Claims
- 1. A process of making a multileveled electronic package comprising the steps of:
- (a) depositing a layer of poly(aryl ether benzimidazole), in the form of a solution, over a substrate;
- (b) heating said poly(aryl ether benzimidazole) layer to drive off said solvent;
- (c) adding a coating of polyamic acid to said layer of said poly(aryl ether benzimidazole) whereby a product is formed;
- (d) heating said product of step (c) whereby said poly(aryl ether benzimidazole) is cured and said polymeric acid is converted to a cured polyimide to provide a randomly cured product;
- (e) forming vias in said randomly cured product of step (d);
- (f) depositing copper in said vias to complete a first layer; and
- (g) repeating steps (a) to (f) whereby a second layer is formed.
- 2. A process in accordance with claim 1 wherein said step (d) of heating poly(aryl ether benzimidazole) and said polyamic acid to form said cured polyimide occurs at a temperature of between about 300.degree. C. and about 400.degree. C.
- 3. A process in accordance with claim 2 wherein said solvent of said poly(aryl ether benzimidazole) solution in said step (a) includes an aprotic solvent.
- 4. A process in accordance with claim 3 wherein said heating step (b) occurs at a temperature in the range of between about 70.degree. C. and about 200.degree. C.
- 5. A process in accordance with claim 1 wherein said poly(aryl ether benzimidazole) has the structural formula ##STR14## where n is an integer of at least about 15.
- 6. A process in accordance with claim 1 wherein aid poly(aryl ether benzimidazole) has the structural formula ##STR15## where m is an integer of at least about 2.
- 7. A process in accordance with claim 1 wherein said poly (aryl ether benzimidazole) has the structural formula ##STR16## where x is at least about 0.1; y is at least about 0.1, with the proviso that the sum of x and y is at least about 1; and z is an integer of at least about 15.
- 8. A process in accordance with claim 1 wherein said poly(aryl ether benzimidazole) has the structural formula ##STR17## where X is ##STR18## and p is an integer of at least about 15.
Parent Case Info
This is a divisional of application Ser. No. 08/318,392, filed on Oct. 6, 1994, now U.S. Pat. No. 5,516,874, which is a continuation application of U.S. Ser. No. 08/268,422, filed on Jun. 30, 1994, now abandoned.
US Referenced Citations (14)
Divisions (1)
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319392 |
Oct 1994 |
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Continuations (1)
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268422 |
Jun 1994 |
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