Patent Application
20140083652
The present invention relates to a sealed casing provided with a cooling device for a heat-generating body which is housed inside a container which forms a sealed space.
A device such as a server which needs to operate in various environments needs to be made a structure which is provided with sealability. However, when the device itself is made a sealed structure, it becomes impossible to radiate heat of a heat-generating body which generates high heat such as a CPU (Central Processing Unit) installed inside the device. Therefore, there was a problem that a temperature inside the device rises and an erroneous operation is caused.
Accordingly, in patent document 1 (Japanese Unexamined Patent Application Publication No. 2002-181437), a cooling device which cools heat which a heat-generating part installed inside the cooling device generates by a heat radiator which is installed on an outer surface of a casing is disclosed. This related cooling device is made a structure which, by using ebullient cooling utilizing phase change, conducts the heat generated by the heat-generating part installed inside the device to the heat radiator installed outside the casing.
The cooling device described in patent document 1 installs various parts inside the casing, and in case they are replaced due to a failure or an inspection, the casing of the entire device needs to be removed. Also, a condensing unit is installed adjacent to the outer surface of the casing, and in order to maintain sealability between the condensing unit and an ebullient unit, a connection between the heat-generating part and the ebullient unit needed to be removed.
However, when the connection between the heat-generating part and the ebullient unit is removed each time the casing is removed, in case an enough thermal connection is not made between both of them, thermal resistance between a heat-generating body and the ebullient unit rises. As a result, there was a problem that cooling performance deteriorates each time maintenance is performed.
An object of the present invention is to provide a sealed casing which solves the problem mentioned above.
A sealed casing according to the present invention includes a container provided with a plurality of openings and housing at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.
[
[
[
[
[
[
[
[
In the following, desirable modes for carrying out the present invention will be explained using drawings. However, in exemplary embodiments described below, although technically desirable limitations are made to carry out the present invention, the scope of the invention is not limited to the following.
[The first exemplary embodiment] This exemplary embodiment will be explained in detail with reference to drawings.
[Explanation of structure] The sealed casing 1 according to this exemplary embodiment includes a container 2, a top board 3 and a cooling unit 10 as shown in
The container 2 is provided with a plurality of openings and houses at least one heat-generating body 5 in the inside. And the plurality of openings is sealed by the plurality of top boards 3 respectively.
At least one of the openings is installed above a heat-generating area where the heat-generating body 5 is disposed. The top board 3 which seals the opening of the heat-generating area is connected with the cooling unit 10 which cools the heat-generating body 5.
[Explanation of effect] The sealed casing 1 according to this exemplary embodiment is provided with the top board 3 which seals the plurality of openings respectively. Therefore, without removing the top board 3 which seals the opening of the heat-generating area and by removing other top board 3, it becomes possible to check or replace parts inside the container 2. As a result, maintenance can be performed without deteriorating cooling capability of the sealed casing 1.
[The second exemplary embodiment] This exemplary embodiment will be explained in detail with reference to drawings.
[Explanation of structure] As shown in
The container 2 is a box type shape, and installs a frame shaped component 9 on an upper surface part. In the container 2, the frame shaped component 9 installed on the upper surface part forms a plurality of openings. The frame shaped component 9 is composed of materials with high sealability such as silicone rubber and foamed material, and is stuck by an adhesive material such as a seal on the upper surface part of the container 2 and is connected with it.
In this exemplary embodiment, explanation will be made with a top board 3 being distinguished between the first top board 3 and the second top board 4. The first top board 3 and the second top board 4 are disposed so that the openings of the frame shaped component 9 may be covered respectively. The first top board 3 and the second top board 4 compose a sealed structure of the container 2 by being connected with resin material such as silicone rubber which is the frame shaped component 9 by contact bonding using adhesives so that water and dust do not enter from outside.
The container 2 houses inside a heat-generating body 5 which becomes a cooling object and the evaporator 6. The first top board 3 is connected with the evaporator 6, and the first top board 3 is installed on a frame shaped component 9 above a heat-generating area where the heat-generating body 5 is disposed. The second top board 4 is installed on the frame shaped component 9 above an area except for the heat-generating area where the heat-generating body 5 is disposed. Further, if sealability of the container 2 can be maintained by being connected with the frame shaped component 9, the first top board 3 and the second top board 4 may be divided into plural.
Here, connection of the container 2, the first top board 3 and the second top board 4 will be explained in detail. In case the first top board 3 and the second top board 4 which compose the top boards of the container 2 are made a structure such that they can be removed independently of each other, since the first top board 3 and the second top board 4 cannot be connected fittingly, the container 2 cannot be made a sealed structure.
