The present invention relates to a new and useful sputter magnetron assembly for use in rotatable magnetron sputtering target material onto a substrate.
In rotatable magnetron plasma sputtering, it is known to provide a stationary magnet and a target cathode in the form of a cylindrical tube that surrounds the stationary magnet bar. However, as explained in US published application US 2006/0000705 A1, one problem with then existing target cathode structures is that the targets (generally target electrode tubes) don't wear uniformly along their lengths. There is increased erosion near the ends of the target electrode tubes, and less erosion in the center. The solution to that problem disclosed by the '705 published application is to oscillate the magnet bar axially within the target electrode tube. A framework supports the magnet bar against rotation within the target electrode tube, and a mechanism is provided for oscillating the magnet bar axially within the target electrode tube.
The present invention provides a new and useful sputter magnetron assembly that addresses the issue of uneven wear of the target electrode tube in a different way and with different operating principles than the approach of US published application US 2006/0000705 A1. Moreover, the principles of the present invention provide for improved sputter deposition over the '705 published application.
According to the principles of the present invention, a sputter magnetron assembly for use in magnetron sputtering target material onto a substrate comprises
In a preferred embodiment, the target electrode tube is coupled with a feedthrough that extends about the longitudinal central axis and is supported for rotation about the longitudinal central axis, in a manner such that the target electrode tube rotates with the feedthrough about the longitudinal central axis, and wherein the target electrode tube extends through the feedthrough and can move axially relative to the feedthrough as the target electrode tube and the feedthrough are rotated about the longitudinal central axis.
In addition, the coupling between the target electrode tube and the feedthrough is located at least partially in a vacuum chamber area that needs to be sealed from the atmosphere while enabling the target electrode tube to be rotated with the feedthrough and moved axially relative to the feedthrough. In accordance with the present invention, the coupling between the feedthrough and the target electrode tube is configured to seal the vacuum chamber area from the atmosphere.
Other features of the present invention will become further apparent from the following detailed description and the accompanying drawings.
As discussed above, the present invention relates to a new and useful sputter magnetron assembly for use in rotatable magnetron sputtering. The following detailed description relates to a preferred sputter magnetron assembly according to the principles of the present invention, and from that description the manner in which the principles of the invention can be implemented in various sputter magnetron assemblies will be clear to those in the art.
The magnet bar 108 is supported in target electrode tube 104 by magnet bar support 112 and is held stationary within the target electrode tube 104 (e.g. by a magnet bar support shaft 109), and a coolant fluid (e.g. water) is circulated through the tube to keep target electrode tube 104 and target material 106 relatively cool. The foregoing general principles of a rotatable sputter magnetron assembly are known to those in the art and should not require further explanation.
In the sputter magnetron assembly 100 of the present invention, the target electrode tube 104 extends longitudinally and has a longitudinal central axis 114. Magnet bar 108 is held stationary within the target electrode tube 104 and generates the plasma confining magnetic field adjacent target material 106.
In accordance with the principles of the present invention, the target electrode tube 104 is supported for rotation about its longitudinal central axis 114 and for axial movement along its longitudinal central axis 114, so that wear of the target material 106 can be controlled by moving the target electrode tube 104 both rotationally and axially (i.e. in the direction of its longitudinal central axis 114 during magnetron sputtering of the target material. Moreover, the target electrode tube 104 is coupled with the feedthrough 118 in the manner described below.
Specifically, the target electrode tube 104 is coupled with a target tube support shaft 116. The target tube support shaft 116 is coaxial with the longitudinal central axis 114, and extends axially through a rotatably supported feedthrough 118. The target tube support shaft 116 is coupled with the feedthrough 118 in a manner such that the support shaft 116 can be rotated about the longitudinal axis 114 (e.g. by a motor 122 that drives a timing pulley 124 by means of a timing belt 126). In one configuration, a motor mount plate 120 could be joined to the target tube support shaft 116 through a bearing connection capable of transmitting thrust loads, and the axial movement of the target tube support shaft 116 (and in turn the target electrode tube 104) could be achieved by moving the motor mounting plate 120 in the direction of the longitudinal central axis 114. In another configuration, the motor mounting plate 120 could remain stationary while the target tube support shaft 116 is independently moved in the direction of the longitudinal central axis 114. Those skilled in the art will see that there are multiple ways to achieve this motion. When the support shaft 116 is rotated, it rotates the feedthrough 118, and rotates the target electrode tube 104 about the longitudinal central axis 114. In addition, the target tube support shaft 116 can move axially through the feedthrough 118, so that the target electrode tube 104 can be moved axially relative to the stationary magnet 108. In the illustrated example, the rotatable feedthrough 118 is fixed to a member 119 that has internal splines that engage external splines on the target tube support shaft 116, so that the target tube support shaft 116 and the target electrode tube 104 can be rotated together about the longitudinal central axis 114. In addition, the engagement between the internal splines on the rotatable feedthrough 118 and the external splines on the target tube support shaft 116 enables the target tube support shaft 116 and the target electrode tube 104 to be moved axially relative to the magnet bar 108 (e.g. the motor mount plate 120 can be axially indexed asynchronously to rotation of the target tube 104).
As described above, the target electrode assembly 101 is located in a vacuum chamber (in the figures, a wall 130 is illustrated that forms part of the vacuum chamber, and the vacuum and atmosphere sides of the vacuum chamber are shown in
Accordingly, the foregoing disclosure provides a new and useful rotatable sputter magnetron assembly that enables a target electrode tube to both rotate about and move axially relative to a stationary magnet, to enable wear of the target electrode tube to be made more even. Axially moving the target electrode tube while holding the magnet bar stationary holds the sputter plasma stationary over the substrate. This has several advantages over the technique of the published '705 application described above: 1) By holding the plasma stationary over the substrate, uniformity of deposition is improved. When the magnet bar is moved as in the published '705 application, this causes the sputter deposition to move and can detrimentally affect uniformity. 2) Because the plasma does not move, the cathode target can be made shorter relative to the substrate. When the magnet bar is moved as in the published '705 application, the target electrode tube must be made sufficiently long such that any uniformity variances due to the moving magnet bar are kept away from the substrate. 3) By enabling a shorter target electrode tube, smaller, more economical vacuum chambers can be used and target electrode tubes are made less expensively.
With the foregoing disclosure in mind, the manner in which the principles of the present invention can be used to form various types of sputter magetron assemblies will be apparent to those in the art.
This application is related to and claims priority from provisional application Ser. No. 60/942,986, filed Jun. 8, 2007, which provisional application is incorporated by reference herein.
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/US2008/066145 | 6/6/2008 | WO | 00 | 1/18/2010 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2008/154397 | 12/18/2008 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4904362 | Gaertner et al. | Feb 1990 | A |
5200049 | Stevenson et al. | Apr 1993 | A |
6488824 | Hollars et al. | Dec 2002 | B1 |
7993496 | Hartig et al. | Aug 2011 | B2 |
20060000705 | Hartig et al. | Jan 2006 | A1 |
20110192715 | Weichart | Aug 2011 | A1 |
Number | Date | Country |
---|---|---|
59013068 | Jan 1984 | JP |
01112199 | May 1989 | JP |
03262308 | Oct 1991 | JP |
Number | Date | Country | |
---|---|---|---|
20100155226 A1 | Jun 2010 | US |
Number | Date | Country | |
---|---|---|---|
60942986 | Jun 2007 | US |