1. Field of the Invention
This invention relates generally to power and energy (PE) meters, and more particularly to PE meters designed to measure electromagnetic radiation.
2. Description of the Related Art
A power and energy (PE) meter is a device designed to measure power and/or energy being conveyed, either through free space or via some sort of conductor. For example, a PE meter could be designed to measure directed electromagnetic (EM) radiation traveling through air or free space. These types of PE meters are usually comprised of a single or multi-component sensor, a heat sink, and electrical and/or thermal connections between the sensor and a display instrument.
Sensors used to measure directed EM radiation include, but are not limited to: thermopiles, bolometers, photoconductors, photodiodes, pyroelectrics and calorimeters. Some sensors operate by absorbing part or all of the EM radiation entering a sensor, such that the sensor temperature increases in a manner proportional to the amount of radiation absorbed. Sensors which use temperature change to indicate the amount of EM radiation absorbed must be calibrated when housed in the heat sink, since the power associated with a given change in temperature is dependent on the sensor/heat sink combination—commonly referred to as a “sensor head”—and on the cooling of the sensor head.
Heat sinks are usually metal, and conduct heat away from the sensors with which they are in contact via conduction, convection, and by thermal radiation. The rate at which heat is transferred away from a sensor by the heat sink depends upon the thermal resistance between the sensor and heat sink surface, and on how fast heat can be removed from the heat sink. Heat sinks are cooled by natural convection, forced air (through or over the heat sink surface), or by liquid cooling (through or over the heat sink surface). A heat sink also provides support for electrical or thermal I/O.
Front and side views of a conventional PE meter sensor head are shown in
Another problem is that, except for very low amounts of EM radiation, the absorbing part of the sensor must be bonded, brazed or soldered to the heat sink with thermally conductive materials to maximize heat transfer away from the absorbing part of the sensor, to prevent the sensor from overheating or becoming saturated. In addition, the maximum EM radiation that may be measured by the sensor head is limited by the requirement that all of the radiation entering the sensor be absorbed by the sensor head.
A PE meter designed to measure electromagnetic radiation is presented which addresses each of the problems noted above.
The present PE meter includes a sensor head comprising a sensor which absorbs EM radiation that impinges on it, and a heat sink with which the sensor is in thermal contact. The heat sink includes a through-hole located behind the sensor which allows at least some of the EM radiation which is not absorbed by the sensor to pass through the heat sink without being absorbed. The EM radiation may be, for example, directed EM radiation such as that produced by a laser, or EM radiation such as that produced by one or more light-emitting diodes (LEDs).
The present PE meter preferably also includes a means of applying mechanical pressure—such as a spring mechanism—which holds the sensor in thermal contact with the heat sink, thereby avoiding the need to bond, braze or solder the sensor to the heat sink.
A “capture head” is preferably mounted behind and physically separate from the sensor head, and is arranged to absorb at least some of the EM radiation which is not absorbed by the sensor and which passes through the heat sink without being absorbed. A “shroud” might also be positioned between the capture head and sensor head, either attached to the perimeter of the capture head or self-standing.
These and other features, aspects, and advantages of the present invention will become better understood with reference to the following drawings, description, and claims.
a and 1b are front and side views, respectively, of a conventional PE meter sensor head.
a and 2b are front and side views, respectively, of one possible embodiment of a PE meter sensor head in accordance with the present invention.
a and 3b are front and side views, respectively, of another possible embodiment of a PE meter sensor head in accordance with the present invention.
Front and side views showing one aspect of a PE meter sensor head in accordance with the present invention are shown in
The outer periphery of sensor 20 contacts the inner periphery of the through-hole. Providing a through-hole 26 behind the sensor in this manner enables the use of thinner sensors which do not absorb all of the EM radiation that enters them, because the heat sink 22 does not absorb—and is therefore not heated by—the exiting flux (28). Note that, though sensor 20 and heat sink 22 are shown as round in the figures, each can have any shape that can be fabricated—as long as there is a hole in the heat sink behind the sensor such that at least some of the EM radiation 24 which is not absorbed by the sensor passes through heat sink 22 without being absorbed.
The present PE meter is designed to measure EM radiation, such as that generated by one or more LEDs, or directed EM radiation, such as that generated by a laser. For example, the PE meter could be arranged to measure the power or the energy profile/distribution present within a cross-sectional area of a directed EM radiation beam.