Accordingly, the container 2 according to this exemplary embodiment installs the frame shaped component 9 including at least no smaller than two openings on the upper surface part. (In
As a result, the first top board 3 and the second top board 4 can make the container 2 a sealed structure by contact bonding and by being connected with the container 2 via the frame shaped component 9 via adhesives. On the other hand, although the first top board 3 and the second top board 4 are connected via the frame shaped component 9, they are not connected each other. Therefore, the second top board 4 can be removed from the frame shaped component 9 independently.
The container 2 may be formed by thin plate working of a metal plate or metal plates created separately may be assembled together. However, in case the container 2 is composed by assembling the metal plates created separately together, connections such as a joint of metal plates are made a sealed structure sealed with resin such as silicone rubber so that water and dust do not enter from outside. Although materials of the container 2 are composed of metal, iron and stainless steel, they are not limited to the above and may be other materials.
The heat-generating body 5 is not limited in particular as far as it is one which generates heat along with operation, for example, such as a CPU. Further, in this exemplary embodiment, although the heat-generating body 5 is mounted on a substrate 11, it may be disposed directly on a bottom part of the container 2. The heat-generating body 5 is connected with the evaporator 6 thermally via adhesives with high thermal conductivity such as heat conductive grease on an upper surface part which is a surface of opposite side from a surface connected with the substrate 11.
The evaporator 6 is a box type shape and provided with a refrigerant inside. In this exemplary embodiment, although HFC (hydro fluorocarbon: hydrofluorocarbon) and HFE (hydro fluoro ether: hydrofluoroether) are being used as a specific refrigerant, the material is not limited to them. Further, since the evaporator 6 contacts with the heat-generating body 5 thermally on a lower surface part, the refrigerant receives heat which the heat-generating body 5 generates and boils.
The evaporator 6 is connected with the first top board 3 installed above and is fixed. In case there exists a plurality of heat-generating bodies 5, there is a case when heights are different depending on the kinds of the heat-generating bodies 5. Accordingly, the evaporator 6 and the first top board 3 may be connected via a spring 12.
To be explained in detail, as shown in
Since the evaporator 6 contacts with the first top board 3, by the power by which the first top board 3 is pressed by the spring 12, the evaporator 6 presses down the heat-generating body 5 installed downward. As a result, thermal connection between the evaporator 6 and the heat-generating body 5 can be made stronger. Further, as shown in
Also, the evaporator 6 is connected with at least two of the connecting pipes 7 and 7, and the respective connecting pipes 7 and 7 are connected with the condensing unit 8. Materials of the evaporator 6 are not limited in particular as far as they are the materials with high thermal conductivity such as copper and aluminum. Further, locations where the evaporator 6 is connected with the connecting pipes 7 and 7′ may be outside the container 2, in other words, above the first top board 3 or may be inside the container 2 as far as scalability of the container 2 can be kept.
The connecting pipes 7 and 7′ are composed by a two layer structure where an inner layer is composed by a metal layer and an outer layer is composed by a resin layer, or an inner layer and an outer layer both being metal layers.
The condensing unit 8 is installed on the first top board 3. Further, the condensing unit 8 is connected, at a top end part, with at least one connecting pipe 7, and also at a bottom end part, with at least one connecting pipe 7′. Further, the connecting pipe 7 carries vapor of the refrigerant which evaporated in the evaporator 6 to the condensing unit 8, and the connecting pipe 7′ carries the refrigerant which is condensed and liquefied in the condensing unit 8 to the evaporator 6 again. Further, materials of the condensing unit 8 are not limited in particular as far as they are ones with high thermal conductivity such as copper and aluminum.
In case a plurality of heat-generating bodies 5 whose heat-generating values are different is included inside the container 2, the first top boards 3 installed above the heat-generating areas respectively may preferably be provided with different coolers having cooling performance corresponding to the heat-generating values. At that time, the cooling performance of the plurality of condensing units 8 corresponds to the heat-generating values of the heat-generating bodies 5
In the condensing unit 8, when vapor of the refrigerant pours into the condensing unit 8 from the connecting pipe 7 which is connected with the top end part, the vapor flows to the bottom end part through a central part of the condensing unit 8. When the condensing unit 8 is cooled by such as an outside air, it condenses and liquefies the vapor poured into. The liquefied refrigerant flows to the evaporator 6 via the connecting pipe 7′ which is connected with the bottom end part.
