This application claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. 2004-210199 filed Jul. 16, 2004, the entire content of which is hereby incorporated by reference.
The present invention relates to a probe mechanism constituted by a tip member comprising a needle-like member brought into contact with a sample, and a pick up mechanism having a handling function of separating, picking up, storing or the like of a small sample, particularly a pick up mechanism highly convenient for cutting out a defect portion of a sample of a transmission electron microscope (TEM) or a semiconductor device which are attached to an analyzing apparatus of a focusing ion beam (FIB) apparatus or a scanning probe microscope (SPM).
There is carried out an operation of bringing a probe into contact with a small sample while observing the sample by a scanning electron microscope (SEM), a scanning ion microscope (SIM), or a scanning probe microscope (SPM) and inspecting a physical property of an electric property or the like thereof. Further, there is carried out an operation of cutting out and picking up a portion of a semiconductor wafer or the like to fix to a sample base or the like in picking up a TEM sample or cutting out a failed defect portion thereof. The operation is constituted by a series of operation of making a needle-like probe approach a specific portion of a sample by operating a manipulator, bringing a probe tip portion into contact therewith and thereafter fixedly attaching the probe tip portion thereto by deposition (CVD) by FIB, further cutting to separate a sample piece from a sample main body by FIB etching, thereafter, carrying a sample piece to a predetermined position at which a sample base or the like is present to fix by operating the manipulator, and subjecting the tip portion of the probe fixedly attached with the sample piece previously by CVD to FIB etching to cut to separate the sample piece while observing in a chamber of an FIB apparatus or the like.
Patent Reference 1 discloses a technology of separating a sample piece including a region to be observed from a sample board by an ion beam sputtering method, picking up the sample piece from the sample board by using a beam member comprising a rod-like member for holding the sample piece by a force by elastically deforming a portion thereof for pressing to hold the sample and drawing to separate the sample, having a shape of a tip slenderer than a root thereof and dividing the tip portion for holding the sample piece provided by the shape, moving the sample piece to a mounting base for mounting the sample piece and separating the beam member and the sample piece to store the sample piece with an object of providing an apparatus and a method of separating, picking up and storing the small sample piece firmly and stably without contaminating the small sample piece and a peripheral region thereof. The invention adopts a mode of grabbing the sample piece in a tweezers mode by pinching the sample piece by a divided portion to press and therefore, although it is not necessary to fixedly attach the probe and the sample piece by CVD to thereby shorten an operation time period in comparison with the background art, a considerable skill is needed in the operation of pinching the sample piece by operating a manipulator while observing the sample piece by the microscope. Further, depending on a size or a shape of the sample, a size and a shape of the divided portion needs to be changed and the sample piece may be damaged by exerting an unreasonable force in pinching the sample piece.
Further, Patent Reference 2 discloses a pair of microtweezers in which as shown by
A technology of sensing contact between the probe and the sample is disclosed in Patent Reference 3 or Patent Reference 4. The invention of Patent Reference 3 is a technology of improving Patent Reference 2, it is an object thereof to provide inexpensive contact sensing means capable of sensing the contact of the sample and the probe regardless of a kind of the sample, and a probe comprising a needle-like conductive material having a tip in an acute angle shape is fixedly attached to a free end of a warp sensing beam having a piezoelectric resistance layer a resistance value of which is changed in accordance with a deformation of its own. Although contact between the sample and the probe can be sensed by adopting such a constitution, the constitution poses a problem that the sensing is limited in a direction of laminating piezoelectric elements. Further, it is an object of the invention of Patent Reference 4 to provide a probe apparatus capable of detecting that a small sample is completely cut off when a small sample is cut off from a sample of a wafer or the like to pick up by a probe, and it is detected that the small sample is completely cut off by previously applying a probe voltage from a probe control portion to the probe and detecting a change in the probe voltage immediately after cutting off the small sample from the sample by FIB. According to the contact sensing method, it is necessary to make a current flow in the sample and therefore, the method is based on a condition that the sample is conductive and the method is not applicable to a sample damaged, or destructed or the like by conducting electricity.
[Patent Reference 1] JP-A-2002-333387 “Beam member and sample machining apparatus and sample pick up method using beam member” Publication date; Heisei-14-11-22 (Nov. 22, 2002)
[Patent Reference 2] JP-A-2000-2630 “Probe moving apparatus and sample fabricating apparatus using the same” Publication date; Heisei-12-1-7 (Jan. 7, 2000)
[Patent Reference 3] JP-A-2002-33366 “Probe unit and sample operating apparatus using the same” Publication date; Heisei-14-1-31 (Jan. 31, 2002)
[Patent Reference 4] JP-A-2001-83055 “Probe apparatus” Publication date; Heisei-13-3-30 (Mar. 30, 2001)
A problem to be resolved by the invention resides in providing a probe mechanism or a small sample pick up mechanism of analyzing apparatus overcoming the above-described drawbacks of the mechanism of the background art, that is, providing a mechanism having a function of sensing contact of a sample and a probe without damaging the sample in approaching the sample, enabling to handle swiftly and firmly a small sample as a pick up mechanism and structurally simple without selecting a material of the sample.
