Patent Application
20240250013
The present disclosure generally relates to a radio frequency module, a communication device, and a method of manufacturing the radio frequency module, and more specifically, to a radio frequency module including a mounting substrate, a communication device including the radio frequency module, and a method of manufacturing the radio frequency module including the mounting substrate.
Patent Document 1 describes a radio frequency module including a module substrate (mounting substrate), a filter (first electronic component), a semiconductor IC (second electronic component), and a plurality of columnar electrodes. The module substrate has a first main surface and a second main surface. The filter is mounted on the first main surface of the module substrate. The semiconductor IC is mounted on the second main surface of the module substrate. The plurality of columnar electrodes are disposed on the second main surface of the module substrate.
Patent Document 1: International Publication No. WO 2020/071021
In the radio frequency module as described in Patent Document 1, it is desired that the columnar electrode is thinned as a size of the radio frequency module is reduced. Meanwhile, assuming the columnar electrode is thinned, an electric resistance is increased, and there is an issue that a signal loss is increased.
An object of the present disclosure is to provide a radio frequency module capable of reducing a signal loss while achieving reduction in size, a communication device, and a method of manufacturing the radio frequency module. Solution to Problem
According to an aspect of the present disclosure, there is provided a radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The mounting substrate has a first main surface and a second main surface facing each other. The first electronic component is disposed on the first main surface of the mounting substrate. The second electronic component and the first connection terminal are disposed on the second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal and disposed on a side of the first connection terminal opposite to a mounting substrate side. The first resin layer covers at least a part of the second electronic component and covers at least a part of the first connection terminal. The second resin layer is disposed on the first resin layer and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.
According to another aspect of the present disclosure, there is provided a radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The mounting substrate has a first main surface and a second main surface facing each other. The first electronic component is disposed on the first main surface of the mounting substrate. The second electronic component and the first connection terminal are disposed on the second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal and disposed on a side of the first connection terminal opposite to a mounting substrate side. The first resin layer covers at least a part of the second electronic component and covers at least a part of the first connection terminal. The second resin layer is disposed on the first resin layer and covers at least a part of the second connection terminal. A shape of each of the first connection terminal and the second connection terminal is a columnar shape. An area of the first connection terminal is larger than an area of the second connection terminal in a plan view in a thickness direction of the mounting substrate.
According to still another aspect of the present disclosure, there is provided a communication device including the radio frequency module, and a signal processing circuit. The signal processing circuit is connected to the radio frequency module.
According to still another aspect of the present disclosure, there is provided a method of manufacturing a radio frequency module including a step of preparing a mounting substrate that includes a first main surface and a second main surface facing each other, and a step of forming a metal member on the second main surface of the mounting substrate. The method of manufacturing the radio frequency module further includes a step of disposing an electronic component on the second main surface of the mounting substrate, and a step of forming a first resin member on a second main surface side of the mounting substrate to cover at least a part of the electronic component. The method of manufacturing the radio frequency module further includes a step of forming a first resin layer by polishing a main surface of the first resin member on an opposite side to a mounting substrate side such that a main surface of the first connection terminal formed from the metal member on an opposite side to the mounting substrate side is exposed. The method of manufacturing the radio frequency module further includes a step of forming a second resin member on a side of the first resin layer opposite to a mounting substrate side, and a step of forming a second resin layer by forming a through-hole at a part of the second resin member facing the first connection terminal in a thickness direction of the mounting substrate. The method of manufacturing the radio frequency module further includes a step of forming a second connection terminal in the through-hole of the second resin layer. The second connection terminal is located inside the first connection terminal in a plan view in the thickness direction of the mounting substrate. Advantageous Effects of Disclosure
With a radio frequency module, a communication device, and a method of manufacturing the radio frequency module according to an aspect of the present disclosure, it is possible to reduce a signal loss while achieving reduction in size.
Hereinafter, a radio frequency module, a communication device, and a method of manufacturing the radio frequency module according to Embodiments 1 to 7 will be described with reference to the accompanying drawings. All of
A configuration of a radio frequency module 1 according to Embodiment 1 will be described with reference to the drawings.
The radio frequency module 1 is used, for example, in a communication device 100 as illustrated in
The communication device 100 performs communication in a first communication band. More specifically, the communication device 100 performs transmission of transmission signals in the first communication band and reception of reception signals in the first communication band.
The transmission signals and the reception signals of the first communication band are, for example, signals of a frequency division duplex (FDD). The FDD is a wireless communication technology in which different frequency bandwidths are assigned to transmission and reception in wireless communication, and transmission and reception are performed. The transmission signal and the reception signal of the first communication band are not limited to the FDD signals, and may be signals of time division duplex (TDD). The TDD is a wireless communication technology in which the same frequency bandwidth is assigned to transmission and reception in wireless communication, and transmission and reception are switched by the hour.
Hereinafter, a circuit configuration of the radio frequency module 1 according to Embodiment 1 will be described with reference to
As illustrated in
The transmission filter 11 illustrated in
The reception filter 12 illustrated in
The power amplifier 13 illustrated in
The low-noise amplifier 14 illustrated in
As illustrated in
The output matching circuit 15 has a configuration including an inductor. The inductor of the output matching circuit 15 is provided on an output side of the power amplifier 13 in the transmission path T1. The output matching circuit 15 is not limited to the configuration including one inductor, and may have, for example, a configuration including a plurality of inductors, or a configuration including a plurality of inductors and a plurality of capacitors.
As illustrated in
The input matching circuit 16 has a configuration including an inductor. The inductor of the input matching circuit 16 is provided on an input side of the low-noise amplifier 14 in the reception path R1. The input matching circuit 16 is not limited to the configuration including one inductor, and may have, for example, a configuration including a plurality of inductors, or a configuration including a plurality of inductors and a plurality of capacitors.
As illustrated in
The matching circuit 17 has a configuration including an inductor. The inductor of the matching circuit 17 is provided on an output side of the transmission filter 11 in the transmission path T1. The matching circuit 17 is not limited to the configuration including one inductor, and may have, for example, a configuration including a plurality of inductors, or a configuration including a plurality of inductors and a plurality of capacitors.
As illustrated in
The matching circuit 18 has a configuration including an inductor. The inductor of the matching circuit 18 is provided on an input side of the reception filter 12 in the reception path R1. The matching circuit 18 is not limited to the configuration including one inductor, and may have, for example, a configuration including a plurality of inductors, or a configuration including a plurality of inductors and a plurality of capacitors.
The switch 19 illustrated in
The switch 19 switches connection states between the common terminal 190 and the plurality of selection terminals 191 and 192. The switch 19 is controlled by, for example, the signal processing circuit 20. The switch 19 electrically connects the common terminal 190 to at least one of the plurality of selection terminals 191 and 192, according to a control signal from an RF signal processing circuit 201 of the signal processing circuit 20.
As illustrated in
The antenna terminal 701 is connected to the antenna 203. In the radio frequency module 1, the antenna terminal 701 is connected to the switch 19. In addition, the antenna terminal 701 is connected to the transmission filter 11 and the reception filter 12 with the switch 19 interposed therebetween.
The signal input terminal 702 is a terminal for inputting transmission signals from an external circuit (for example, the signal processing circuit 20) to the radio frequency module 1. In the radio frequency module 1, the signal input terminal 702 is connected to the power amplifier 13.
