BRIEF DESCRIPTION OF THE DRAWINGS
Example embodiments of the present invention will be readily understood with reference to the following detailed description thereof provided in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.
FIG. 1 is a plan view of a conventional semiconductor chip package mounting structure.
FIG. 2 is a side view of the semiconductor chip package mounting structure in FIG. 1.
FIG. 3 is a plan view of a structural variation of a module board in FIG. 1.
FIG. 4 is a plan view of an electronic module that may implement a semiconductor chip package mounting structure in accordance with an example embodiment of the present invention.
FIG. 5 is a side view of the electronic module in FIG. 4.
FIG. 6 is a bottom view of the semiconductor chip package mounting structure in FIG. 4.
FIG. 7 is a cross-sectional view of a semiconductor chip package mounting structure in accordance with an example embodiment of the present invention.
FIG. 8 is a cross-sectional view of a semiconductor chip package mounting structure in accordance with another example embodiment of the present invention.
FIG. 9 is a side view of an electronic module implementing the semiconductor chip package mounting structure in FIG. 8.
FIG. 10 is a plan view of a portion of the module board in FIG. 9.
FIGS. 11 to 13 are schematic views of electrical connections between flexible circuit boards and semiconductor chip packages in FIG. 9.
FIG. 14 is a cross-sectional view of a semiconductor chip package mounting structure in accordance with another example embodiment of the present invention.
FIG. 15 is a cross-sectional view of a semiconductor chip package mounting structure in accordance with another example embodiment of the present invention.