The present disclosure contains subject matter related to that disclosed in International Patent Application PCT/JP 2014-073653 filed in the Japan Patent Office on Sep. 8, 2014, the entire contents of which are hereby incorporated by reference.
Field of the Invention
The embodiments disclosed herein relate to a robot system and a carrying method.
Description of the Related Art
In related art, a robot system having a horizontal articulated robot provided in a space formed within a local clean apparatus is known. The horizontal articulated robot carries substrates such as wafers into and out of a cassette for housing substrates or a processing apparatus used for a semiconductor manufacturing process.
Further, as the robot system, a substrate carrier system combining a horizontal articulated robot without an elevating mechanism with a cassette having the elevating mechanism is known (for example, see JP-A-8-274140).
According to one aspect of the embodiments, a robot system includes a robot, a holder, and circuitry. The robot includes a first hand, a second hand, an arm mechanism, and an elevator. The first hand is to hold a substrate. The second hand is to hold the substrate. The arm mechanism supports the first hand and the second hand to provide a height difference between the first hand and the secondhand in a height direction of the robot. The elevator is to move the arm mechanism in the height direction within a moving range larger than the height difference. Both the first hand and the second hand put the substrate in the holder. The circuitry is to control the robot to move the arm mechanism in the height direction by the elevator to pass the substrate from the first hand to the second hand via the holder.
The embodiments of a robot system and a carrying method disclosed in this application will be explained in details with reference to the accompanying drawings.
First, the carrying method according to the embodiment will be explained in
Further, the Z-axis directions shown in the drawing may be referred to as height directions, and the positive direction of the Z-axis with respect to an object may be referred to as “upside” and the negative direction may be referred to as “downside”.
The carrying method shown in
The arm mechanism 12 supports the pair of hands 11 that respectively hold the substrate W at different heights. In
The robot has an elevator (not shown) that moves up and down the arm mechanism 12 in an elevation range (a moving range) larger than the height difference between the pair of hands 11. The elevator moves up and down the arm mechanism 12 in a longer distance than the distance B along the Z-axis directions illustrated in the drawing (see an arrow 200 in
The arm mechanism 12 is moved up and down in the above described manner, and thereby, a range in which ranges reached by the lower hand 11a and the upper hand 11b in the height direction overlap may be provided (see “overlap range dp” in
The holder 50 holds the substrate W in the overlap range dp. Then, the robot hands over the substrate W between the pair of hands 11 via the holder 50 while moving up and down the arm mechanism 12.
As below, the handover of the substrate W between the pair of hands 11 in the carrying method according to the embodiment will be explained more specifically. The case where the substrate W is handed over from the lower hand 11a to the upper hand 11b will be explained below as an example.
As shown in
Subsequently, the upper hand 11b carries the substrate W out of the holder 50 while the arm mechanism 12 moves in the negative direction of the Z-axis shown in the drawing, and carries the substrate W to a carrying destination reachable by the upper hand lib (see step S3 in
Further, in
As described above, in the carrying method according to the embodiment, the handover of the substrate W between the pair of hands 11 is performed via the holder 50. Thereby, the elevation range of the elevator can be made smaller than an elevation range required for the handover without being performed via the holder 50. In other words, the carrying range of the substrate W can be expanded without increase of the elevation range of the elevator compared to the case not via the holder 50. Therefore, according to the carrying method of the embodiment, space efficiency of the facilities may increase.
In
As long as the pair of hands 11 may hold the substrate W at the distance B in the height directions, any positional relationship can be determined between the hands in the XY-plane directions in the drawing. In this case, a turning mechanism that turns the arm mechanism 12 about an axis parallel to the height directions may be provided.
Next, a robot system 1 according to the embodiment will be explained.
Accordingly, directions along the XY-plane refer to “horizontal directions” and the positive direction of the Z-axis refers to “height direction”. The orthogonal coordinate system may be shown in the other drawings used for the following explanation. Further, the positive direction of the Z-axis with respect to an object may be referred to as “upside” and the negative direction may be referred to as “downside”. Furthermore, as below, the positive direction of the X-axis is determined as “forward” and the positive direction of the Y-axis is determined as “leftward”.