According to the invention, there is provided a probe mechanism provided at an observing apparatus or an analyzing apparatus and characterized in including a tip member comprising a needle-like member brought into contact with a sample, the needle-like member comprising an electrostatic actuator for driving, and means for monitoring a change in an electrostatic capacitance between electrodes of the electrostatic actuator and capable of sensing that the needle-like member is brought into contact with the sample by the monitor.
According to the invention, the probe mechanism is installed in a vacuum chamber for an observing, analyzing or machining apparatus having a charged particle lens-barrel.
According to the probe mechanism of the invention, a structure of the electrodes of the electrostatic actuator is formed by a combteeth shape to intensify a drive force and promote a contact sensitivity.
According to the invention, there is provided a sample pick up mechanism provided at an observing apparatus or an analyzing apparatus and characterized in including a tip member comprising two pieces of needle-like members for grabbing a sample, comprising an electrostatic actuator for driving to make the two pieces of needle-like members proximate to and separate from each other, and means for monitoring a change in an electrostatic capacitance between electrodes of the electrostatic actuator to be capable of sensing that the needle-like members are brought into contact with the sample by the monitor.
Further, according to the invention, the sample pick up mechanism is installed in a vacuum chamber of an observing, analyzing or machining apparatus having a charged particle lens-barrel so as to be able to observe and machine by the changed particle.
Further, according to the sample pick up mechanism of the invention, a structure of the electrodes of the electrostatic actuator is formed in a combteeth shape in order to intensify a drive force and promote a contact sensitivity.
According to the sample pick up mechanism of the invention, there is adopted a structure of aligning positions of the two pieces of needle-like members at a center thereof, arranging the electrostatic actuators in a shape of a flat plate to interpose the two pieces of needle-like members on both sides thereof and connecting the electrostatic actuators and the two pieces of needle-like members locally by a coupling member. Further, the probe of the needle-like member and the electrostatic actuator are connected by interposing an insulating layer therebetween.
According to an electrostatic actuator installed at the probe of the invention and the sample pick up mechanism of the invention, a structure of including the needle-like member and the electrode is fabricated by a semiconductor silicon process technology.
According to the invention, there is provided a method of picking up a sample comprising a step of making a needle-like member approach a sample along with an electrostatic actuator while observing the sample by a microscope, a step of sensing that the needle-like member is brought into contact with the sample from a change in an electrostatic capacitance of the electrostatic actuator shown in a monitor, a step of grabbing the sample by driving the electrostatic actuator when it is sensed that the needle-like member is brought into contact with the sample, and a step of picking up the sample after grabbing the sample by using an observing, analyzing or machining apparatus including the electrostatic actuator for driving to make two pieces of the needle-like members for grabbing the sample proximate to and remote from each other, and the means for monitoring the change in the electrostatic capacitance between electrodes of the electrostatic actuator.
According to the invention, there is provided a method of analyzing an electric property of a surface of a sample comprising a step of sensing that a probe is brought into contact with the sample from a change in an electrostatic capacitance of an electrostatic actuator shown by a monitor, and a step of detecting an electric property of a portion of the sample brought into contact with the probe when it is sensed that the probe is brought into contact with the sample by a detecting portion electrically connected to the portion by way of the probe by using a sample pick up mechanism including the means for monitoring the change in the electrostatic capacitance between electrodes of the electrostatic actuator and connecting the probe of a needle-like member and the electrostatic actuator by interposing an insulting layer therebetween.
The probe mechanism and the small sample pick up mechanism of the invention are constituted by including the electrostatic actuator for driving and the means for monitoring a change in the electrostatic capacitance between the electrodes of the electrostatic actuator and therefore, the electrostatic actuator brings the tip member into contact with the sample and drives to grab the sample and therefore, the voltage necessary for driving to displace the tip by the same amount is far smaller than that in piezoelectrically driving the tip of the background art in the scale. Further, when the probe or the two pieces of needle-like members are brought into contact with the sample in a procedure of approaching the sample, the reaction is received thereby, and the contact can be sensed by the function of monitoring the change in the electrostatic capacitance. Thereby, the operation while observing the sample by FIB, SEM or the optical microscope is facilitated and efficient.
Further, the structure of the electrodes of the electrostatic actuator according to the invention is formed by the combteeth shape and therefore, the electrostatic capacitance can be increased by increasing areas of the electrodes opposed to each other, the driving force of the actuator is increased and the electrostatic actuator can function as a three-dimensional touch sensor with excellent sensitivity.
Further, by adopting the electrostatic actuator including the needle-like member and the electrode structure fabricated by the silicon process technology, the electrostatic actuators with excellent accuracy can be provided comparatively inexpensively by the large amount and can correspond also to a frequent interchanging demand.
The small sample pick up mechanism of the invention adopts the structure of arranging the two pieces of needle-like members at the center and the electrostatic actuators in the shape of the flat plate to interpose the two pieces of needle-like members on both sides thereof and connecting the two pieces of needle-like members and the electrostatic actuators locally by the coupling member and therefore, the two pieces of needle-like members can be operated to drive to be proximate to and remote from each other steadily by low energy.