The signal output terminal 703 is a terminal for outputting a reception signal from the low-noise amplifier 14 to an external circuit (for example, the signal processing circuit 20). In the radio frequency module 1, the signal output terminal 703 is connected to the low-noise amplifier 14.
The plurality of ground terminals are terminals which are electrically connected to a ground electrode of an external substrate (not illustrated) included in the communication device 100 and to which a ground potential is applied. In the radio frequency module 1, the plurality of ground terminals are connected to a ground layer (not illustrated) of a mounting substrate 2. The ground layer is a circuit ground of the radio frequency module 1.
Hereinafter, a structure of the radio frequency module 1 according to Embodiment 1 will be described with reference to the drawings.
As illustrated in
The radio frequency module 1 can be electrically connected to the external substrate (not illustrated). The external substrate corresponds to a mother substrate of the communication device 100 (see
As illustrated in
The mounting substrate 2 is a multilayer substrate in which a plurality of dielectric layers are laminated. The mounting substrate 2 has a plurality of conductive layers 23 and a plurality of via-conductors 24 (including through- electrodes). The plurality of conductive layers 23 include a ground layer at a ground potential. The plurality of via- conductors 24 are used for electrical connection of elements (including the first electronic component 3A and the second electronic component 3B described above) mounted on each of the first main surface 21 and the second main surface 22 and the conductive layer 23 of the mounting substrate 2. The plurality of via-conductors 24 are used for electrical connection between the elements mounted on the first main surface 21 and the elements mounted on the second main surface 22 and for electrical connection between the conductive layer 23 of the mounting substrate 2 and the first connection terminal 71.
The plurality of first electronic components 3A are disposed on the first main surface 21 of the mounting substrate 2. The second electronic component 3B and the plurality of first connection terminals 71 are disposed on the second main surface 22 of the mounting substrate 2.
As illustrated in
Electronic components constituting the transmission filter 11 are not illustrated in
Each of the transmission filter 11 and the reception filter 12 is, for example, an acoustic wave filter including a plurality of series arm resonators and a plurality of parallel arm resonators. The acoustic wave filter is, for example, a surface acoustic wave (SAW) filter that uses a surface acoustic wave. Further, each of the transmission filter 11 and the reception filter 12 may include at least one of an inductor and a capacitor connected in series to any one of the plurality of series arm resonators, or may include an inductor or a capacitor connected in series to any one of the plurality of parallel arm resonators.
As illustrated in
Each of the output matching circuit 15, the input matching circuit 16, and the plurality of matching circuits 17 and 18 is not illustrated in
The plurality of first connection terminals 71 are terminals for electrically connecting the mounting substrate 2 and the second connection terminal 72.
As illustrated in
The plurality of second connection terminals 72 are terminals for electrically connecting the plurality of first connection terminals 71 and an external substrate (not illustrated). Each of the plurality of second connection terminals 72 corresponds to at least one of the plurality of first connection terminals 71. In the example in
As illustrated in
As illustrated in
As illustrated in
As illustrated in
Here, hardness of the resin layer 5 (first resin layer) is preferably harder than hardness of the resin layer 6 (second resin layer). A scale indicating the “hardness” is, for example, Vickers hardness. The “A is harder than B” means, for example, that a numerical value of Vickers hardness of A is larger than a numerical value of Vickers hardness of B.
At least one of the material of the resin layer 5 and the material of the resin layer 6 is preferably a material having high thermal conductivity. Thus, it is possible to improve heat radiation performance of heat generated in the second electronic component 3B.
As illustrated in
The mounting substrate 2 illustrated in
Further, the mounting substrate 2 is not limited to the LTCC substrate, and may be, for example, a wiring structure. The wiring structure is, for example, a multilayer structure. The multilayer structure includes at least one insulating layer and at least one conductive layer. The insulating layer is formed in a predetermined pattern. In a case where the number of insulating layers is plural, the plurality of insulating layers are formed in a predetermined pattern determined for each layer. The conductive layer is formed in a predetermined pattern different from the predetermined pattern of the insulating layer. In a case where the number of conductive layers is plural, the plurality of conductive layers are formed in a predetermined pattern determined for each layer. The conductive layer may include one or a plurality of rewiring portions. In the wiring structure, a first surface of two surfaces facing each other in a thickness direction of the multilayer structure is the first main surface 21 of the mounting substrate 2, and a second surface is the second main surface 22 of the mounting substrate 2. The wiring structure may be, for example, an interposer. The interposer may be an interposer using a silicon substrate or may be a substrate having multiple layers.
The first main surface 21 and the second main surface 22 of the mounting substrate 2 are separated in the thickness direction D1 of the mounting substrate 2, and intersect with the thickness direction D1 of the mounting substrate 2. The first main surface 21 of the mounting substrate 2 is, for example, orthogonal to the thickness direction D1 of the mounting substrate 2, and may include, for example, a side surface or the like of a conductor portion as a surface that is not orthogonal to the thickness direction D1 of the mounting substrate 2. In addition, the second main surface 22 of the mounting substrate 2 is, for example, orthogonal to the thickness direction D1 of the mounting substrate 2, and may include, for example, a side surface or the like of a conductor portion as a surface that is not orthogonal to the thickness direction D1 of the mounting substrate 2. Further, the first main surface 21 and the second main surface 22 of the mounting substrate 2 may be formed with a fine roughness portion, a recess portion, or a protruding portion. The mounting substrate 2 has an oblong shape, and may be, for example, a square shape, in the plan view in the thickness direction D1 of the mounting substrate 2.
Detailed structures of the transmission filter 11 and the reception filter 12 will be described. In the following description, the transmission filter 11 and the reception filter 12 are referred to as filters without distinguishing between the transmission filter 11 and the reception filter 12.
The filter is a one-chip filter. Here, in the filter, for example, each of a plurality of series arm resonators and a plurality of parallel arm resonators is configured with an acoustic wave resonator. In this case, the filter includes, for example, a substrate, a piezoelectric body layer, and a plurality of interdigital transducer electrodes (IDTs). The substrate has a first surface and a second surface. The piezoelectric body layer is provided on the first surface of the substrate. The piezoelectric body layer is provided on a low velocity-of-sound film. The plurality of IDT electrodes are provided on the piezoelectric body layer. Here, the low velocity-of-sound film is directly or indirectly provided on the substrate. In addition, the piezoelectric body layer is directly or indirectly provided on the low velocity-of-sound film. In the low velocity-of-sound film, a velocity of sound of a bulk wave that propagates through the low velocity-of- sound film is lower than a velocity of sound of a bulk wave that propagates through the piezoelectric body layer. In the substrate, a velocity of sound of the bulk wave that propagates through the substrate is faster than a velocity of sound of an acoustic wave that propagates through the piezoelectric body layer. A material of the piezoelectric body layer is, for example, lithium tantalate. A material of the low velocity-of-sound film is, for example, silicon oxide. The substrate is, for example, a silicon substrate.
The piezoelectric body layer may be formed with, for example, any one of lithium tantalate, lithium niobate, zinc oxide, aluminum nitride, or lead zirconate titanate (PZT). In addition, the low velocity-of-sound film may include at least one material selected from a group consisting of silicon oxide, glass, silicon oxynitride, tantalum oxide, and a compound obtained by adding fluorine, carbon, or boron to silicon oxide. In addition, the substrate may include at least one material selected from a group consisting of silicon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, lithium tantalate, lithium niobate, crystal, alumina, zirconia, cordierite, mullite, steatite, forsterite, magnesia, and diamond.
