Patent Application
20130077267
This application claims priority from Korean Patent Application No. 10-2011-0095913, filed on Sep. 22, 2011, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
1. Field
Apparatuses and methods consistent with exemplary embodiments relate to a power board, a method of manufacturing the same, and a liquid crystal display apparatus having the same.
2. Description of the Related Art
In the related art, liquid crystal display (LCD) apparatuses are configured to implement an image by using a liquid crystal, and applied to various kinds of display apparatuses, such as televisions and computer monitors.
In recent years, the LCD apparatuses have become smaller and thinner. Thus, an area occupied by circuits built in the products is very small. Because tops of parts mounted on a top and bottom of a circuit board are nearly in contact with a cover such as a housing, circuits are likely to be damaged by pressing of the cover due to a force applied from the exterior of the display apparatus, or by vibration or shock during the movement of the product. In particular, such a problem becomes serious in a power circuit board which uses many large parts. In the related art, when an external force is applied to an unstable space in which the circuits are located, a supporting member having a higher height than the respective parts of the circuits primarily absorbs the force in order to maintain the space, thereby preventing the parts on a top and bottom of a power circuit board from being damaged.
However, in the related art, because the supporting member is inserted manually into the circuit board after the parts are mounted and soldered in the board, there is a problem that a separate process of mounting the supporting member is inevitably required.
One or more exemplary embodiments may overcome the above disadvantages and other disadvantages not described above. However, it is understood that one or more exemplary embodiment are not required to overcome the disadvantages described above, and may not overcome any of the problems described above.
One or more exemplary embodiment provides a power board including a supporting member mounted in a board by using a surface mount technology (SMT) and a soldering process.
According to an aspect of an exemplary embodiment, there is provided a power board. The power board may include: a board housing; a board included in an inside of the board housing; a plurality of parts mounted in the board; and a supporting member which is mounted in the board and which supports the board to prevent each of the plurality of parts from being damaged. The supporting member may include a supporting member mounted by using a surface mounted technology (SMT) process.
The supporting member mounted by using the SMT process may be soldered and fixed to the board.
The supporting member may include a lower supporting unit which supports a bottom of the board, and a soldering unit attached to a side of the lower supporting unit and which is soldered and fixed to the bottom of the board.
The supporting member may further include an upper supporting unit which is formed on the lower supporting unit and which supports a top of the board.
A height of the lower supporting unit may be greater than a height of each part mounted on the bottom of the board.
The board may include a through-hole which allows the upper supporting unit to be inserted therethrough. The lower supporting unit may have a width greater than a width of the through-hole.
A height of a portion of the upper supporting unit extending from the top of the board may be greater than a height of each part mounted on the top of the board.
The supporting member may further include a hook unit which prevents the upper supporting unit from slipping through the through-hole.
The soldering unit may be formed such that the soldering unit is mounted to penetrate the lower supporting unit, and both of a first end and a second end opposite the first end of the soldering unit may be bent to be in contact with the bottom of the board.
Alternatively, the soldering unit may be formed such that a first end of the soldering unit is inserted into the lower supporting unit and a second end opposite the first end of the soldering unit is in contact with the bottom of the board.
A plurality of soldering units may be mounted in the lower supporting unit such that each respective soldering unit is spaced apart from a next soldering unit by a predetermined distance.
The supporting member may include an insulator formed by using a thermosetting resin. The supporting member may include a material which is heat-resistant at a soldering temperature.
According to another aspect of an exemplary embodiment, there is provided a method of manufacturing a power board. The method may include: mounting an upper part on a top of a board; mounting a lower part and a supporting member which supports the board to prevent the upper and lower parts from being damaged in a bottom of the board by using a surface mount technology (SMT) process; and soldering the lower part and the supporting member on the bottom of the board.
According to still another aspect of an exemplary embodiment, there is provided a liquid crystal display apparatus including any one of power boards according to exemplary embodiments.
According to various exemplary embodiments, because a supporting member is mounted on a board by a soldering after applying a SMT process, a separate process of mounting the supporting member is not required and thus an effect of improving productivity of a power board can be obtained.
Additional aspects and advantages of the exemplary embodiments will be set forth in the detailed description, will be obvious from the detailed description, or may be learned by practicing the exemplary embodiments.
The above and/or other aspects will be more apparent by describing in detail exemplary embodiments, with reference to the accompanying drawings, in which:
Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings.
In the following description, same reference numerals are used for the same elements when they are depicted in different drawings. The matters defined in the description, such as detailed construction and elements, are provided to assist in a comprehensive understanding of the exemplary embodiments. Thus, it is apparent that the exemplary embodiments can be carried out without those specifically defined matters. Further, functions or elements known in the related art are not described in detail, because they would obscure the exemplary embodiments with unnecessary detail.
First, a power board according to an exemplary embodiment will now be described below.
Referring to
A plurality of insulating units 130 are mounted on an inner surface of the board housing 110 to prevent electricity generated in the board 120 in which the parts 150 are mounted from being conducted to the board housing 110.
The parts 150 include a top part 152 mounted on a top of the board 120 and at least one bottom part 154 mounted on a bottom of the board 120.