Further, according to the small sample pick up mechanism of the invention, the insulting layers are interposed at the coupling members for connecting the needle-like members and the electrostatic actuators and therefore, a voltage or the like applied on the driving portion is not applied to the sample and the sample is not damaged electrically.
According to the method of picking up a sample of the invention, in a procedure of making the needle-like member approach the sample for each of the electrostatic actuators while observing the sample by the microscope, it is sensed that the needle-like member is brought into contact with the sample from a change in the electrostatic capacitance of the electrostatic actuator shown in the monitor and therefore, the operation of grabbing the sample by driving the electrostatic actuator can easily and firmly be executed.
Further, the method of analyzing the electric property of the surface of the sample of the invention can be executed in the state in which the voltage or the like applied on the electrostatic actuator driving portion is not applied to the sample and the sample is not electrically damaged since connection between the needle-like member and the electrostatic actuator is insulated. Further, it is sensed that the probe is brought into contact with the sample from a change in the electrostatic capacitance of the electrostatic actuator shown in the monitor and therefore, after confirming that the surface of the sample and the probe are brought into contact with each other, the electric property of the portion can easily and firmly be detected by the detecting portion electrically connected thereto by way of the needle-like member.
The inventors have developed a “gripper” capable of accurately moving an arm and capable of firmly grabbing even a small sample of a micrometer order and filed an application thereof on a date the same as that of the present application. The gripper is a structure having an electrostatic actuator for driving to make a pair of arms having parallel grabbing faces proximate to and remote from each other while maintaining the grabbing faces in parallel with each other and is fabricated as a small structure by using a semiconductor silicon process technology. The invention has conceived to adopt such a gripper at a grabbing portion of a pick up mechanism in an analyzing/observing apparatus of FIB or SEM which needs to handle the small sample in order to resolve the above-described problem. That is, in an analyzing apparatus which observes and inspects a small sample of the invention the invention has been developed to provide a mechanism which enables to handle a small sample safely, swiftly and firmly as a pick up mechanism and is structurally simple without selecting a material of the sample and a first characteristic point thereof resides in adopting an electrostatic actuator in place of a piezoelectrically driven actuator which has been used in the pick up mechanism of the background art. By replacing the drive source of the actuator, it is not necessary to apply a high voltage at a vicinity of the sample and a voltage which is needed in driving to the same degree becomes far smaller in a scale thereof.
Further, a second characteristic point of the invention resides in providing a function of monitoring an electrostatic capacitance between electrodes. According to the constitution, when a probe is brought into contact with an object (sample) in a procedure of being drive by an electrostatic actuator, as a reaction thereof, the electrostatic capacitance in correspondence with a displacement between the electrodes is discontinuously changed. When the change is monitored by an electrostatic capacitance sensor, contact of the probe can be sensed. According to observing, machining and analyzing apparatus of the background art, the operation is made to proceed while observing a state of a sample, for example, a sample and a state of bringing a pick up probe into contact with the sample by a microscope. However, although a microscope image is a two-dimensional image and therefore, the firm contact cannot be confirmed, according to the invention, by monitoring the contact by the electrostatic capacitance sensor, the contact state can accurately be sensed, thus an efficiency of the operation is promoted and the sample is not damaged in approaching the sample.
Under a condition of a probe having a small structure for an analyzing apparatus which is obliged to be arranged in a narrow space, according to a simple mode of constituting the two electrodes by a pair of planes opposed to each other, not only a problem that a drive force cannot sufficiently be exerted is posed but also a sensitivity when the direction of the reaction received by the contact is in parallel with the electrode planes becomes low. Hence, according to the invention, it is conceived that the two electrodes are formed in a combteeth shape as shown by the right side of
A model shown in
A simple explanation will be given of a method of fabricating the gripper by a semiconductor silicon process technology.
The grippers are fabricated by the semiconductor silicon process technology in this way and therefore, a number of the grippers having the same standard can be provided in one process and therefore, the grippers can be supplied inexpensively.
Next, an explanation will be given of a process of fabricating a sample of a sectional structure of a semiconductor device for observing by a transmission electron microscope (hereinafter, referred to as TEM sample) by using an FIB apparatus attached with the gripper at a tip portion of a micromanipulator in reference to
Number | Date | Country | Kind |
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2004-210199 | Jul 2004 | JP | national |
Number | Name | Date | Kind |
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20010008476 | Imamura | Jul 2001 | A1 |
20050072231 | Chojnacki et al. | Apr 2005 | A1 |
20060014196 | Konno et al. | Jan 2006 | A1 |
20060220659 | Konno et al. | Oct 2006 | A1 |
20070187623 | Skidmore et al. | Aug 2007 | A1 |
Number | Date | Country |
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2000-2630 | Jan 2000 | JP |
2001-83055 | Mar 2001 | JP |
2002-33366 | Jan 2002 | JP |
2002-333387 | Nov 2002 | JP |
Number | Date | Country | |
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20060010968 A1 | Jan 2006 | US |