The filter further includes, for example, a spacer layer and a cover member. The spacer layer and the cover member are provided on the first surface of the substrate. The spacer layer surrounds the plurality of IDT electrodes, in a plan view in a thickness direction of the substrate. The spacer layer has a frame shape (rectangular frame shape), in the plan view in the thickness direction of the substrate. The spacer layer has electric insulation. The material of the spacer layer is, for example, an epoxy resin or a synthetic resin such as polyimide. The cover member has a flat plate shape. The cover member has an oblong shape in the plan view in the thickness direction of the substrate. Meanwhile, the cover member is not limited thereto, and may have, for example, a square shape. In the filter, an outer size of the cover member, an outer size of the spacer layer, and an outer size of the cover member are substantially the same, in the plan view in the thickness direction of the substrate. The cover member is disposed on the spacer layer to face the substrate in the thickness direction of the substrate. The cover member overlaps with the plurality of IDT electrodes in the thickness direction of the substrate, and is separated from the plurality of IDT electrodes in the thickness direction of the substrate. The cover member has electric insulation. A material of the cover member is, for example, an epoxy resin or a synthetic resin such as polyimide. The filter has a space surrounded by the substrate, the spacer layer, and the cover member. In the filter, the space contains a gas. The gas is, for example, air, an inert gas (for example, nitrogen gas), or the like. The plurality of terminals are exposed from the cover member. Each of the plurality of terminals is, for example, a bump. Each bump is, for example, a solder bump. Each bump is not limited to the solder bump, and may be, for example, a gold bump.
The filter may include, for example, a close contact layer interposed between the low velocity-of-sound film and the piezoelectric body layer. The close contact layer is made of, for example, a resin (epoxy resin and polyimide resin). Further, the filter may include a dielectric film either between the low velocity-of-sound film and the piezoelectric body layer, over the piezoelectric body layer, or under the low velocity-of-sound film.
Further, the filter may include, for example, a high velocity-of-sound film interposed between the substrate and the low velocity-of-sound film. Here, the high velocity-of- sound film is directly or indirectly provided on the substrate. The low velocity-of-sound film is directly or indirectly provided on the high velocity-of-sound film. The piezoelectric body layer is directly or indirectly provided on the low velocity-of-sound film. In the high velocity-of-sound film, a velocity of sound of a bulk wave that propagates through the high velocity-of-sound film is faster than a velocity of sound of an acoustic wave that propagates through the piezoelectric body layer. In the low velocity-of-sound film, a velocity of sound of a bulk wave that propagates through the low velocity- of-sound film is lower than a velocity of sound of a bulk wave that propagates through the piezoelectric body layer.
The high velocity-of-sound film is made of diamond-like carbon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, silicon, sapphire, lithium tantalate, lithium niobate, a piezoelectric body such as crystal, various ceramics such as alumina, zirconia, cordierite, mullite, steatite, and forsterite, magnesia, diamond, or a material having each of the above materials as a main component, and a material having a mixture of each of the above materials as a main component.
Regarding a thickness of the high velocity-of-sound film, since the high velocity-of-sound film has a function of confinement of acoustic waves in the piezoelectric body layer and the low velocity-of-sound film, the larger the thickness of the high velocity-of-sound film, the more preferable. A piezoelectric substrate may have the close contact layer, the dielectric film, or the like, as another film other than the high velocity-of-sound film, the low velocity-of-sound film, and the piezoelectric body layer.
Each of the plurality of series arm resonators and the plurality of parallel arm resonators is not limited to the acoustic wave resonator described above, and may be, for example, a SAW resonator or a bulk acoustic wave (BAW) resonator. Here, the SAW resonator includes, for example, a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. In a case where each of the plurality of series arm resonators and the plurality of parallel arm resonators is configured with the SAW resonator, the filter includes a plurality of IDT electrodes corresponding to the plurality of series arm resonators on a one-to-one basis on one piezoelectric substrate, and a plurality of IDT electrodes corresponding to the plurality of parallel arm resonators on a one-to-one basis. The piezoelectric substrate is, for example, a lithium tantalate substrate, a lithium niobate substrate, or the like. The BAW resonator is, for example, a film bulk acoustic resonator (FBAR) or a solidly mounted resonator (SMR). The BAW resonator has a substrate. The substrate is, for example, a silicon substrate.
The power amplifier 13 illustrated in
The IC chip 25 illustrated in
As illustrated in
The antenna 203 is connected to the antenna terminal 701 of the radio frequency module 1. The antenna 203 has a transmission function of emitting a transmission signal output from the radio frequency module 1 as a radio wave, and a reception function of receiving a reception signal from an outside as a radio wave and outputting the reception signal to the radio frequency module 1.
The signal processing circuit 20 includes the RF signal processing circuit 201 and a baseband signal processing circuit 202. The signal processing circuit 20 processes a signal passing through the radio frequency module 1. More specifically, the signal processing circuit 20 processes a transmission signal and a reception signal.
The RF signal processing circuit 201 is, for example, a radio frequency integrated circuit (RFIC). The RF signal processing circuit 201 performs signal processing on a radio frequency signal.
The RF signal processing circuit 201 performs signal processing, such as upconverting, on a radio frequency signal output from the baseband signal processing circuit 202, and outputs the radio frequency signal on which the signal processing is performed to the radio frequency module 1. The RF signal processing circuit 201 performs signal processing, such as down-conversion, on a radio frequency signal output from the radio frequency module 1, and outputs the radio frequency signal on which the signal processing is performed to the baseband signal processing circuit 202.
The baseband signal processing circuit 202 is, for example, a baseband integrated circuit (BBIC). The baseband signal processing circuit 202 performs predetermined signal processing on a transmission signal from an outside of the signal processing circuit 20. The reception signal processed by the baseband signal processing circuit 202 is used, for example, as an image signal as an image signal for an image display or used as an audio signal for a call.
Further, the RF signal processing circuit 201 also has a function as a control unit that controls connection of the switch 19 included in the radio frequency module 1, based on transmission and reception of the radio frequency signals (transmission signal and reception signal). Specifically, the RF signal processing circuit 201 switches the connections of the switch 19 of the radio frequency module 1 by a control signal (not illustrated). The control unit may be provided outside the RF signal processing circuit 201, and may be provided in the radio frequency module 1 or the baseband signal processing circuit 202, for example.
Hereinafter, detailed structures of the first connection terminal 71 and the second connection terminal 72 will be described with reference to the drawings.
As illustrated in
A shape of the first connection terminal 71 and the second connection terminal 72 is, for example, a columnar shape. More specifically, the shape of each of the first connection terminal 71 and the second connection terminal 72 is, for example, a cylindrical shape. As illustrated in
Further, as described above, the diameter dl of the first connection terminal 71 is larger than the diameter d2 of the second connection terminal 72. Therefore, the second connection terminal 72 can be disposed inside the first connection terminal 71, in the plan view in the thickness direction D1 of the mounting substrate 2 (see
Further, as illustrated in
Here, as illustrated in
For example, in a case where the material of the second connection terminal 72 does not include gold but includes copper, adhesion with a solder may be decreased due to oxidation of the copper. On the other hand, with the radio frequency module 1 according to Embodiment 1, the material of the second connection terminal 72 includes gold and is difficult to oxidize, so that adhesion with the solder can be improved.