The supporting member 200 is mounted in the board 120 by using a surface mount technology (SMT) process, and then soldered and fixed to the board 120. The SMT process is a process by which parts are automatically mounted in a printed circuit board (PCB) using one or multiple equipment. In this process, the parts are mounted in the PCB and then joined to the PCB to electrically connect the parts by using a bonding or soldering. In particular, in the exemplary embodiment illustrated in
The supporting member 200 includes a lower supporting unit 220 configured to support the bottom of the board 120 and a soldering unit 240 attached to a side of the lower supporting unit 220 and soldered and fixed to a solder area 126 on the bottom of the board 120. The lower supporting unit 220 may include a thermosetting resin and the soldering unit 240 may include a solderable material.
The lower supporting unit 220 has a height which is greater than respective heights of the bottom parts 154, in order to prevent the bottom parts 154 mounted on the bottom of the board 120 from being damaged. Accordingly, the bottom parts 154 may be disposed to leave a space with respect to the board housing 110 or the insulting units 130. When a force is externally applied to a lower portion of the board housing 110, the lower supporting unit 220 primarily absorbs the force and prevents the force from being applied to the bottom parts 154.
The supporting member 200 may further include an upper supporting unit 260 configured to be formed on the lower supporting unit 220 and to support the board 120.
A through-hole 122 is formed in the board 120 to allow the upper supporting unit 260 to penetrate therethrough and to be inserted into the through-hole 122. The through-hole 122 has a width which is smaller than a corresponding width of the lower supporting unit 220, thereby preventing the lower supporting member 220 from slipping through the through-hole 122. In addition, the through-hole 122 has a width which allows the upper supporting unit 260 to be inserted therein.
The upper supporting unit 260 has a height which is greater than a height of the top part 152, which is mounted on the top of the board 120, in order to prevent the top part 152 from being damaged, similarly as described above with respect to the lower supporting unit 220. Accordingly, similarly as with the lower part 154, the top part 152 may be disposed to leave a space with respect to the board housing 110 or the insulating unit 130. When a force is externally applied to an upper portion of the board housing 110, the upper supporting unit 260 primarily absorbs the force and prevents the force from being applied to the top part 152.
The upper supporting unit 260 may include a thermosetting resin, similarly as described above with respect to the lower supporting unit 220. The upper supporting unit 260 may be molded integrally with the lower supporting unit 220.
The soldering unit 240 is formed such that the soldering unit 240 is mounted to penetrate the lower supporting unit 220, and both of a first end and a second end opposite the first end of the soldering unit 240 are bent to be in contact with solder areas 126.
A plurality of soldering units 240 may be mounted in the lower supporting unit 220 such that each respective soldering unit 240 is spaced apart from a next soldering unit 240 by a predetermined distance.
A process of manufacturing the supporting member 200 according to the first exemplary embodiment will now be described below.
Referring to
As shown in
A process of mounting the supporting member 200 in the board 120 according to the first exemplary embodiment will now be described below.
As shown in
When the bottom parts 154 and the supporting member 200 are mounted on the bottom surface of the board 120, a soldering process is performed on the bottom surface of the board 120 so that the bottom part 154 and the supporting member 200 are fixed to the board 120. Accordingly, because the supporting member 200 is mounted and fixed in conjunction with the mounting of the bottom parts 154, a separate process for mounting the supporting member 200, such as a manual insertion process, is not required, thereby resulting in an increase in efficiency in a process and productivity.
Although the mounting of the top part 152 in the board 120 is not illustrated, in general, the top part 154 is mounted on the top of the board 120 prior to executing the SMT process for mounting the bottom parts 154 and the supporting member 200.
A supporting member included in a power board according to another exemplary embodiment will be described below. The components having the same structure as in the above-described exemplary embodiment are denoted by the same reference numerals, and thus the redundant description will be omitted or simplified. Further, the supporting member according to the exemplary embodiment will be described below by providing details relating to the differences between exemplary embodiments.
A supporting member according to a second exemplary embodiment will be now described.
Referring to
Each respective soldering unit 340 has an “L”-character shape such that one end 342 of the respective soldering unit 340 is inserted into an insertion groove formed in the lower supporting unit 320 and the other end 344 of the respective soldering unit 340 is in contact with a solder area (126 of
Next, a supporting member according to a third exemplary embodiment will be described below.
Referring to
If the supporting member 400 is not firmly fixed to the board due to a soldering failure relating to the soldering unit 340 after the mounting of the supporting member 400, the hook unit 450 serves to prevent the upper supporting unit 260 from slipping through the through-hole when the supporting member 400 is detached from the board. In particular, even when the supporting member 400 according to the third exemplary embodiment might otherwise become detached from the board, the hook unit 450 effectively locks onto the top of the board to prevent the supporting member 400 from becoming detached from the board.
The hook unit 450 may include the same material as the soldering unit 340 to provide ease of manufacturing, thereby enabling the hook unit 450 to be mounted in the upper supporting unit 260 when the soldering unit 340 is mounted in the lower supporting unit 320.
A LCD television (TV) has been illustrated as the LCD apparatus 1 of
Referring to
The foregoing exemplary embodiments and advantages are merely exemplary and are not to be construed as limiting the present inventive concept. The exemplary embodiments can be readily applied to other types of apparatuses. Also, the description of the exemplary embodiments is intended to be illustrative, and not to limit the scope of the claims, and many alternatives, modifications, and variations will be apparent to those skilled in the art.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-0095913 | Sep 2011 | KR | national |
