The present disclosure relates to a semiconductor device package. In particular, the present disclosure relates to a semiconductor device package including optical devices.
A waveguide can be used to guide light from a light emitter to an optical sensor in a semiconductor device package. The light emitter and the optical sensor may be disposed in a cavity, or each in a separate cavity, formed in the semiconductor device package. Horizontal misalignment may occur during placement of the light emitter and the optical sensor in the cavity or cavities. Further, a depth of the cavity or cavities in the semiconductor device package may not be consistent, such that a depth tolerance of the cavity or cavities may result in vertical misalignment of the light emitter, the waveguide and the optical sensor.
In an embodiment, a semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.
In an embodiment, a semiconductor device package includes: (1) a substrate having a first surface, the substrate defining a space having a bottom surface; (2) a waveguide in the substrate; and (3) an optical device disposed in the space and separated from the bottom surface of the space by a distance, the optical device including (a) an alignment portion extending along the first surface of the substrate and supported by the first surface of the substrate, wherein the alignment portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the alignment portion of the optical device engages with the groove of the substrate; and (b) a light emitting portion or a light receiving portion aligned with the waveguide.
In an embodiment, a semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate without protruding from the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device is directly disposed on the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.
Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar elements. Embodiments of the present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings.
Described in the present disclosure are techniques for providing optical devices to improve quality of light transmission. Moreover, the techniques may improve horizontal and vertical alignments such that misalignment between optical components is mitigated.
Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,” “down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “over,” “under,” and so forth are indicated with respect to the orientation shown in the figures unless otherwise specified. It should be understood that the spatial descriptions used herein are for purposes of illustration only, and that practical implementations of the structures described herein can be spatially arranged in any orientation or manner, provided that the merits of embodiments of this disclosure are not deviated by such arrangement.
The substrate 10 has a top surface 101. The substrate 10 includes a semiconductor layer 103 and a semiconductor oxide layer 104 on the semiconductor layer 103.
The semiconductor layer 103 may include, for example, silicon or another suitable material. The semiconductor oxide layer 104 may include, for example, silicon oxide (SiOx), or another suitable material.
A space 30 is defined by a bottom 31 and side walls 32 of the semiconductor oxide layer 104. A space 40 is defined by a bottom 41 and side walls 42 of the semiconductor oxide layer 104. The space 30 is separated from the space 40 by the semiconductor oxide layer 104. The space 30 receives or accommodates the optical device 11. An adhesive gel 72 may surround a portion of the optical device 11 in the space 30, and fill the space 30 to approximately the bottom of the waveguide 13 and lens 16. The adhesive gel 72 does not touch the waveguide 13 and lens 16. An adhesive gel 74 may surround a portion of the optical device 12 in the space 40, and fill the space 40 to approximately the bottom of the waveguide 13 and 16. The adhesive gel 74 does not touch the waveguide 13 and lens 16.
The waveguide 13 is disposed within the semiconductor oxide layer 104. A material of the waveguide 13 may be, or may include, a fiber, a polymer, a glass or another suitable material. Light from the optical device 11 may be transmitted to the optical device 12 by the waveguide 13, and vice versa. The waveguide 13 may be formed in the substrate 10 before disposing the optical device 11 and the optical device 12 in the respective space 30 and space 40. The waveguide 13 may be formed during a process of manufacturing the substrate 10. The waveguide 13 includes a lens 16 at each end for light convergence.
The optical device 11 includes a light emitter (e.g., a light emitting diode or a laser diode). The optical device 11 may be a light emitting die. The optical device 11 includes a first portion 111 and a second portion 112. The first portion 111 and the second portion 112 may be two portions of a single component, formed integrally (e.g., in a same process stage using a same material). The first portion 111 and the second portion 112 may be two separate members which are attached together to form the optical device 11.
The first portion 111 is positioned to extend into the space 30 of the substrate 10, and to not extend above the top surface 101 of the substrate 10. The optical device 11 is positioned such that the second portion 112 is laterally protruded from the first portion 111 external to the substrate 10 and extends along the top surface 101 of the substrate 10. The second portion 112 of the optical device 11 is supported by the top surface 101 of the substrate 10 such that the first portion 111 of the optical device 11 remains at a distance from the bottom 31 of the space 30. The second portion 112 of the optical device 11 serves as an alignment portion of the optical device 11.