[Explanation of action] The evaporator 6 installed inside the container 2 contacts thermally with the heat-generating body 5 mounted on the substrate 11 on the lower surface part. Therefore, the refrigerant installed inside the evaporator 6 boils by receiving the heat which the heat-generating body 5 generates.
The vapor which is generated by the refrigerant inside the evaporator 6 boiling is carried, by buoyancy due to a difference in density of vapor-liquid, and via the connecting pipe 7 which is connected with the evaporator 6, to the condensing unit 8 which is installed outside the container 2.
The vapor of the refrigerant carried to the condensing unit 8 performs heat exchange with the outside air while it flows through the condensing unit 8 from the top end part to the bottom end part. By the condensing unit 8 being cooled, the evaporated refrigerant is condensed from gas to liquid, and radiates the heat generated in the heat-generating body 5 to the outside air
And the refrigerant which liquefied in the bottom end part of the condensing unit 8 is carried to the evaporator 6 via the connecting pipe 7′ connected with the bottom end part.
In a cooling method of the heat-generating body 5 mentioned above, the heat generated by the heat-generating body 5 is radiated to the outside air by, in the evaporator 6 and the condensing unit 8, changing the phases of the refrigerant from liquid to gas and also from gas to liquid. In other words, since the refrigerant which absorbed the heat in the evaporator 6 becomes gas and moves to the condensing unit 8, it is necessary to maintain high scalability between the evaporator 6 and the condensing unit 8.
Inside the container 2, various parts are built-in in addition to the heat-generating body 5, and such as a fan (not illustrated) which makes an inner air circulate is also installed. For those built-in parts, not only when a failure occurred, checks or parts replacement need to be performed periodically.
However, in case of the cooling device described in patent document 1, in case parts other than the heat-generating body installed inside the sealed casing are to be replaced, the entire casing needs to be removed. Also, the condensing unit is installed adjacent to the outer surface of the casing, and in order to maintain the sealability between the condensing unit and the ebullient unit, the connection between the heat generating part and the ebullient unit needed to be removed.
When the connection between the heat generating part and the ebullient unit is removed each time the casing is removed, since there is a case when an enough thermal connection between both of them might not be made, there was a problem that thermal resistance between the heat generating part and the ebullient unit rises and the cooling performance deteriorates.
Accordingly, the sealed casing 1 according to this exemplary embodiment installs the container 2 provided with a plurality of the openings, the first top board 3 and the second top board 4 sealing the openings respectively. And the first top board 3 which is installed above the heat-generating area where the heat-generating body 5 and the evaporator 6 are disposed installs the condensing unit 8. Also, although the evaporator 6 is connected with the first top board 3, it is not connect with the second top board 4.
And since the first top board 3 and the second top board 4 are not connected directly, they can be removed independently. As a result, even if the second top board 4 is removed, since it is not necessary to remove the connection between the heat-generating body 5 and the evaporator 6, maintenance such as a checking and replacing the parts inside the container 2 can be performed without deteriorating the cooling performance,
[Explanation of effect] Next, the effect according to this exemplary embodiment will be explained.
The sealed casing 1 according to this exemplary embodiment is provided with the container 2 a the box type shape provided with a plurality of openings and installs the first top board 3 and the second top board 4 which seal the respective openings. And the first top board 3 and the second top board 4 are connected with the container 2 via the frame shaped component 9 respectively, and they can be removed independently of each other.
Also, the first top board 3 is installed above the heat-generating area where the heat-generating body 5 and the evaporator 6 are disposed, and is connected fixedly with the evaporator 6 via the spring 12 and the screw 15. In other words, although the first top board 3 is installed above the heat-generating body 5 and the evaporator 6, the second top board 4 is installed in the area other than that.
By the structure mentioned above, and by removing the second top board 4, replacement or inspection of parts other than the heat-generating body 5 installed inside the container 2 can be performed. As a result, since it is not necessary to remove the connection relationship between the heat-generating body 5 and the evaporator 6, maintenance to check or replace the parts inside the container 2 can be performed without deteriorating the cooling performance.
[The third exemplary embodiment] The third exemplary embodiment will be explained in detail with reference to drawings.
[Explanation of structure] A point different from the second exemplary embodiment is that a connecting pipe 7 is connected to a side surface part of an evaporator 6 as shown in
The evaporator 6 of the sealed casing 1 according to this exemplary embodiment is installed inside the container 2. The evaporator 6 is a box type shape and is provided with a refrigerant inside. And the evaporator 6 contacts with a heat-generating body 5 thermally on a lower surface part, performs boiling of the refrigerant by heat which the heat-generating body 5 generates, and is connected with the first top board 3 on an upper surface part and is fixed.
