Claims
- 1. A semiconductor device comprising:a plurality of metal interconnections formed on a semiconductor substrate; a first fluorine-containing organic film deposited at least between the plurality of metal interconnections; and a second fluorine-containing organic film deposited on the plurality of metal interconnections and in direct contact with the first fluorine-containing organic film, wherein the amount of fluorine atoms contained in the second fluorine-containing organic film is smaller than the amount of fluorine atoms contained in the first fluorine-containing organic film.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-319088 |
Nov 1999 |
JP |
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Parent Case Info
Divisional prior application No.: 09/708,084 filed Nov. 8, 2000 now U.S. Pat. No. 6,500,769.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
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10-199976 |
Jul 1998 |
JP |