is a hydrocarbon group having a tertiary carbon atom at a bonding site with an oxygen atom indicated in the formula; R13, R14 and R15 are the same or different and are each hydrogen atom or a methyl group; R16 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group; and n denotes an integer from 1 to 3.
- 4. The polymeric compound for photoresist according to claim 1, 2 or 3, further comprising at least one selected from monomer units represented by following Formulae (IIIa) to (IIIg) wherein R1 is a hydrogen atom or a methyl group; R17 and R18 are the same or different and are each a hydrogen atom, a hydroxyl group or a carboxyl group; R19 is a hydroxyl group, an oxo group or a carboxyl group; R20, R21, R22 R23 and R24 are the same or different and are each a hydrogen atom or a methyl group; R25 is a hydrogen atom or a methyl group; R26 is a tricyclo[5.2.1.026]decylmethyl group, a tetracyclo[4.4.0.12,5.17,10]dodecylmethyl group, a norbornyl group, an isobornyl group or a 2-norbornylmethyl group; and R27 is a substituent of R26 and is a hydrogen atom, a hydroxyl group, a hydroxymethyl group, a carboxyl group or a —COOR28 group, where R28 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group.
- 5. A resin composition for photoresist, comprising the polymeric compound for photoresist as claimed in any one of claims 1 to 3 and a light-activatable acid generator.
- 6. A method of manufacturing a semiconductor, the method comprising the steps of applying the resin composition for photoresist as claimed in claim 4 onto a base or substrate to thereby form a resist film; and subjecting the resist film to exposure and development to thereby produce a pattern.
- 7. A polymeric compound for photoresist, comprising a monomer unit represented by following Formula (I): and having a weight average molecular weight (Mw) of from about 5000 to about 50000; wherein the polymeric compound further comprises at least one monomer unit selected from Formulae (IIa) to (IIg): wherein R1 is a hydrogen atom or a methyl group; R2 and R3 are the same or different and are each a hydrocarbon group having from 1 to 8 carbon atoms; R4, R5 and R6 are the same or different and are each a hydrogen atom, a hydroxyl group or a methyl group; R7 and R8 are the same or different and are each a hydrogen atom, a hydroxyl group or a —COOR9 group, where R9 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group; R10 and R11 are the same or different and are each a hydrogen atom, a hydroxyl group or an oxo group; R12 is a hydrocarbon group having a tertiary carbon atom at a bonding site with an oxygen atom indicated in the formula; R13, R14 and R15 are the same or different and are each hydrogen atom or a methyl group; R16 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group; and n denotes an integer from 1 to 3;with the proviso that when the polymeric compound contains a monomer unit of Formulae (IIg), the polymeric compound further comprises at least one of Formulae (IIa), (IIb), (IIc), (IId), (IIe), (IIf), (IIIa), (IIIb), (IIIc), (IIId), (IIIe), (IIIf) and (IIIg) wherein Formulae (IIIa) to (IIIg) have the following formulae: wherein R1 is a hydrogen atom or a methyl group; R17 and R18 are the same or different and are each a hydrogen atom, a hydroxyl group or a carboxyl group; R19 is a hydroxyl group, an oxo group or a carboxyl group; R20, R21, R22, R23 and R24 are the same or different and are each a hydrogen atom or a methyl group; R25 is a hydrogen atom or a methyl group; R26 is a tricyclo[5.2.1.02,6]decylmethyl group, a tetracyclo[4.4.0.12,5.17,10]dodecylmethyl group, a norbornyl group, an isobornyl group or a 2-norbornylmethyl group; and R27 is a substituent of R26 and is a hydrogen atom, a hydroxyl group, a hydroxymethyl group, a carboxyl group or a —COOR28 group, where R28 is a t-butyl group, a 2-tetrahydrofuranyl group, a 2-tetrahydropyranyl group or an 2-oxepanyl group.
- 8. The polymeric compound for photoresist according to claim 7, having a molecular weight distribution (Mw/Mn) of from about 1.8 to about 3.5.
- 9. A method of manufacturing a semiconductor, the method comprising the steps of applying the resin composition for photoresist as claimed in claim 7 onto a base or substrate to thereby form a resist film; and subjecting the resist film to exposure and development to thereby produce a pattern.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-024527 |
Feb 2000 |
JP |
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Parent Case Info
This application is a continuation of application Ser. No. 09/937,910, filed on Oct. 19, 2001 now U.S. Pat. No. 6,552,143 and for which priority is claimed under 35 U.S.C. § 120. Application Ser. No. 09/937,910 is the national phase of PCT International Application No. PCT/JP01/00515 filed on Jan. 26, 2001 under 35 U.S.C. § 371. This application also claims priority of application Ser. No. 24527/2000 filed in Japan on Feb. 1, 2000 under 35 U.S.C. § 119. The entire contents of each of the above-identified applications are hereby incorporated by reference.
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Continuations (1)
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Parent |
09/937910 |
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US |
Child |
10/375129 |
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US |