In
As shown in
The housing 20 is the so-called EFEM (Equipment Front End Module) that forms a downflow of clean air via a filter unit (not shown) provided on the upside of the top surface and keeps the interior in a high clean level condition. Further, a lower surface of a bottom wall part 23 is provided with a predetermined clearance from the floor surface via legs (not shown).
The robot 10 includes the pair of hands 11 that can respectively hold a wafer (corresponding to “substrate” in
The pair of hands 11 are supported by the arm mechanism 12 at the distance B, which will be described later, between each other in the height directions. In
The trunk part 13 is provided to be movable up and down with respect to the bottom wall part 23 of the housing 20 and turnable in the horizontal directions. In other words, the robot 10 is a horizontal articulated robot including two elevatable arms that turn in the horizontal directions. The details of the robot 10 will be described later using
Further, in the housing 20, a mover 14 that movably supports the robot 10 in the Y-axis directions shown in the drawing. Furthermore, the holder 50 is provided on the inner wall or close to the inner wall of the housing 20 in the -axis directions shown in the drawing.
In the embodiment, the case where the holder 50 is a pre-aligner apparatus that centers the wafer W and the holder 50 is provided on an inner wall 24 of the housing 20 located on the positive direction side of the Y-axis shown in the drawing is shown as an example. However, the holder 50 may be provided apart from the inner wall 24 instead.
The pre-aligner apparatus (holder 50) has a table 51 on which the wafer W is mounted at the heights that can be respectively reached by the pair of hands 11. The table 51 is provided rotatably about an axis AXr parallel to the Z-axis shown in the drawing.
As described above, the holder 50 is provided closer to the side wall of the housing 20 in the movement direction of the robot 10, and thereby, interferences of the pair of hands 11 and the arm mechanism 12 moved by the mover 14 with the holder 50 may be avoided.
The holder 50 may hold the wafer W at the heights that can be respectively reached by the pair of hands 11. Therefore, the holder 50 may be a buffer that temporarily holds the wafer W or a temperature controller that heats or cools the wafer W, and the substrate carrier 2 may have a plurality of the holders 50.
The substrate feeder 3 includes the hoops 30 for housing a plurality of wafers W in multiple stages in the height directions, supports 31 that support the hoops 30, and hoop openers (not shown) that open and close lid members of the hoops 30 so that the wafers W may be ejected into the housing 20.
The substrate processor 4 includes the processing chambers 40 having stages 41 on which the wafers W to be processed are mounted inside. Here, processors (not shown) that perform predetermined processing on the wafers W are provided within the processing chambers 40.
The processors may include e.g. a sputtering apparatus, CVD (Chemical Vapor Deposition) apparatus, etching apparatus, aching apparatus, and cleansing apparatus. The processors cited here are just examples.
Further, the processing chamber 40 includes a carrying window 42 communicating with the housing 20. The carrying window 42 is used for carrying in of the wafer W from the housing 20 to the processing chamber 40 and carrying out of the wafer W from the processing chamber 40 to the housing 20. The carrying window 42 is closed by a shutter (not shown).
The processing chambers 40 include one having the stage 41 and the carrying window 42 at the height that can be reached by the upper hand 11b. In
Here, the case where the substrate feeder 3 and the substrate processor 4 are provided to be opposed is explained as an example. However, for example, the substrate feeder 3 and the substrate processor 4 may be provided in an arbitrary position relationship such that the substrate feeder and the substrate processor are provided side by side on one side surface of the housing 20 or respectively provided on two side surfaces not to be opposed instead.
Further, the robot system 1 includes a control apparatus 60 outside of the housing 20. The control apparatus 60 includes various controllers, arithmetic processing units, memory devices, etc., and is connected to various apparatuses such as the robot 10 and the holder 50 to communicate information. The details of the control apparatus 60 will be described later using
Thereby, for example, the robot 10 carries the wafer W before processing from the hoop 30 to the holder 50 (pre-aligner apparatus) using the lower hand 11a and carries the wafer W after centering from the holder 50 to the processing chamber 40h using the upper hand lib.