Next, a method of manufacturing the radio frequency module 1 according to Embodiment 1 will be described with reference to
The method of manufacturing the radio frequency module 1 includes, for example, a first step, a second step, a third step, a fourth step, a fifth step, a sixth step, a seventh step, and an eighth step, and a ninth step.
The first step is a step of preparing the mounting substrate 2 (see
The third step is a step of disposing the second electronic component 3B (electronic component) on the second main surface 22 of the mounting substrate 2. More specifically, in the third step, as illustrated in
In the fifth step, by using, for example, a polishing machine, a main surface 501 (see
Here, by executing the fifth step, a main surface 711 of each of the plurality of first connection terminals 71 on an opposite side to the mounting substrate 2 side, a main surface 31 of the second electronic component 3B on an opposite side to the mounting substrate 2 side, and the main surface 51 of the resin layer 5 on an opposite side to the mounting substrate 2 side are on the same plane (see
The sixth step is a step of forming a resin member 600 (second resin member). More specifically, in the sixth step, as illustrated in
The eighth step is a step of forming the plurality of second connection terminals 72. More specifically, in the eighth step, as illustrated in
With the first to ninth steps described above, the radio frequency module 1 as illustrated in
Meanwhile, as illustrated in
Further, in the radio frequency module 1 according to Embodiment 1, the first connection terminal 71 can be enlarged to the vicinity of the metal electrode layer 8 in the second direction D2, so that the characteristics of the radio frequency module 1 can be improved. On the other hand, the second connection terminal 72 is made smaller than the first connection terminal 71, so that a distance from the metal electrode layer 8 can be secured, and, as a result, the second connection terminal 72 and the metal electrode layer 8 are less likely to come into contact with each other (short circuit).
In the method of manufacturing the radio frequency module 1 according to Embodiment 1, the first step is a step of preparing the mounting substrate 2 having the first main surface 21 and the second main surface 22 facing each other. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the second step is a step of forming the metal member 700 on the second main surface 22 of the mounting substrate 2. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the third step is a step of disposing the second electronic component 3B (electronic component) on the second main surface 22 of the mounting substrate 2. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the fourth step is a step of forming the resin member 500 (first resin member) on the second main surface 22 side of the mounting substrate 2 to cover at least a part of the second electronic component 3B. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the fifth step is a step of forming the resin layer 5 (first resin layer) by polishing the main surface 501 of the resin member 500 on an opposite side to the mounting substrate 2 side such that the main surface 711 of the first connection terminal 71 formed from the metal member 700, on an opposite side to the mounting substrate 2 side is exposed. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the sixth step is a step of forming the resin member 600 (second resin member) on a side of the resin layer 5 opposite to the mounting substrate 2 side. Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the seventh step is a step of forming the through-hole 61 at a part of the resin member 600 facing the first connection terminal 71 in the thickness direction D1 of the mounting substrate 2 to form the resin layer 6 (second resin layer). Further, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, the eighth step is a step of forming the second connection terminal 72 in the through-hole 61 of the resin layer 6.
Here, in the method of manufacturing the radio frequency module 1 according to Embodiment 1, after the step of forming the metal member 700 on the second main surface 22 of the mounting substrate 2 is mounted, the step of disposing the second electronic component 3B on the second main surface 22 of the mounting substrate 2. Meanwhile, the order of the above two steps may be reversed. That is, after the step of disposing the second electronic component 3B on the second main surface 22 of the mounting substrate 2, the step of forming the metal member 700 on the second main surface 22 of the mounting substrate 2 may be executed.
In the radio frequency module 1 according to Embodiment 1, the first connection terminal 71 is disposed on the second main surface 22 of the mounting substrate 2, and the second connection terminal 72 is disposed on a side of the first connection terminal 71 opposite to the mounting substrate 2 side. In addition, the second connection terminal 72 is connected to the first connection terminal 71, and the second connection terminal 72 is located inside the first connection terminal 71, in the plan view in the thickness direction D1 of the mounting substrate 2. Thus, as compared with a case where the second connection terminal 72 is as thick as the first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2, it is possible to reduce the interval G1 between two first connection terminals 71 adjacent to each other in a direction (second direction D2) intersecting with the thickness direction D1 of the mounting substrate 2, and as a result, reduction in size of the radio frequency module 1 can be achieved. Further, as compared with a case where the first connection terminal 71 is as thin as the second connection terminal 72 in the plan view in the thickness direction D1 of the mounting substrate 2, it is possible to reduce an electric resistance of the first connection terminal 71 and the second connection terminal 72, and as a result, it is possible to reduce a signal loss. That is, with the radio frequency module 1 according to Embodiment 1, it is possible to reduce the signal loss while achieving the reduction in size of the radio frequency module 1.
Further, in the radio frequency module 1 according to Embodiment 1, the interval G2 between two second connection terminals 72 adjacent to each other in the second direction D2 that intersects (orthogonal) with the first direction D1 which is a thickness direction of the mounting substrate 2 is larger than the interval G1 between two first connection terminals 71 adjacent to each other in the second direction D2. Thus, it is possible to reduce connection failures assuming the radio frequency module 1 is mounted on the external substrate, as compared with a case where the interval G2 is the same as the interval G1.
Further, in the radio frequency module 1 according to Embodiment 1, the length L2 of the second connection terminal 72 is smaller than the length L1 of the first connection terminal 71, in the thickness direction D1 of the mounting substrate 2. Thus, as compared with a case where the length L2 of the second connection terminal 72 is equal to or larger than the length L1 of the first connection terminal 71, an electric resistance can be reduced and a decrease in strength can be reduced.
Further, in the radio frequency module 1 according to Embodiment 1, each shape of the first connection terminal 71 and the second connection terminal 72 is cylindrical, and the diameter d1 of the first connection terminal 71 is larger than the diameter d2 of the second connection terminal 72 in the plan view in the thickness direction D1 of the mounting substrate 2. Thus, the electric resistance can be reduced as compared with a case where the diameter dl of the first connection terminal 71 is the same as the diameter d2 of the second connection terminal 72.
In the radio frequency module 1 according to Embodiment 1, as illustrated in
Further, in the radio frequency module 1 according to Embodiment 1, the second connection terminal 72 has a two- layer structure or a three-layer structure, and may have, for example, a one-layer structure.
A radio frequency module 1a according to Embodiment 2 will be described with reference to
As illustrated in
As illustrated in
Each of the plurality of second connection terminals 72 is formed in the corresponding through-hole 61 among the plurality of through-holes 61 of the resin layer 6 (second resin layer). Each of the plurality of bumps 200 is formed in the corresponding through-hole 61 among the plurality of through-holes 61 of the resin layer 6. Further, each of the plurality of bumps 200 is connected to the corresponding second connection terminal 72 among the plurality of second connection terminals 72, and has a tip portion on an opposite side to the second connection terminal 72, which is exposed from the corresponding through-hole 61. A material of the plurality of bumps 200 is, for example, a solder. The material of the plurality of bumps 200 is not limited to the solder, and may be, for example, gold or copper.