The first portion 111 has a dimension A (e.g., width), the second portion 112 has a dimension B (e.g., width), and the space 30 has a dimension C (e.g., width). The dimension B is greater than the dimension A and the dimension C (in other words, B>A and B>C). In some embodiments, the dimension B is greater than the dimension C plus a difference between the dimension C and the dimension A (in other words, B>C+(C−A)).
The first portion 111 of the optical device 11 may include a light emitting area (not shown in
If the vertical offset between the light emitting area of the first portion 111 and the waveguide 13 in the Z direction is greater than or equal to about one third of the vertical dimension (e.g., height) of the waveguide 13, then light energy received by the waveguide 13 may be less than about 10% of light energy emitted by the light emitting area of the first portion 111 due to an optical coupling loss induced by the vertical offset. Similarly, if the lateral offset between the light emitting area of the first portion 111 and the waveguide 13 in the X direction is greater than or equal to about one third of the lateral dimension (e.g., width) of the waveguide 13, then light energy received by the waveguide 13 may be less than about 10% of light energy emitted by the light emitting area of the first portion 111 due to an optical coupling loss induced by the lateral offset. Use of the optical device 11 with the first portion 111 and the second portion 112 facilitates improved alignment by providing a vertical maneuvering area in the space 30 below the first portion 111, and a lateral maneuvering area within the space 30 around a periphery of the first portion 111. Accordingly, lateral alignment tolerance does not rely on a manufacturing tolerance related to an alignment of the space 30 with the waveguide 13, and vertical alignment tolerance does not rely on a manufacturing tolerance related to a depth of the space 30.
The optical device 12 includes an optical detector. The optical device 12 includes a first portion 121 and a second portion 122. Portions 121 and 122 may be two portions of a single component, formed integrally (e.g., in a same process stage using a same material). Portions 121 and 122 may be two separate members which are attached together to form the optical device 12.
The first portion 121 is positioned to extend into the space 40 of the substrate 10, and to not extend above the top surface 101 of the substrate 10. The optical device 12 is positioned such that the second portion 122 is laterally protruded from the portion 121 external to the substrate 10 and extends across the top surface 101 of the substrate 10. The second portion 122 of the optical device 12 is supported by the top surface 101 of the substrate 10 such that the first portion 121 of the optical device 12 is separated from the bottom 41 of the space 40. The second portion 122 of the optical device 12 serves as an alignment portion of the optical device 12.
The portion 121 has a dimension D (e.g., width), the portion 122 has a dimension E (e.g., width), and the space 40 has a dimension F (e.g., width). The dimension E is greater than the dimension D and the dimension F (in other words, E>D and E>F). In some embodiments, the dimension E is greater than the dimension F plus a difference between the dimension F and the dimension D (in other words, E>F+(F−D)).
The portion 121 of the optical device 12 may include a light receiving area (not shown in
If the vertical offset between the light receiving area of the portion 121 and the waveguide 13 in the Z direction is greater than or equal to about one third of the vertical dimension (e.g., height) of the waveguide 13, then light energy received by the light receiving area of the portion 121 may be less than about 10% of light energy emitted by the waveguide 13 due to an optical coupling loss induced by the vertical offset. Similarly, if the lateral offset between the light receiving area of the portion 121 and the waveguide 13 in the X direction is greater than or equal to about one third of the lateral dimension (e.g., width) of the waveguide 13, then light energy received by the light receiving area of the portion 121 may be less than about 10% of light energy emitted by the waveguide 13 due to an optical coupling loss induced by the lateral offset.
Use of the optical device 12 with the first portion 121 and the second portion 122 facilitates improved alignment by providing a vertical maneuvering area in the space 40 below the portion 121, and a lateral maneuvering area within the space 40 around a periphery of the portion 121. Accordingly, lateral alignment tolerance does not rely on a manufacturing tolerance related to an alignment of the space 40 with the waveguide 13, and vertical alignment tolerance does not rely on a manufacturing tolerance related to a depth of the space 40.
In one or more embodiments, a refractive index of the waveguide 13 is larger than a refractive index of the semiconductor oxide layer 104. For example, a refractive index of SiOx is approximately 1.468, which is less than a refractive index of the waveguide 13. In such an arrangement, transmission loss may be reduced because light transmitted in the waveguide 13 may not enter the semiconductor oxide layer 104.
