Claims
- 1. A positive-working photoresist composition which comprises, in the form of a uniform solution:
- (a) a compound capable of generating an acid by the irradiation with actinic rays;
- (b) a resinous compound capable of being imparted with increased solubility in an aqueous alkaline solution in the presence of an acid, which is a combination of a first poly(hydroxystyrene) resin substituted for from 10% to 60% of the hydroxy groups by tert-butoxycarbonyloxy groups and a second poly(hydroxystyrene) resin substituted for from 10% to 60% of the hydroxy groups by the groups represented by the general formula
- --O--CR.sup.1 R.sup.2 (OR.sup.3),
- in which R.sup.1 is a hydrogen atom or a methyl group, R.sup.2 is a methyl group or ethyl group, and R.sup.3 is a lower alkyl group having 1 to 4 carbon atoms, in a weight proportion in the range from 10:90 to 70:30;
- (c) an organic solvent selected from the group consisting of ketone compounds, ether compounds and ester compounds; and
- (d) an N,N-dialkyl carboxylic acid amide, of which the carboxylic acid has 1 to 4 carbon atoms in a molecule and each of the N-substituting alkyl groups has 1 to 4 carbon atoms, in an amount in the range from 0.1 to 5% by weight based on the amount of the component (b).
- 2. The positive-working photoresist composition as claimed in claim 1 in which the N,N-dialkyl carboxylic acid amide as the component (d) is N,N-dimethyl formamide or N,N-dimethyl acetamide.
- 3. The positive-working photoresist composition as claimed in claim 1 in which the component (a) is selected from the group consisting of bis(sulfonyl) diazomethane compounds, sulfonylcarbonyl alkane compounds, sulfonylcarbonyl diazomethane compounds, nitrobenzyl sulfonate compounds, esters of a polyhydroxy compound and an aliphatic or aromatic sulfonic acid and onium salts.
- 4. The positive-working photoresist composition as claimed in claim 3 in which the component (a) is bis(cyclohexylsulfonyl) diazomethane or bis(2,4-dimethylphenylsulfonyl) diazomethane.
- 5. The positive-working photoresist composition as claimed in claim 1 in which the poly(hydroxystyrene) resin has a weight-average molecular weight in the range from 3000 to 30000.
- 6. The positive-working photoresist composition as claimed in claim 1 in which the amount of the component (a) is in the range from 1 to 20 parts by weight per 100 parts by weight of the component (b).
- 7. The positive-working photoresist composition as claimed in claim 1 in which the amount of the component (d) is in the range from 0.5 to 3% by weight based on the amount of the component (b).
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-149285 |
Jun 1995 |
JPX |
|
Parent Case Info
This is a divisional application of Ser. No. 08/654,522, filed May 29, 1996.
US Referenced Citations (7)
Number |
Name |
Date |
Kind |
4248957 |
Sander et al. |
Feb 1981 |
|
4678737 |
Schneller et al. |
Jul 1987 |
|
4889789 |
Stahlhofen et al. |
Dec 1989 |
|
5081000 |
Kuehn et al. |
Jan 1992 |
|
5212046 |
Lamola et al. |
May 1993 |
|
5338641 |
Pawlowski et al. |
Aug 1994 |
|
5340682 |
Pawlowski et al. |
Aug 1994 |
|
Foreign Referenced Citations (7)
Number |
Date |
Country |
0 537 524 |
Apr 1993 |
EPX |
0 611 998 |
Aug 1994 |
EPX |
0 628 876 |
Dec 1994 |
EPX |
0 660 187 |
Jun 1995 |
EPX |
6-266110 |
Sep 1994 |
JPX |
7-92681 |
Apr 1995 |
JPX |
WO9401805 |
Jan 1994 |
WOX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
654522 |
May 1996 |
|