In the radio frequency module 1a according to Embodiment 2, as illustrated in
In the radio frequency module 1a according to Embodiment 2, the second connection terminal 72 and the bump 200 are located inside the first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2. Thus, in the same manner as the radio frequency module 1 according to Embodiment 1, it is possible to reduce the signal loss while achieving the reduction in size of the radio frequency module la.
In Embodiment 2, a part of the bump 200 is exposed from the through-hole 61. Meanwhile, for example, an entirety of the bump 200 may be exposed from the through-hole 61, as in a radio frequency module 1b illustrated in
A radio frequency module 1c according to Embodiment 3 will be described with reference to
As illustrated in
As illustrated in
Each of the plurality of second connection terminals 72A and 72B is located inside the corresponding first connection terminal 71 among the plurality of first connection terminals 71, in the plan view in the thickness direction D1 of the mounting substrate 2. A part of an outer edge of each of the four second connection terminals 72A disposed at the four corners of the mounting substrate 2 among the plurality of second connection terminals 72A and 72B overlaps with an outer edge of the corresponding first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2. On the other hand, an outer edge of each of the remaining second connection terminals 72B does not overlap with an outer edge of the corresponding first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2.
More specifically, the part of the outer edge of each of the plurality of second connection terminals 72A overlaps with a part of the outer edge of the corresponding first connection terminal 71 at a portion near the four corners of the mounting substrate 2. For example, a part of an outer edge of the second connection terminal 72A at the upper left in
Further, the diameter d21 of each of the four second connection terminals 72A is larger than the diameter d22 of each of the remaining second connection terminals 72B. Here, in a case where an external force is applied to the radio frequency module 1c, stress applied to the four second connection terminals 72A disposed at the four corners of the mounting substrate 2 becomes the largest. Therefore, by increasing the diameter d21 of the four second connection terminals 72A, it is possible to improve connection reliability with the external substrate (not illustrated). On the other hand, regarding the remaining second connection terminals 72B, the second connection terminal 72A or the second connection terminal 72B is disposed on both sides in the second direction D2 or a third direction D3, so that it is possible to reduce short-circuit between the terminals by reducing the diameter d22. Here, the second direction D2 is a direction that intersects (orthogonal) with the first direction D1 which is a thickness direction of the mounting substrate 2 and is a longitudinal direction of the mounting substrate 2. In addition, the third direction D3 is a direction orthogonal to both the first direction D1 and the second direction D2, and is a short direction of the mounting substrate 2.
The second connection terminals 72A are not limited to being disposed at all the four corners of the mounting substrate 2, and the second connection terminals 72A may be disposed at one to three corners of the four corners of the mounting substrate 2.
In the radio frequency module 1c according to Embodiment 3, the second connection terminals 72A and 72B are located inside the first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2. Thus, in the same manner as the radio frequency module 1 according to Embodiment 1, it is possible to reduce the signal loss while achieving the reduction in size of the radio frequency module 1c.
A radio frequency module 1d according to Embodiment 4 will be described with reference to
As illustrated in
As illustrated in
As illustrated in
Here, as illustrated in
In the radio frequency module 1d according to Embodiment 4, the second connection terminal 72 is located inside the first connection terminals 71C and 71D in the plan view in the thickness direction D1 of the mounting substrate 2 (see
Further, in the radio frequency module 1d according to Embodiment 4, the area S1 of the two first connection terminals 71C overlapping with the first electronic component 3A in the thickness direction D1 of the mounting substrate 2, among the plurality of first connection terminals 71C and 71D, is larger than the area S2 of the remaining first connection terminal 71D. Therefore, by connecting the first connection terminal 71C to the first electronic component 3A having the large amount of radiation heat, it is possible to improve heat radiation performance of the first electronic component 3A.
In Embodiment 4, the first connection terminal 71C is connected to the heat radiation terminal of the first electronic component 3A. Meanwhile, the first connection terminal 71C may be connected to, for example, a signal terminal of the first electronic component 3A. Thus, it is possible to reduce a signal loss, and, as a result, it is possible to reduce a characteristic deterioration of the radio frequency module 1d.
A radio frequency module 1e according to Embodiment 5 will be described with reference to
As illustrated in
As illustrated in
As illustrated in
Here, as illustrated in
In the radio frequency module 1e according to Embodiment 5, the second connection terminal 72 is located inside the first connection terminals 71E and 71F in the plan view in the thickness direction D1 of the mounting substrate 2 (see
Further, in the radio frequency module 1e according to Embodiment 5, the first connection terminal 71E has an elliptical shape in the plan view in the thickness direction D1 of the mounting substrate 2, and the two second connection terminals 72 are connected to the first connection terminal 71E. In addition, in the radio frequency module 1e according to Embodiment 5, the first connection terminal 71E is connected to the signal terminal of the first electronic component 3A. Thus, it is possible to reduce a signal loss, and, as a result, it is possible to reduce a characteristic deterioration of the radio frequency module 1e.
In Embodiment 5, the first connection terminal 71E is connected to the signal terminal of the first electronic component 3A. Meanwhile, the first connection terminal 71E may be connected to, for example, the heat radiation terminal of the first electronic component 3A. Thus, heat generated in the first electronic component 3A can be radiated to the external substrate (not illustrated) with the first connection terminal 71E and the two second connection terminals 72E interposed therebetween.
In Embodiment 5, the two second connection terminals 72 are connected to one first connection terminal 71E. Meanwhile, three or more second connection terminals 72 may be connected to one first connection terminal 71E. In short, two or more second connection terminals 72 may be connected to one first connection terminal 71E.
In a case where three or more second connection terminals 72 are connected to one first connection terminal 71, the three or more second connection terminals 72 may be arranged side by side in a line or may be arranged on a plane.
The first connection terminal 71E is not limited to the elliptical shape in the plan view in the thickness direction D1 of the mounting substrate 2, and may have a shape other than the elliptical shape.
A radio frequency module 1f according to Embodiment 6 will be described with reference to
As illustrated in
As illustrated in
As illustrated in
Here, as illustrated in
In the radio frequency module 1f according to Embodiment 6, the second connection terminals 72G and 72H are located inside the first connection terminals 71G and 71H in the plan view in the thickness direction D1 of the mounting substrate 2 (see
Further, in the radio frequency module 1f according to Embodiment 6, each of the first connection terminal 71G and the second connection terminal 72G connected to the first connection terminal 71G has an elliptical shape in the plan view in the thickness direction D1 of the mounting substrate 2. In the radio frequency module 1f according to Embodiment 6, the first connection terminal 71G is connected to the signal terminal of the first electronic component 3A. Thus, it is possible to reduce a signal loss, and, as a result, it is possible to reduce a characteristic deterioration of the radio frequency module 1f.
In Embodiment 6, the first connection terminal 71G is connected to the signal terminal of the first electronic component 3A. Meanwhile, the first connection terminal 71G may be connected to, for example, the heat radiation terminal of the first electronic component 3A. Thus, heat generated in the first electronic component 3A can be radiated to the external substrate (not illustrated) with the first connection terminal 71G and the second connection terminal 72G interposed therebetween.