Also, the evaporator 6 is connected with at least two connecting pipes 7 and 7′, and the respective connecting pipes 7 and 7′ are connected with the condensing unit 8. Materials of the connecting pipes 7 and 7 are composed by metal layers or a two layer structure where an inner layer is a metal layer and an outer layer is a resin layer.
The evaporator 6 and the connecting pipe 7 are connected on the upper surface part of the evaporator 6. Locations where the evaporator 6 and the connecting pipe 7 are connected may be outside the container 2, in other words, above the first top board 3 or may be inside the container 2.
Also, the evaporator 6 and the connecting pipe 7′ are connected on the side surface part of the evaporator 6 which is inside the container 2.
Further, it is desirable that the connecting pipe 7′ is connected at a sufficiently low location than a liquid surface of the refrigerant on the side surface part of the evaporator 6.
The connecting pipe 7 connected with the upper surface part of the evaporator 6 is connected with a top end part of the condensing unit 8. Also, the connecting pipe 7′ connected with the side surface part of the evaporator 6 is connected with a bottom end part of the condensing unit 8.
[Explanation of action and effect] Next, the action and the effect according to this exemplary embodiment will be explained.
The sealed casing 1 according to this exemplary embodiment installs the connecting pipe 7 which connects the upper surface part of the evaporator 6 and the top end part of the condensing unit 8, and the connecting pipe 7′ which connects the side surface part of the evaporator 6 and the bottom end part of the condensing unit 8.
The refrigerant installed inside the evaporator 6 boils by receiving the heat which the heat-generating body 5 connected thermally on the lower surface part generates. And the vapor which the refrigerant boiled is carried, to the condensing unit 8 via the connecting pipe 7 which is connected with the upper surface of the evaporator 6 by buoyancy due to a difference in density of vapor-liquid.
And while it flows through the condensing unit 8 from the top end part to the bottom end part, the vapor of the refrigerant carried to the condensing unit 8 performs heat exchange with the outside air. By the entire body of the condensing unit 8 being cooled, the evaporated refrigerant is condensed from gas to liquid and radiates the heat generated in the heat-generating body 5 to the outside air. The refrigerant which liquefied at the bottom end part of the condensing unit 8 is carried to the evaporator 6 through the side surface part via the connecting pipe 7′ which is connected with the bottom end part of the condensing unit 8.
To be explained in detail, since the vapor of the refrigerant which evaporates in the evaporator 6 by the heat which the heat-generating body 5 generates moves upward by the buoyancy, although it is carried to the connecting pipe 7 which is connected with the upper surface part of the evaporator 6, it is not carried to the connecting pipe 7′ which is connected with the side surface part of the evaporator 6.
In other words, the evaporator 6 can, by changing the connecting locations of the connecting pipes 7 and 7′ respectively, distinguish the connecting pipe 7 which carries the vapor of the refrigerant which boiled to the condensing unit 8 and the connecting pipe 7 which carries the refrigerant which is cooled and liquefied in the condensing unit 8 to the evaporator again.
Therefore, it is possible to prevent the vapor of the evaporated refrigerant being carried to the connecting pipe 7′ and flowing backward. As a result, heat cycle in which the vapor of the refrigerant is carried to the top end part of the condensing unit 8 via the connecting pipe 7 and is carried to the evaporator 6 through the side surface part via the connecting pipe 7′ which is connected with the bottom end part of the condensing unit 8 can be maintained. As a result, the heat which the heat-generating body 5 generates can be radiated efficiently and the cooling performance of the sealed casing 1 can be raised.
[The fourth exemplary embodiment] Next, the fourth exemplary embodiment will be explained in detail with reference to drawings.
[Explanation of structure] A point different from the second exemplary embodiment is, as shown in
As shown in
In case the heat radiators 13 and 13′ are installed on both sides of the second top board 4, it is desirable that the heat radiator 13′ installed on the inner surface part and the heat radiator 13 installed on the outer surface part are disposed in opposite locations via the second top board 4. Further, the heat radiator 13′ installed on the inner surface part of the second top board 4 and the heat radiator 13 installed on the outer surface part may be connected directly by similar components or materials of high thermal conductivity which penetrate the container 2.