The PE meter is not limited to any specific type of sensor. One type of sensor suitable for measuring EM radiation comprises an absorber which is heated by EM radiation impinging on it, and a temperature measurement device arranged to produce an output which varies with the temperature of the absorber. The temperature measurement device might be, for example, a calorimeter, pyroelectric, thermopile, bolometer, thermistor, resistance temperature device (RTD) or thermocouple. The absorber is typically a solid material, which may or may not be coated with a thin or thick film that absorbs EM radiation. Examples of sensors that may be suitable for use with the present meter are described, for example, in U.S. Pat. Nos. 6,239,432, 6,576,972, 6,649,994, 6,713,762, and 7,176,461, all of which are assigned to the present assignee.
Another type of sensor suitable for measuring EM radiation is arranged to produce an electrical output signal which varies with the amount of EM radiation impinging on the sensor. Here, the sensor could comprise, for example, one or more photodiodes or photoconductors.
As depicted in the front and side views shown in
As discussed in more detail below, one or both surfaces of sensor 20 may be roughened, which acts to scatter reflected and transmitted radiation. Much of the reflected and transmitted radiation impinging on the sensor does not arrive from a perpendicular direction. This non-perpendicular radiation can be absorbed by the heat sink component of the sensor head, causing the sensor head to get hotter due to radiation absorbed by the heat sink directly. Using a chamfered heat sink hole (32) as shown in
The sensor head preferably employs mechanical pressure to hold the sensor(s) in thermal contact with the heat sink. This avoids the need to bond, braze or solder the sensor to the heat sink. Since the heat sink through-hole eliminates the need for the sensor to absorb all the incoming EM radiation, holding the sensor to the heat sink by mechanical pressure—while having a higher thermal resistance than would a bonded, brazed or soldered sensor—still provides enough thermal conductivity to allow higher EM radiation levels to be measured than can be measured by a sensor that must absorb all of the radiation entering it.
The means of applying mechanical pressure should be arranged to allow the sensor and heat sink to expand and contract, such that mechanical stresses created within the sensor over the sensor's operating temperature range do not cause the sensor to crack or break. One way in which this could be accomplished is with the use of one or more spring mechanisms which provide a spring-loaded coupling between the sensor and heat sink.
A front view of a sensor head illustrating one possible mounting arrangement is shown in
Two bars 48 extend along opposite edges of sensor 40 and between respective pairs of mounting posts 50, 52, and apply mechanical pressure which holds the sensor against the heat sink. The bars may be conductive or non-conductive, depending on the sensor type. For example, if the sensor has electrical contacts along its edges beneath bars 48, the bars can be conductive and used to connect the sensor contacts to the mounting posts. The sensor signals can then be carried away from the heat sink via electrical lead-wires 54 connected to the mounting posts with nuts 55. An exemplary device 56 that might be used to sense the temperature of heat sink 42, such as a thermocouple (TC) or resistance temperature detector (RTD), is also shown in
Other means of applying mechanical pressure include, but are not limited to:
A sectional view of a spring-loading mechanism as might be used with mounting posts 50, 52 and nuts 55 is shown in
The present PE meter can also include a capture head, which would typically be mounted behind and physically separate from the sensor head, and arranged to absorb at least some of the EM radiation which is not absorbed by the sensor and which passes through the heat sink without being absorbed. The capture head may include a shroud, arranged to absorb EM radiation that does not arrive from a perpendicular direction. A front view of a capture head 60 and shroud 62 is shown in
The capture head may be any metal, but thermally conductive metals such as aluminum or copper are preferred. The shroud, which can be attached to the perimeter of the capture head as shown in
Capture head 60 comprises an absorbing surface which absorbs at least some of said EM radiation which is not absorbed by the sensor and which passes through the heat sink without being absorbed. The absorbing surface is preferably roughened to provide more absorbing surface area, and to scatter incoming EM radiation in a more dispersive manner than would a flat surface; a roughness average of greater than or equal to 12 micro-inches is preferred. The capture head's absorbing surface is also preferably black to maximize EM radiation absorption. The black surface can be created by numerous techniques, such as anodizing, painting, or evaporation.
The shroud, if present, also includes an absorbing surface. As with the capture head, the absorbing surface of the shroud is preferably roughened, preferably with a roughness average of greater than or equal to 12 micro-inches, and is black.
As shown in
One or both surfaces of the EM radiation sensor may be roughened, to disperse EM radiation that is reflected and/or radiation that is not absorbed. For example, in the example shown in
The embodiments of the invention described herein are exemplary and numerous modifications, variations and rearrangements can be readily envisioned to achieve substantially equivalent results, all of which are intended to be embraced within the spirit and scope of the invention as defined in the appended claims.
This application claims the benefit of provisional patent application No. 61/092,295 to James D. Parsons and Andrew D. Devey, filed Aug. 27, 2008.
Number | Date | Country | |
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61092295 | Aug 2008 | US |