In
In
In
In
In
As used herein, the terms “approximately” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can encompass a range of variation of less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For another example, a first angle may be approximately the same as a second angle if a difference between the first angle and the second angle is less than or equal to ±10°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°.
Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.
Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood flexibly to include numerical values explicitly specified as limits of a range, but also to include all individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly specified.
While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.
This application is a continuation of U.S. patent application Ser. No. 15/201,095, filed Jul. 1, 2016, the contents of which are incorporated herein by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
5598495 | Rittle et al. | Jan 1997 | A |
6088153 | Anthon et al. | Jul 2000 | A |
6229158 | Minemier et al. | May 2001 | B1 |
6229712 | Munoz-Bustamante et al. | May 2001 | B1 |
6253005 | Bergmann et al. | Jun 2001 | B1 |
6275625 | Bergmann | Aug 2001 | B1 |
6325552 | Brillhart | Dec 2001 | B1 |
6351329 | Greywall | Feb 2002 | B1 |
6363203 | Dautartas | Mar 2002 | B1 |
6370311 | Basavanhally | Apr 2002 | B1 |
6374012 | Bergmann et al. | Apr 2002 | B1 |
6388798 | Smith et al. | May 2002 | B2 |
6396711 | Degani et al. | May 2002 | B1 |
6399418 | Glenn et al. | Jun 2002 | B1 |
6404533 | Fergusson | Jun 2002 | B1 |
6408120 | Dautartas | Jun 2002 | B1 |
6411757 | Brener et al. | Jun 2002 | B1 |
6420204 | Glenn | Jul 2002 | B2 |
6431765 | Chen et al. | Aug 2002 | B1 |
6439895 | Li | Aug 2002 | B1 |
6442306 | Dautartas et al. | Aug 2002 | B1 |
6442307 | Carr et al. | Aug 2002 | B1 |
6448506 | Glenn et al. | Sep 2002 | B1 |
6477301 | Anthon et al. | Nov 2002 | B1 |
6487001 | Greywall | Nov 2002 | B2 |
6487356 | Harrison et al. | Nov 2002 | B1 |
6512861 | Chakravorty et al. | Jan 2003 | B2 |
6519075 | Carr et al. | Feb 2003 | B2 |
6560377 | Jones et al. | May 2003 | B2 |
6564454 | Glenn et al. | May 2003 | B1 |
6576998 | Hoffman | Jun 2003 | B1 |
6586824 | Glenn et al. | Jul 2003 | B1 |
6603183 | Hoffman | Aug 2003 | B1 |
6618184 | Jin et al. | Sep 2003 | B2 |
6624444 | Li | Sep 2003 | B1 |
6628452 | Haeberle et al. | Sep 2003 | B2 |
6630661 | Hoffman | Oct 2003 | B1 |
6639724 | Bower et al. | Oct 2003 | B2 |
6646290 | Lee et al. | Nov 2003 | B1 |
6661943 | Li | Dec 2003 | B2 |
6686588 | Webster et al. | Feb 2004 | B1 |
6702476 | Bergmann et al. | Mar 2004 | B2 |
6704475 | Jin et al. | Mar 2004 | B2 |
6704476 | Ford et al. | Mar 2004 | B2 |
6712527 | Chan et al. | Mar 2004 | B1 |
6716657 | Soh | Apr 2004 | B1 |
6718086 | Ford et al. | Apr 2004 | B1 |
6740950 | Paek | May 2004 | B2 |
6748125 | Deliwala | Jun 2004 | B2 |
6754407 | Chakravorty et al. | Jun 2004 | B2 |
6757458 | Neilson et al. | Jun 2004 | B2 |