Here, the control apparatus 60 having the single casing is shown, however, the control apparatus may include a plurality of casings respectively associated with various apparatuses to control. Further, the control apparatus 60 may be provided within the housing 20.
As described above, in the robot system 1 according to the embodiment, in the carrying route of the wafers W, for example, an apparatus such as the pre-aligner apparatus that the robot system 1 originally has is also used as the holder 50.
Thereby, the carrying range of the wafers W in the height directions can be simply and easily expanded without changes in the facility including addition of new apparatuses and increase of an elevation range of an elevating mechanism, which will be described later, of the trunk part 13.
Therefore, according to the robot system 1 of the embodiment, the carrying range of the wafers W covering the long stroke of the elevating mechanism in the case without the holder 50 may be easily achieved by the simple configuration.
Next, a configuration of the robot 10 according to the embodiment will be explained using
As shown in
The base 13a has a turning mechanism and an elevating mechanism (not shown), and supports the arm base 13b to be turnable about an axis S in the vertical directions (see a double-headed arrow about the axis S in
The arm mechanism 12 includes a pair of horizontal arms provided as dual arms and each arm has a first arm 12a and a second arm 12b. As below, of the dual arms of the arm mechanism 12, one corresponding to the right arm will be explained as an example and the duplicated explanation of the other corresponding to the left arm will be omitted.
As shown in
The lower hand 11a has a proximal end portion coupled to a distal end portion of the second arm 12b to be rotatable about an axis a3 (see a double-headed arrow about the axis a3 in
The upper hand 11b is supported by the arm part 12 similarly to the lower hand 11a, and moves along the axis line located on the upside of the axis AXL, for example. As below, the details of the pair of hands 11 including the point will be explained with
As shown in
Specifically, the supporting portion 11ba has brackets 11bb, 11bd and a coupling member 11bc extending in the vertical directions. The proximal end portion of the bracket 11bb is provided rotatably about the axis b3 in the distal end portion of the second arm 12b.
The coupling member 11bc is attached to the distal end portion of the bracket 11bb at a predetermined distance from the axis AXL in the positive direction of the Y-axis shown in the drawing. The proximal end portion of the bracket 11bd is attached to the other end portion of the coupling member 11bc. Then, the bracket 11bd holds the plate 111 in the distal end portion. The plate 111 is a member as a base portion of the upper hand lib.
Further, the lower hand 11a has a plate 111 and a supporting portion 11aa that supports the plate 111. The supporting portion 11aa is rotatable about the axis a3 in the distal end portion of the second arm 12b. Then, the lower hand 11a moves forward and backward on the axis AXL (see an arrow 204 in
The engaging portions 112 are members that engage and hold the wafer W on the plate 111.
Note that the number of engaging portions 112 is optional, but may be four or more. Further,
As described above, in the robot 10 according to the embodiment, with respect to the pair of horizontal arms (arm mechanism 12) respectively provided at the same height, the distance B in the height directions is provided between the pair of hands 11 by the coupling member 11bc extending in the vertical directions.
Thereby, the members forming the arm mechanism 12 and the pair of hands 11 can be used in common with each other and one of the dual arms of the arm mechanism 12 can be manufactured with slight alterations of the other. Therefore, the manufacturing cost of the robot 10 may be reduced.
Further, in the pair of hands 11 according to the embodiment, the coupling member 11bc is provided at the predetermined distance from the axis AXL in the positive direction of the Y-axis shown in the drawing. Thereby, interferences of the wafer W held by the lower hand 11a with the coupling member 11bc can be avoided and the respective arms of the arm mechanism 12 can be provided close to each other. The robot 10 is thus downsized.
Next, a configuration of the robot system 1 according to the embodiment will be explained with
As shown in
The acquirer 611 acquires information containing positions and operation statuses of various apparatuses including the pair of hands 11 of the substrate carrier 2. Specifically, the acquirer 611 may acquire amount of expansion and contraction of the arm mechanism 12 and the elevation position and the turning position of the arm base 13b of the robot 10, the movement position of the robot 10 by the mover 14, and the operation status of the holder 50 etc.