A radio frequency module 1g according to Embodiment 7 will be described with reference to
As illustrated in
As illustrated in
A shape of each of the plurality of first connection terminals 71I and 71J is a columnar shape (for example, a cylindrical shape). Further, a shape of each of the plurality of second connection terminals 721 and 72J is a columnar shape (for example, a cylindrical shape). In addition, in the plan view in the thickness direction D1 of the mounting substrate 2, an area S11 of each of the plurality of first connection terminals 71I and 71J is larger than an area S22 of each of the plurality of second connection terminals 721 and 72J. Further, the first connection terminal 711, which is one of the plurality of first connection terminals 711 and 71J, and the second connection terminal 721, which is one of the plurality of second connection terminals 721 and 72J, are connected to each other along the second direction D2 with the long conductive layer 62 interposed therebetween. That is, in the radio frequency module 1g according to Embodiment 7, the first connection terminal 711 and the second connection terminal 72I are not directly connected. Further, in the radio frequency module 1g according to Embodiment 7, as illustrated in
In the radio frequency module 1g according to Embodiment 7, the area S11 of the first connection terminal 71I is larger than the area S22 of the second connection terminal 72I, in the plan view in the thickness direction D1 of the mounting substrate 2. In addition, the area S11 of the first connection terminal 71J is larger than the area S22 of the second connection terminal 72J, in the plan view in the thickness direction D1 of the mounting substrate 2. Thus, as compared with a case where the second connection terminals 721 and 72J are as thick as the first connection terminals 71I and 71J in the plan view in the thickness direction D1 of the mounting substrate 2, it is possible to reduce an interval G11 between two first connection terminals 71I and 71J adjacent to each other in a direction (second direction D2) intersecting with the thickness direction D1 of the mounting substrate 2, and as a result, reduction in size of the radio frequency module 1g can be achieved. Further, as compared with a case where the first connection terminals 71I and 71J are as thin as the second connection terminals 721 and 72J in the plan view in the thickness direction D1 of the mounting substrate 2, it is possible to reduce an electric resistance of the first connection terminals 711 and 71J and the second connection terminals 72I and 72J, and as a result, it is possible to reduce a signal loss. That is, with the radio frequency module 1g according to Embodiment 7, it is possible to reduce a signal loss while achieving reduction in size of the radio frequency module 1g.
Further, in the radio frequency module 1g according to Embodiment 7, an interval G22 between the two second connection terminals 721 and 72J adjacent to each other in the second direction D2 is larger than the interval G2 between the two second connection terminals 72 described in Embodiment 1. Thus, as compared with the radio frequency module 1 according to Embodiment 1, it is possible to further reduce connection failures assuming the radio frequency module 1g is mounted on the external substrate (not illustrated).
Hereinafter, Modification Examples of Embodiments 1 to 7 will be described.
The radio frequency modules 1, 1a, 1b, 1c, 1d, 1e, 1f, and 1g according to Embodiments 1 to 7 include the metal electrode layer 8. Meanwhile, the metal electrode layer 8 may be omitted.
In the radio frequency modules 1, 1a, 1b, 1c, 1d, 1e, 1f, and 1g according to Embodiments 1 to 7, the material of the resin layer 5 and the material of the resin layer 6 are different from each other. Meanwhile, the material of the resin layer 5 may be the same as the material of the resin layer 6. In this case, since a coefficient of linear expansion of the resin layer 5 and a coefficient of linear expansion of the resin layer 6 are the same, separating is less likely to occur between the resin layer 5 and the resin layer 6.
In the radio frequency module 1 according to Embodiment 1, the material of the first connection terminal 71 and the material of the second connection terminal 72 are different from each other. Meanwhile, the material of the first connection terminal 71 and the material of the second connection terminal 72 may be the same. Thus, a bonding strength between the first connection terminal 71 and the second connection terminal 72 can be increased, as compared with a case where the material of the first connection terminal 71 and the material of the second connection terminal 72 are different from each other. The same applies to the radio frequency modules 1a, 1b, 1c, 1d, 1e, 1f, and 1g according to Embodiments 2 to 7.
In the radio frequency module 1 according to Embodiment 1, the copper plating layer grown from the second main surface 22 of the mounting substrate 2 is used as the first connection terminal 71. For example, a solder layer formed at the second main surface 22 of the mounting substrate 2 may be used as the first connection terminal 71, or a pillar (for example, a copper pillar) mounted on the second main surface 22 of the mounting substrate 2 may be used as the first connection terminal 71. The same applies to the radio frequency modules 1a, 1b, 1c, 1d, 1e, 1f, and 1g according to Embodiments 2 to 7.
In the radio frequency module 1 according to Embodiment 1, the plating layer grown from the main surface 711 of the first connection terminal 71 on an opposite side to the mounting substrate 2 side is used as the second connection terminal 72. For example, the second connection terminal 72 may be formed by printing on the main surface 711 of the first connection terminal 71. The same applies to the radio frequency modules 1a, 1b, 1c, 1d, 1e, 1f, and 1g according to Embodiments 2 to 7.
Each of the transmission filter 11 and the reception filter 12 according to Embodiments 1 to 7 is not limited to a ladder filter, and may be, for example, a longitudinally coupled resonator-type surface acoustic wave filter.
In addition, the acoustic wave filter described above is an acoustic wave filter that uses a surface acoustic wave or a bulk acoustic wave, and is not limited thereto. For example, an acoustic wave filter that uses a boundary acoustic wave, a plate wave, or the like may be used.
Further, the communication device 100 according to Embodiment 1 may include any one of the radio frequency modules 1a, 1b, 1c, 1d, 1e, 1f, and 1g, instead of the radio frequency module 1.
In the present specification, “an element is disposed on a first main surface of a substrate” includes both a case where the element is directly mounted on the first main surface of the substrate and a case where the element is disposed in a space on the first main surface side between the space on the first main surface side and a space on the second main surface side separated by the substrate. That is, “the element is disposed on the first main surface of the substrate” includes a case where the element is mounted on the first main surface of the substrate with another circuit element, an electrode, or the like interposed therebetween. The element is, for example, the first electronic component 3A, and is not limited to the first electronic component 3A. The substrate is, for example, the mounting substrate 2. In a case where the substrate is the mounting substrate 2, the first main surface is the first main surface 21 and the second main surface is the second main surface 22.
In the present specification, “an element is disposed on a second main surface of a substrate” includes both a case where the element is directly mounted on the second main surface of the substrate and a case where the element is disposed in a space on the second main surface side between the space on the first main surface side and a space on the second main surface side separated by the substrate. That is, “the element is disposed on the second main surface of the substrate” includes a case where the element is mounted on the second main surface of the substrate with another circuit element, an electrode, or the like interposed therebetween. The element is, for example, the second electronic component 3B, and is not limited to the second electronic component 3B. The substrate is, for example, the mounting substrate 2. In a case where the substrate is the mounting substrate 2, the first main surface is the first main surface 21 and the second main surface is the second main surface 22.
In the present specification, “A is located inside B” means that a first region determined by an outer edge of B is included in a second region determined by an outer edge of A and the first region is smaller than the second region. A is, for example, the first connection terminal 71 in the plan view in the thickness direction D1 of the mounting substrate 2. B is, for example, the second connection terminal 72 in the plan view in the thickness direction D1 of the mounting substrate 2.
The following aspects are disclosed in the present specification.