6759266 | Hoffman | Jul 2004 | B1 |
6765801 | Glenn et al. | Jul 2004 | B1 |
6771850 | Greywall | Aug 2004 | B1 |
6784534 | Glenn et al. | Aug 2004 | B1 |
6788847 | Paddon et al. | Sep 2004 | B2 |
6793407 | Jacobowitz et al. | Sep 2004 | B2 |
6801676 | Liu | Oct 2004 | B1 |
6807218 | Greenwood et al. | Oct 2004 | B1 |
6809258 | Dang et al. | Oct 2004 | B1 |
6809848 | Carr et al. | Oct 2004 | B2 |
6813054 | Aksyuk et al. | Nov 2004 | B2 |
6819813 | Howland et al. | Nov 2004 | B2 |
6836185 | Pobanz | Dec 2004 | B1 |
6839517 | Anigbo et al. | Jan 2005 | B2 |
6841842 | Li | Jan 2005 | B2 |
6846087 | Carr et al. | Jan 2005 | B2 |
6856730 | Johnson et al. | Feb 2005 | B2 |
6859324 | Meyers et al. | Feb 2005 | B2 |
6861720 | Heckman et al. | Mar 2005 | B1 |
6864553 | Epitaux et al. | Mar 2005 | B2 |
6869815 | Gasparyan et al. | Mar 2005 | B2 |
6879751 | Deliwala | Apr 2005 | B2 |
6891685 | Deliwala et al. | May 2005 | B2 |
6896422 | Bennett et al. | May 2005 | B2 |
6906846 | Cirelli et al. | Jun 2005 | B2 |
6912330 | Deliwala | Jun 2005 | B2 |
6922499 | Boie et al. | Jul 2005 | B2 |
6944008 | Arney et al. | Sep 2005 | B2 |
6944369 | Deliwala | Sep 2005 | B2 |
6955481 | Colgan et al. | Oct 2005 | B2 |
6968110 | Patel et al. | Nov 2005 | B2 |
6973230 | Mackay | Dec 2005 | B1 |
6975664 | Dodabalapur et al. | Dec 2005 | B1 |
6975784 | Xu et al. | Dec 2005 | B1 |
7000434 | Murali | Feb 2006 | B2 |
7003196 | Ghiron et al. | Feb 2006 | B2 |
7013067 | Ghiron et al. | Mar 2006 | B2 |
7015056 | Gasparyan et al. | Mar 2006 | B2 |
7020364 | Ghiron et al. | Mar 2006 | B2 |
7026707 | Li et al. | Apr 2006 | B2 |
7031562 | Paddon et al. | Apr 2006 | B2 |
7039263 | Towle | May 2006 | B2 |
7042106 | Lu et al. | May 2006 | B2 |
7049704 | Chakravorty et al. | May 2006 | B2 |
7054534 | Gunn et al. | May 2006 | B1 |
7058247 | Crow et al. | Jun 2006 | B2 |
7059040 | Webster et al. | Jun 2006 | B1 |
7068892 | Lu et al. | Jun 2006 | B1 |
7081981 | Ling et al. | Jul 2006 | B2 |
7082246 | Gunn et al. | Jul 2006 | B1 |
7095620 | Bozso et al. | Aug 2006 | B2 |
7095914 | Xu et al. | Aug 2006 | B2 |
7116881 | Gunn, III et al. | Oct 2006 | B1 |
7146106 | Yang et al. | Dec 2006 | B2 |
7159421 | Bhandarkar et al. | Jan 2007 | B2 |
7177499 | Johnson | Feb 2007 | B2 |
7187837 | Gothoskar et al. | Mar 2007 | B2 |
7194166 | Gunn, III | Mar 2007 | B1 |
7212713 | Fukuzawa et al. | May 2007 | B2 |
7224076 | Agrawal et al. | May 2007 | B2 |
7229221 | Ahrens | Jun 2007 | B2 |
7245803 | Gunn, III et al. | Jul 2007 | B2 |
7256059 | Lu et al. | Aug 2007 | B2 |
7260289 | Gunn et al. | Aug 2007 | B1 |
7260293 | Gunn et al. | Aug 2007 | B1 |
7269326 | Paddon et al. | Sep 2007 | B2 |
7283699 | Lu et al. | Oct 2007 | B2 |
7298939 | Malendevich et al. | Nov 2007 | B1 |
7333695 | Xu et al. | Feb 2008 | B2 |
7334946 | Lu | Feb 2008 | B2 |
7343058 | Block et al. | Mar 2008 | B2 |
7352066 | Budd et al. | Apr 2008 | B2 |
7359591 | Vandentop et al. | Apr 2008 | B2 |
7359609 | Mahoney et al. | Apr 2008 | B2 |