The designator 612 sequentially designates the operations of the various apparatuses of the substrate carrier 2 from the information acquired in the acquirer 611. The designation is performed based on the carrying information 621. The carrying information 621 is information containing operation sequences of the various apparatuses including the substrate carrier 2 for carrying the wafers W and stored in the memory 62 in advance.
The command generator 613 generates operation signals for operating the various apparatus including the robot 10, the mover 14, and the holder 50 shown in
For example, the command generator 613 generates commands to the various apparatuses, such as for carrying the wafer W with the lower hand 11a shown in
The memory 62 is a storage device such as a hard disc drive or non-volatile memory and stores the carrying information 621. The contents of the carrying information 621 have been already explained and the description is omitted here.
Note that, in the explanation with
Now, when the distance B between the pair of hands 11 is determined based on the height of the carrying destination of the wafer W such as the stage 41h of the processing chamber 40h and the table 51 (see
First, the elevation range of the pair of hands 11 in the embodiment is explained. The pair of hands 11 move up and down with a stroke longer than the distance B between the pair of hands 11 (see “elevation distance Z” in
Thereby, “overlap range dp” in which the elevation ranges of the lower hand 11a and the upper hand 11b overlap may be provided. The holder 50 holds the wafer W in the overlap range dp.
Therefore, the pair of hands 11 can carry the wafer W to an arbitrary height via the holder 50 in the range between the lower hand 11a located in the lowermost position and the upper hand 11b located in the uppermost position (see “carrying range A” in
Further, as shown in
Z=A−B (1)
On the other hand, in the comparative example, when the wafer W is carried to an arbitrary height in the carrying range A by the respective pair of hands 11′, the following expression (2) holds among an elevation distance Z′ of the pair of hands 11′, the difference between the maximum height and the minimum height of the carrying destination of the wafer W (the distance of the carrying range A), and the distance B.
Z′=A+B (2)
Therefore, according to the robot system 1 of the embodiment, the elevation stroke of the robot 10 (see
As shown in
In this case, the space corresponding to the outside of the carrying range A of the movement range of the pair of hands 11′ becomes a space unavailable effectively for placement of equipment, the so-called dead space.
In other words, according to the robot system 1 of the embodiment, the wafer W can be carried without the dead space in the height directions. Therefore, space efficiency of the facility including downsizing of the housing 20 (see
Now, according to the embodiment, even in the case where the carrying range A of the wafer W and the position of the holder 50 are determined in advance, the distance B between the pair of hands 11 may be easily determined. As below, the point will be explained in detail.
First, “access allowance” according to the embodiment is explained. The access allowance refers to a distance in the upward and downward directions for the access operations of the respective pair of hands 11 to the wafer W. Specifically, in the embodiment, the respective pair of hands 11 move upward from immediately below the wafer W to hold to a fixed distance and mounts and holds the wafer in the middle of the movement.
Therefore, a distance in which the pair of hands 11 move is necessary in the upward and downward directions of the above described wafer W to be held.
The above described access allowance is changed as appropriate depending on the holding form of the wafer W by the pair of hands 11. For example, in the case where the respective pair of hands 11 suction and hold the wafer W from upside, it is not necessary to provide the allowance distance.
Subsequently, the method for determining the distance B between the pair of hands 11 is explained. First, assumingly, the access allowance on the upside of the carrying destination at the maximum height (see “carrying point cp1” in
Further, assumingly, the access allowance on the downside of the carrying destination at the minimum height (see “carrying point cp2” in
In this case, the distance B between the pair of hands 11 is determined by the following expression (3). Note that
B=min[(X+C1),(Y+C2)] (3)
As described above, according to the robot system 1 of the embodiment, the distance B between the pair of hands 11 may be easily set. Further, in this case, the elevation distance Z may be minimized with respect to the predetermined carrying range A of the wafer W and position of the holder 50.
Next, an example of a carrying method of the wafer W according to the embodiment will be explained with
In
First, as shown in
Subsequently, as shown in
It is preferable to move the upper hand lib downward concurrently with the processing of the holder 50 including the above described centering of the wafer W. Thereby, the time taken for carrying the wafer W can be substantially shortened. Therefore, throughput of the wafer W may be improved.
