This application is a divisional application of Ser. No. 08/853,211, filed May 8, 1997.
Number | Name | Date | Kind |
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4448804 | Amelio et al. | May 1984 | |
4521280 | Bahrle et al. | Jun 1985 | |
4559292 | Geissler et al. | Dec 1985 | |
4581308 | Moriya et al. | Apr 1986 | |
4867839 | Sato et al. | Sep 1989 | |
4911786 | Kindl et al. | Mar 1990 | |
4940651 | Brown et al. | Jul 1990 | |
4983252 | Masui et al. | Jan 1991 | |
4992354 | Axon et al. | Feb 1991 | |
5026624 | Day et al. | Jun 1991 | |
5028513 | Murakami et al. | Jul 1991 | |
5164284 | Briguglio et al. | Nov 1992 | |
5208067 | Jones et al. | May 1993 | |
5264325 | Allen et al. | Nov 1993 | |
5278010 | Day et al. | Jan 1994 | |
5300402 | Card, Jr. et al. | Apr 1994 | |
5304457 | Day et al. | Apr 1994 | |
5391458 | Conrad | Feb 1995 | |
5437960 | Nagate et al. | Aug 1995 | |
5439766 | Day et al. | Aug 1995 | |
5439779 | Day et al. | Aug 1995 | |
5443672 | Stoll et al. | Aug 1995 | |
5557844 | Bhat et al. | Sep 1996 | |
5648200 | Letize et al. | Jul 1997 | |
5665650 | Lauffer et al. | Sep 1997 | |
5667934 | Markovich et al. | Sep 1997 |
Entry |
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IBM Technicle Disclosure Bulletin, Vol. 33, No. 7, Dec. 1990 "Improved Composition for a Dry Film Soldermask" by Day, et al. |
IBM Technical Disclosure Bulletin , Vol. 36, No. 10, Oct. 1993, "Formation of Surface Laminar Circuit Printed Circuit Board with Plated Through Holes". |
IBM Technical Disclosure Bulletin, Vol. 14, No. 3, Aug. 1971, "Making Integral Multilayer Circuit Boards with Cable Connection". |
Number | Date | Country | |
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Parent | 853211 | May 1997 |