According to a first aspect, there is provided a radio frequency module (1; 1a to 1f) includes a mounting substrate (2), a first electronic component (3A), a second electronic component (3B) and a first connection terminal (71; 71C to 71H), a second connection terminal (72; 72A, 72B; 72G, 72H), a first resin layer (5), and a second resin layer (6). The mounting substrate (2) has a first main surface (21) and a second main surface (22) facing each other. The first electronic component (3A) is disposed on the first main surface (21) of the mounting substrate (2). The second electronic component (3B) and the first connection terminal (71; 71C to 71H) are disposed on the second main surface (22) of the mounting substrate (2). The second connection terminal (72; 72A, 72B; 72G, 72H) is connected to the first connection terminal (71; 71C to 71H), and is disposed on a side of the first connection terminal (71; 71C to 71H) opposite to the mounting substrate (2) side. The first resin layer (5) covers at least a part of the second electronic component (3B), and covers at least a part of the first connection terminals (71; 71C to 71H). The second resin layer (6) is disposed on the first resin layer (5), and covers at least a part of the second connection terminals (72; 72A, 72B; 72G, 72H). The second connection terminal (72; 71A, 71B; 71G, 71H) is located inside the first connection terminal (71; 71C to 71H) in a plan view from a thickness direction (D1) of the mounting substrate (2).
In the radio frequency module (1; 1a to 1f) according to the first aspect, the first connection terminal (71; 71C to 71H) is disposed on the second main surface (22) of the mounting substrate (2), and the second connection terminal (72; 72A, 72B; 72G, 72H) is disposed on a side of the first connection terminal (71; 71C to 71H) opposite to the mounting substrate (2) side. In addition, the second connection terminal (72) is connected to the first connection terminal (71; 71C to 71H), and the second connection terminal (72; 72A, 72B; 72G, 72H) is located inside the first connection terminal (71; 71C to 71H) in a plan view in the thickness direction (D1) of the mounting substrate (2). Thus, as compared with a case where the second connection terminal (72; 72A, 72B; 72G, 72H) has the same size as the first connection terminal (71; 71C to 71H) in the plan view in the thickness direction (D1) of the mounting substrate (2), it is possible to reduce an interval (G1) between two adjacent first connection terminals (71; 71C to 71H) in a direction (second direction D2) intersecting the thickness direction (D1) of the mounting substrate (2), as a result, reduction in size of the radio frequency module (1; 1a to 1f) can be achieved. Further, as compared with a case where the first connection terminal (71; 71C to 71H) has the same size as the second connection terminal (72; 72A, 72B; 72G, 72H) in the plan view in the thickness direction (D1) of the mounting substrate (2), an electric resistances of the first connection terminal (71; 71C to 71H) and the second connection terminal (72; 72A, 72B; 72G, 72H) can be reduced, and, as a result, an increase in signal loss can be reduced. That is, with this aspect, it is possible to reduce the increase in signal loss while achieving the reduction in size of the radio frequency module (1; 1a to 1f).
According to the first aspect, the radio frequency module (1; 1a to 1d) according to a second aspect includes a plurality of first connection terminals (71; 71C, 71D), and includes a plurality of second connection terminals (72; 72A, 72B). An interval (G2) between two second connection terminals (72; 72A, 72B) adjacent to each other in a second direction (D2) among the plurality of second connection terminal (72; 72A, 72B) is larger than the interval (G1) between two first connection terminals (71C, 71D) adjacent to each other in the second direction (D2) among the plurality of first connection terminals (71; 71C, 71D). The second direction (D2) is a direction that intersects with the first direction (D1) which is a thickness direction of the mounting substrate (2).
With this aspect, as compared with a case where the interval (G1) between the two first connection terminals (71; 71C, 71D) is the same as the interval (G2) between the two second connection terminals (72; 72A, 72B), it is possible to reduce connection failures based on mounting on an external substrate.
According to the first or second aspect, in the radio frequency module (1; 1a to 1f) according to a third aspect, a length (L2) of the second connection terminal (72; 72A, 72B, 72G, 72H) is smaller than a length (L1) of the first connection terminal (71; 71C to 71H), in the thickness direction (D1) of the mounting substrate (2).
With this aspect, as compared with a case where the length (L2) of the second connection terminal (72; 72A, 72B; 72G, 72H) is equal to or larger than the length (L1) of the first connection terminal (71; 71C to 71H), a terminal strength can be improved.
According to any one of the first to third aspects, in the radio frequency module (1; 1a to 1f) according to a fourth aspect, a material of the first connection terminal (71; 71C to 71H) includes copper. A material of the second connection terminal (72; 72A, 72B; 72G, 72H) includes gold.
With this aspect, it is possible to improve adhesion with a solder, as compared with a case where the material of the second connection terminal (72; 72A, 72B; 72G, 72H) includes copper but does not include gold.
According to any one of the first to third aspects, in the radio frequency module (1; 1a to 1f) according to a fifth aspect, a material of the first connection terminal (71; 71C to 71H) is the same as a material of the second connection terminal (72; 72A, 72B; 72G, 72H).
With this aspect, as compared with a case where the material of the first connection terminal (1; 1a to 1f) and the material of the second connection terminal (72; 72A, 72B; 72G, 72H) are different from each other, it is possible to increase a bonding strength between the first connection terminal (1; 1a to 1f) and the second connection terminal (72; 72A, 72B; 72G, 72H).
According to any one of the first to fifth aspects, in the radio frequency module (1; 1a to 1f) according to a sixth aspect, a shape of each of the first connection terminal (71; 71C to 71H) and the second connection terminal (72; 72A, 72B; 72G, 72H) is a columnar shape. In the plan view in the thickness direction (D1) of the mounting substrate (2), an area (S1) of the first connection terminal (71; 71C to 71H) is larger than an area (S2) of the second connection terminal (72; 72A, 72B; 72G, 72H).
With this aspect, as compared with a case where the area (S1) of the first connection terminal (71; 71C to 71H) is the same as the area (S2) of the second connection terminal (72; 72A, 72B; 72G, 72H), it is possible to reduce an electric resistance.
According to any one of the first to sixth aspects, in the radio frequency module (1; 1a to 1d) according to a seventh aspect, a shape of each of the first connection terminal (71; 71C, 71D) and the second connection terminal (72; 72A, 72B) is a cylindrical shape. In the plan view in the thickness direction (D1) of the mounting substrate (2), a diameter (d1) of the first connection terminal (71; 71C, 71D) is larger than a diameter (d2) of the second connection terminal (72; 72A, 72B).
With this aspect, the electric resistance can be reduced, as compared with a case where the diameter (d1) of the first connection terminal (71; 71C, 71D) is the same as the diameter (d2) of the second connection terminal (72; 72A, 72B).
According to any one of the first to seventh aspects, in the radio frequency module (1; 1a to 1f) according to an eighth aspect, a main surface (31), a main surface (711), and a main surface (51) have the same distances (L1, L3, L4) from the second main surface (22) of the mounting substrate (2) in the thickness direction (D1) of the mounting substrate (2). The main surface (31) is a main surface of the second electronic component (3B) on an opposite side to the mounting substrate (2) side. The main surface (711) is a main surface of the first connection terminal (71; 71C to 71H) on an opposite side to the mounting substrate (2) side. The main surface (51) is a main surface of the first resin layer (5) on an opposite side to the mounting substrate (2) side.
With this aspect, the radio frequency module (1; 1a to 1f) can be reduced in size in the thickness direction (D1) of the mounting substrate (2).
