Power Electronics with a Heat Sink

Abstract

Power electronics include a printed circuit board on which at least one component to be cooled is mounted, and a heat sink which is arranged on that side of the printed circuit board which faces the component to be cooled. The heat sink is in thermally conductive contact with the component to be cooled. In order to allow the power electronics to be produced and assembled easily, they furthermore have a positioning device for positioning the printed circuit board in a defined orientation relative to the heat sink, where the distance between the heat sink and the printed circuit board corresponds approximately to the physical height of the at least one component to be cooled, and at least one attachment element for attaching the printed circuit board to the heat sink and at the same time for pressing the at least one component to be cooled against the heat sink.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a schematic plan view of The power electronics according to one exemplary embodiment; and

FIG. 2 shows a section taken through the power electronics along the line II-II in FIG. 1 and viewed in the direction of the arrows.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described in the following text with reference to rotation-speed electronics for a washing machine drive; it will be readily understood, however, that the invention can also be applied analogously to other power electronics as well, and the invention is not restricted to the specifically described, exemplary embodiment.

The heat sink 1 is an extruded part, for example composed of aluminium or some other metal with good thermal conductivity characteristics. The heat sink 1 comprises a base body in the form of a plate and from which a wall section 8 projects in one side area of the base body. A groove 9 is formed in this wall section 8. Furthermore, a multiplicity of cooling ribs or lamellae 11 are provided on the side of the heat sink 1 facing away from the wall section 8, in order to improve the cooling performance of the heat sink 1, in a known manner. Furthermore, a plurality of slots (not illustrated) are formed on the side of the heat sink 1 facing away from the cooling ribs 11.

The wall section 8, the groove 9, the cooling ribs 11 and the slots are all parallel to one another, so that the entire heat sink can be manufactured in a simple manner by way of one extrusion tool, as an extruded part. The extruded part does not need any further machining or treatment. All that is needed is for it to be cut to the desired length.

A printed circuit board 2 is mounted on the side of the heat sink 1 facing away from the cooling ribs 11. A plurality of components 3, 4 to be cooled, so-called power modules, as well as further components are mounted on this printed circuit board 2, with at least the power modules 3, 4 being mounted on the side of the printed circuit board 2 facing the heat sink 1. In the present exemplary embodiment, one of the power modules 3 is, for example, a bridge rectifier, and the other power module 4 contains, for example, three half-bridges and the associated drive circuit.

The printed circuit board 2 is pushed into the groove 9 in the wall section 8 of the heat sink, and is thus preinstalled on the heat sink 1. The distance between the groove 9 and the heat sink surface in this case defines the desired distance between the printed circuit board 2 and the heat sink 1, which corresponds approximately to the physical height of the components 3, 4 to be cooled. Furthermore, the printed circuit board 2 is provided with a stop 10, which defines the maximum insertion depth of the printed circuit board 2 into the groove 9, so that the printed circuit board 2 can also for this purpose be preinstalled in a predefined orientation relative to the heat sink 1.

One of the components 3 to be cooled is pressed directly against the heat sink 1, in order to produce a good thermal contact, by means of a self-tapping screw 5 as the attachment element according to the invention. The screw 5 is threaded into a corresponding slot in the heat sink 1. A bore or other aperture 12 is provided in the printed circuit board 2 for this purpose.

Two further self-tapping screws 6, 7 are provided as the attachment elements according to the invention for the other component 4 to be cooled. In contrast to the above component 3, this component 4 is, however, pressed by means of the screws 6, 7 against the heat sink 1 via the printed circuit board 2. On the one hand, this ensures good thermal contact between the component 4 to be cooled and the heat sink 1, while at the same time attaching the printed circuit board 2 to the heat sink 1.

In this case, self-tapping screws have been mentioned as preferred attachment elements 5, 6, and 7. However, the invention is not just restricted to them, and it is also possible to use other attachment elements, such as simple screws, bolts, rivets and the like.

As a result of the predefined position of the printed circuit board 2 in the groove 9 in the heat sink 1, the self-tapping screws 5, 6, 7 always automatically enter the slots in the lower face of the heat sink 1. There is no need to search for appropriate attachment holes in the heat sink 1. The components 3, 4 to be cooled are pressed against the heat sink 1 via the printed circuit board 2 by means of the attachment elements 5-7; there is no need for any additional attachment of the printed circuit board 2 to the heat sink 1.

In a preferred implementation of the power electronics, the printed circuit board 2 and the components 3, 4 are at least partially lacquered or encapsulated. A corresponding protective layer 13 is indicated at the bottom of FIG. 2.

The production of the heat sink 1 as an extruded part is simple, and the simple assembly of the printed circuit board 2 and heat sink 1 is suitable not only for manual assembly but also for automated assembly.

Claims

1. Power electronics, comprising: a printed circuit board having mounted thereon at least one component to be cooled;a heat sink disposed on said printed circuit board and in thermally conductive contact with the at least one component to be cooled;a positioning device for positioning said printed circuit board in a defined orientation relative to said heat sink and with a spacing distance between said heat sink and said printed circuit board approximately corresponding to a physical height of the at least one component to be cooled; andat least one attachment element for attaching said printed circuit board to said heat sink and for pressing the at least one component to be cooled against said heat sink.

2. The power electronics according to claim 1, wherein said positioning device includes a groove formed in a wall section of said heat sink, said groove being configured to receive said printed circuit board therein and being disposed at a predefined distance from a surface of said heat sink.

3. The power electronics according to claim 2, wherein said positioning device includes a stop formed on said printed circuit board, for defining an insertion depth of said printed circuit board into said groove.

4. The power electronics according to claim 1, wherein said at least one attachment element is a self-tapping screw.

5. The power electronics according to claim 4, wherein said heat sink has at least one slot formed therein on a side thereof facing towards said printed circuit board, and wherein said slot and said self-tapping screw are configured for said self-tapping screw to be screwed into said slot.

6. The power electronics according to claim 1, wherein at least one said attachment element presses the at least one component to be cooled against said heat sink via said printed circuit board.

7. The power electronics according to claim 6, wherein at least one further said attachment element presses at least one further component to be cooled directly against said heat sink.

8. The power electronics according to claim 1, wherein said heat sink is formed with a multiplicity of cooling ribs on a side thereof facing away from said printed circuit board.

9. The power electronics according to claim 1, wherein said heat sink is an extruded part with a multiplicity of parallel cooling ribs, one or more slots, a wall section, and a groove in said wall section extending parallel to one another.

10. The power electronics according to claim 1, wherein said printed circuit board and the at least one component are at least partially lacquered or encapsulated.

11. The power electronics according to claim 1 configured as power electronics for a washing machine drive.