As shown in
Here, the case where the wafer W is handed over from the lower hand 11a to the upper hand 11b via the holder 50 is explained as an example. However, the wafer W may be handed over from the upper hand 11b to the lower hand 11a via the holder 50 instead.
Next, the processing procedures when the robot system 1 according to the embodiment performs handover of the wafer W between the pair of hands 11 will be explained with
As shown in
Subsequently, the holder 50 performs predetermined processing on the wafer W (step S103) and the arm part 12 moves up or down (falls) (step S104). Step S103 and step S104 may be performed at the same time. In the case where the holder 50 is e.g. a buffer that holds the wafer W, step S103 may be omitted.
Then, the other (upper hand 11b) of the pair of hands 11 carries the wafer W out of the holder 50 (step S105) and carries the wafer W to a position that can be reached by the other of the pair of hands 11 (step S106), and the processing is ended.
As described above, a robot system according to an aspect of the embodiments includes a robot, a holder, and a control apparatus. The robot has arm mechanism supporting a pair of hands that can respectively hold a substrate at different heights and an elevator that moves up and down the arm mechanism in an elevation range larger than a difference between the heights of the hands.
The holder holds the substrate in an overlap range in which ranges reached by the hands overlap. The control apparatus performs control of handover of the substrate from one to the other of the hands via the holder while moving up and down the arm mechanism.
As described above, in the robot system according to the embodiment, the substrate is handed over between the pair of hands via the holder. Thereby, the elevation range of the elevator can be made smaller than an elevation range required for the handover without being performed via the holder. In other words, the carrying range of the substrate W can be expanded without increase of the elevation range of the elevator compared to the case not via the holder. Therefore, according to the robot system of the embodiment, space efficiency of the apparatus may be improved.
Note that, in the above described embodiments, the dual-arm robot is explained as an example, however, the embodiments may be applied to a multi-arm robot having two or more arms. Alternatively, a pair of hands may be provided in the distal end portion of one arm.
In the above described embodiments, the case where the respective pair of hands move along axis lines parallel to each other is explained as an example. However, as long as the pair of hands are at the different heights from each other, the respective hands may move along axis lines in different directions.
The above described embodiments are explained based on the case where one of pair of hands mounts or engages the substrate, while the other one of pair of hands holds the substrate. However, the pair of hands may hold the substrate in alternative manner such as gripping the substrate or chucking the substrate from above.
Still further, the above described embodiments are explained based on the case where the carrying destination of the substrate in the uppermost position is the stage of the processing chamber and the carrying destination (carrying source) in the lowermost position is the lowermost stage of the hoop is explained as an example. However, the carrying destination and the carrying source of the substrate may be determined in arbitrary locations in the range reached by the pair of hands instead.
In the above described embodiments, the housing having the nearly rectangular parallelepiped shape is explained as an example. However, as long as the housing has side walls, for example, an arbitrary shape such as a polygonal column shape or cylindrical shape may be employed.
In the above described embodiments, the case where the holder is fixedly provided is explained as an example. However, the holder may move up and down in the height directions by an elevating mechanism instead. In this case, the elevation range of the base and the distance between the pair of hands are determined based on the height of the holder (substrate) when the substrate is carried in and out. In this manner, the time taken for carrying the substrate may be further shortened.
Additional effects and modified examples may be easily derived by those skilled in the art. Accordingly, the wider aspect of the embodiments is not limited to the above shown and described particular details and representative embodiments. Therefore, various changes can be made without departing from the sprit or scope of the appended claims or the equivalents thereof.
It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.
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Number | Date | Country |
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Entry |
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Japanese Office Action for corresponding JP Application No. 2016-547266, dated Oct. 10, 2017 (w/ English machine translation). |
International Search Report for corresponding International Application No. PCT/JP2014/073653, dated Nov. 25, 2014. |
Number | Date | Country | |
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20170178938 A1 | Jun 2017 | US |
Number | Date | Country | |
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Parent | PCT/JP2014/073653 | Sep 2014 | US |
Child | 15451411 | US |