According to any one of the first to eighth aspects, in the radio frequency module (1; 1a to 1f) according to a ninth aspect, a material of the first resin layer (5) and a material of the second resin layer (6) are different from each other.
With this aspect, for example, in a case where hardness of the first resin layer (5) is higher than hardness of the second resin layer (6), it is possible to improve coplanarity of the second connection terminals (72; 72A, 72B; 72G, H).
According to any one of the first to eighth aspects, in the radio frequency module (1; 1a to 1f) according to a tenth aspect, a material of the first resin layer (5) is the same as a material of the second resin layer (6).
With this aspect, since a coefficient of linear expansion of the first resin layer (5) and a coefficient of linear expansion of the second resin layer (6) are the same, separating is less likely to occur between the first resin layer (5) and the second resin layer (6).
According to any one of the first to tenth aspects, the radio frequency module (1a; 1b) according to an eleventh aspect further includes a bump (200). The bump (200) is disposed on a side of the second connection terminal (72) opposite to the first connection terminal (71) side. The bump (200) is located inside the first connection terminal (71) in the plan view in the thickness direction (D1) of the mounting substrate (2).
With this aspect, it is possible to reduce an increase in signal loss while achieving reduction in size of the radio frequency module (1a; 1b).
According to a twelfth aspect, there is provided a radio frequency module (1; 1a to 1g) includes a mounting substrate (2), a first electronic component (3A), a second electronic component (3B) and a first connection terminal (71; 71C to 71J), a second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J), a first resin layer (5), and a second resin layer (6). The mounting substrate (2) has a first main surface (21) and a second main surface (22) facing each other. The first electronic component (3A) is disposed on the first main surface (21) of the mounting substrate (2). The second electronic component (3B) and the first connection terminal (71; 71C to 71J) are disposed on a second main surface (22) of the mounting substrate (2). The second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J) is connected to the first connection terminal (71; 71C to 71J), and is disposed on a side of the first connection terminal (71; 71C to 71J) opposite to the mounting substrate (2) side. The first resin layer (5) covers at least a part of the second electronic component (3B), and covers at least a part of the first connection terminals (71; 71C to 71J). The second resin layer (6) is disposed on the first resin layer (5), and covers at least a part of the second connection terminals (72; 72A, 72B; 72G, 72H; 721, 72J). A shape of each of the first connection terminal (71; 71C to 71J) and the second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J) is a columnar shape. In a plan view in a thickness direction (D1) of the mounting substrate (2), an area (S11) of the first connection terminal (71; 71C to 71J) is larger than an area (S12) of the second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J).
With this aspect, it is possible to reduce an increase in signal loss while achieving reduction in size of the radio frequency module (1; 1a to 1g).
According to a thirteenth aspect, there is provided a communication device (100) including the radio frequency module (1; 1a to 1g) according to any one of the first to twelfth aspects, and a signal processing circuit (20). The signal processing circuit (20) is connected to the radio frequency module (1; 1a to 1g).
With this aspect, it is possible to reduce an increase in signal loss while achieving reduction in size of the radio frequency module (1; 1a to 1g).
According to a fourteenth aspect, there is provided a method of manufacturing a radio frequency module (1; 1a to 1f) includes a step of preparing a mounting substrate (2) having a first main surface (21) and a second main surface (22) facing each other. The method of manufacturing the radio frequency module (1; 1a to 1f) further includes a step of forming a metal member (700) on the second main surface (22) of the mounting substrate (2), and a step of disposing an electronic component (3B) on the second main surface (22) of the mounting substrate (2). The method of manufacturing the radio frequency module (1; 1a to 1f) further includes a step of forming a first resin member (500) on the second main surface (22) side of the mounting substrate (2) to cover at least a part of the electronic component (3B). The method of manufacturing the radio frequency module (1; 1a to 1f) further includes a step of forming a first resin layer (5) by polishing a main surface (501) of the first resin member (500) on an opposite side to the mounting substrate (2) side such that a main surface (711) of the first connection terminal (71; 71C to 71H) formed from the metal member (700), on an opposite side to the mounting substrate (2) side is exposed. The method of manufacturing the radio frequency module (1; 1a to 1f) further includes a step of forming a second resin member (600) on a side of the first resin layer (5) opposite to the mounting substrate (2) side, and a step of forming a second resin layer (6) by forming a through-hole (61) at a part of the second resin member (600) facing the first connection terminal (71; 71C to 71H) in a thickness direction (D1) of the mounting substrate (2). The method of manufacturing the radio frequency module (1; 1a to 1f) further includes a step of forming a second connection terminal (72; 72A, 72B; 72G, 72H) in the through-hole (61) of the second resin layer (6). The second connection terminal (72; 72A, 72B; 72G, 72H) is located inside the first connection terminal (71; 71C to 71H) in a plan view in the thickness direction (D1) of the mounting substrate (2).
With this aspect, it is possible to reduce an increase in signal loss while achieving reduction in size of the radio frequency module (1; 1a to 1f).
According to a fifteenth aspect, there is provided a method of manufacturing a radio frequency module (1; 1a to 1g) includes a step of preparing a mounting substrate (2) having a first main surface (21) and a second main surface (22) facing each other. The method of manufacturing the radio frequency module (1; 1a to 1g) further includes a step of forming a metal member (700) on the second main surface (22) of the mounting substrate (2), and a step of disposing an electronic component (3B) on the second main surface (22) of the mounting substrate (2). The method of manufacturing the radio frequency module (1; 1a to 1g) further includes a step of forming a first resin member (500) on the second main surface (22) side of the mounting substrate (2) to cover at least a part of the electronic component (3B). The method of manufacturing the radio frequency module (1; 1a to 1g) further includes a step of forming a first resin layer (5) by polishing a main surface (501) of the first resin member (500) on an opposite side to the mounting substrate (2) side such that a main surface (711) of the first connection terminal (71; 71C to 71H) formed from the metal member (700), on an opposite side to the mounting substrate (2) side is exposed. The method of manufacturing the radio frequency module (1; 1a to 1g) further includes a step of forming a second resin member (600) on a side of the first resin layer (5) opposite to the mounting substrate (2) side, and a step of forming a second resin layer (6) by forming a through-hole (61) at a part of the second resin member (600) facing the first connection terminal (71; 71C to 71J) in the thickness direction (D1) of the mounting substrate (2). The method of manufacturing the radio frequency module (1; 1a to 1g) further includes a step of forming a second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J) in the through- hole (61) of the second resin layer (6). A shape of each of the first connection terminal (71; 71C to 71J) and the second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J) is a columnar shape. In a plan view in the thickness direction (D1) of the mounting substrate (2), an area of the first connection terminal (71; 71C to 71J) is larger than an area of the second connection terminal (72; 72A, 72B; 72G, 72H; 721, 72J).
With this aspect, it is possible to reduce an increase in signal loss while achieving reduction in size of the radio frequency module (1; 1a to 1g).
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-136233 | Aug 2021 | JP | national |
This is a continuation application of PCT/JP2022/029901, filed on Aug. 4, 2022, designating the United States of America, which is based on and claims priority to Japanese Patent Application No. JP 2021-136233, filed on Aug. 24, 2021. The entire contents of the above-identified applications, including the specifications, drawings and claims, are incorporated herein by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2022/029901 | Aug 2022 | WO |
| Child | 18583970 | US |