[Explanation of action and effect] The sealed casing 1 according to this exemplary embodiment can, by installing the heat radiator 13 on the outer surface part of the second top board 4, conduct heat from a device other than the heat-generating body 5 inside the container 2 to the heat radiator 13 via the container 2, and radiate the heat efficiently outside the container 2.
Also, by installing the heat radiator 13 on the inner surface part of the second top board 4, it can conduct the heat which the heat-generating body 5 in the container 2 generates efficiently to the container 2 via the heat radiator 13′ and radiate the heat outside via the heat radiator 13.
Further, according to the sealed casing 1 according to this exemplary embodiment, the condensing unit 8 and the heat radiators 13 and 13′ which are the cooling units 10 having the cooling performance corresponding to the heat-generating values of such as the heat-generating body which becomes a cooling object are disposed on the opposing top board respectively. It becomes possible, not to deteriorate the cooling performance but to improve it, and to perform maintenance such as to check and replace parts inside the container 2.
[The fifth exemplary embodiment] Next, the fifth exemplary embodiment will be explained in detail with reference to drawings. FIG.
6 is a sectional view of a sealed casing 1 according to this exemplary embodiment, and
[Explanation of structure] A point different from the second exemplary embodiment is, as shown in
The container 2 is a box type shape, and installs a frame shaped component 9 including at least two openings on an upper surface part. The first top board 3 is disposed on the frame shaped component 9 so that the opening located above the heat-generating body 5 and the evaporator 6 may be covered. Also, the second top board 4 is disposed on the frame shaped component 9 so that other openings may be covered. Further, all of the openings are covered with the first top board 3 or the second top board 4, and the sealed casing 1 is made a sealed structure.
The first top board 3 and the second top board 4 are connected with the container 2 via the frame shaped component 9 without being connected each other. Therefore, the first top board 3 and the second top board 4 can maintain the sealability of the container 2, and also, since they are not connected with each other, can be removed independently of each other respectively.
Here, in this exemplary embodiment, the distance between the first top board 3 installed above the heat-generating body 5 and the evaporator 6 and the bottom surface of the container 2 is smaller than the distance between the second top board 4 and the bottom surface of the container 2. In other words, the height of the first top board 3 is lower than the height of the second top board 4 against the bottom surface of the container 2.
To be explained in detail, in a part which forms the opening above the heat-generating body 5 and the evaporator 6, the frame shaped component 9 installs the step part 14. And the first top board 3 is installed on a low part of the step part 14, in other words, the part where the distance between the step part 14 and the bottom surface of the container 2 is closer. Also, the second top board 4 is installed on a high part of the step part 14, in other words, the part where the distance between the step part 14 and the bottom surface of the container 2 is farther.
[Explanation of action and effect] In the sealed casing 1 according to this exemplary embodiment, the condensing unit 8 is disposed on the first top board 3 which is outside the container 2. Therefore, when the condensing unit 8 is made larger while trying to improve the cooling performance, the height became larger as an entire device, and there was a problem in terms of downsizing of the device.
Therefore, the sealed casing 1 according to this exemplary embodiment is made a structure which made the height of the first top board 3 on which the condensing unit 8 is installed lower than the height of the second top board 4. In other words, the distance between the first top board 3 and the bottom surface of the container 2 is smaller than the distance between the second top board 4 and the bottom surface of the container 2. Therefore, a new space can be installed on the first top board 3.
Heat radiation characteristics of the sealed casing 1 result from a surface area of the condensing unit 8. Therefore, in proportion to the amount by which the height of the first top board 3 is lower, the surface area of the condensing unit 8 can be made larger. As a result, since the height of the condensing unit 8 can be made higher without increasing the sealed casing 1 in size, it becomes possible to raise the heat radiation characteristics and improve the cooling performance. Further, the present invention is not limited only to the exemplary embodiments mentioned above, and it goes without saying that various changes are possible within the range which do not deviate from the points of the present invention already described.
This application claims the benefit of priority based on Japanese Patent Application No. 2011-116003, filed on May 24, 2011, and the disclosure of which is incorporated herein in its entirety by reference.
The present invention relates to a sealed casing provided with a cooling device for a heat-generating body housed inside a container which forms a sealed space.
1 Sealed casing
2 Container
3 First top board
4 Second top board
5 Heat-generating body
6 Evaporator
7 Connecting pipe
8 Condensing unit
9 Frame shaped component
10 Cooling unit
11 Substrate
12 Spring
13 Heat radiator
14 Step part
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-116003 | May 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2012/063571 | 5/21/2012 | WO | 00 | 11/19/2013 |