7367715 | Budd et al. | May 2008 | B1 |
7369718 | George et al. | May 2008 | B2 |
7373033 | Lu et al. | May 2008 | B2 |
7373044 | Sekiya et al. | May 2008 | B2 |
7409327 | Deliwala | Aug 2008 | B2 |
7412138 | Malendevich et al. | Aug 2008 | B1 |
7415184 | Ghiron et al. | Aug 2008 | B2 |
7433193 | Yee et al. | Oct 2008 | B2 |
7453132 | Gunn, III et al. | Nov 2008 | B1 |
7470069 | Offrein et al. | Dec 2008 | B1 |
7477811 | Dellmann et al. | Jan 2009 | B1 |
7480426 | Dellmann et al. | Jan 2009 | B1 |
7486847 | Dellmann et al. | Feb 2009 | B1 |
7539366 | Baks et al. | May 2009 | B1 |
7539376 | Bozso et al. | May 2009 | B2 |
7551453 | Bozso et al. | Jun 2009 | B2 |
7556440 | Birincioglu et al. | Jul 2009 | B2 |
7576401 | De Guzman et al. | Aug 2009 | B1 |
7609461 | Webster et al. | Oct 2009 | B1 |
7616904 | Gunn, III et al. | Nov 2009 | B1 |
7630601 | Mershon et al. | Dec 2009 | B2 |
7676132 | Mandry et al. | Mar 2010 | B1 |
7684660 | Braunisch et al. | Mar 2010 | B2 |
7701985 | Webster et al. | Apr 2010 | B2 |
7731432 | Theodoras, II | Jun 2010 | B2 |
7773836 | De Dobbelaere | Aug 2010 | B2 |
7801397 | Block et al. | Sep 2010 | B2 |
7826692 | Mongold | Nov 2010 | B2 |
7826694 | Vandentop et al. | Nov 2010 | B2 |
7853105 | Budd et al. | Dec 2010 | B2 |
7903911 | Sekiya et al. | Mar 2011 | B2 |
7911017 | De Guzman et al. | Mar 2011 | B1 |
7936033 | Haskett et al. | May 2011 | B2 |
7941023 | Patel et al. | May 2011 | B2 |
7945127 | Lu | May 2011 | B2 |
7961992 | De Dobbelaere et al. | Jun 2011 | B2 |
8057108 | Bhowmik et al. | Nov 2011 | B2 |
8165431 | De Dobbelaere et al. | Apr 2012 | B2 |
8200056 | Baugh | Jun 2012 | B2 |
8231284 | Doany et al. | Jul 2012 | B2 |
8265432 | Doany et al. | Sep 2012 | B2 |
8280207 | Pinguet et al. | Oct 2012 | B2 |
8373259 | Kim et al. | Feb 2013 | B2 |
8445984 | Haskett et al. | May 2013 | B2 |
8488921 | Doany et al. | Jul 2013 | B2 |
8545108 | Barwicz et al. | Oct 2013 | B1 |
8577191 | De Dobbelaere et al. | Nov 2013 | B2 |
8588561 | Zbinden et al. | Nov 2013 | B2 |
8613561 | Ko et al. | Dec 2013 | B2 |
8626002 | Kucharski | Jan 2014 | B2 |
8694721 | Haywood | Apr 2014 | B2 |
8724937 | Barwicz et al. | May 2014 | B2 |
8731346 | Tseng et al. | May 2014 | B2 |
8750657 | Levy et al. | Jun 2014 | B2 |
8755644 | Budd et al. | Jun 2014 | B2 |
8787711 | Zbinden et al. | Jul 2014 | B2 |
8831437 | Dobbelaere et al. | Sep 2014 | B2 |
RE45214 | De Dobbelaere et al. | Oct 2014 | E |
RE45215 | De Dobbelaere et al. | Oct 2014 | E |
8861906 | Pinguet et al. | Oct 2014 | B2 |
8871570 | Levy et al. | Oct 2014 | B2 |
8873899 | Anderson et al. | Oct 2014 | B2 |
8873912 | Dangel et al. | Oct 2014 | B2 |
8876410 | Shastri et al. | Nov 2014 | B2 |
8905632 | Shastri et al. | Dec 2014 | B2 |
8913856 | Jacobowitz et al. | Dec 2014 | B2 |
8923664 | Mekis et al. | Dec 2014 | B2 |
8926196 | Detofsky et al. | Jan 2015 | B2 |
RE45390 | De Dobbelaere et al. | Feb 2015 | E |
8944704 | Lagziel et al. | Feb 2015 | B2 |
8983291 | Broekaert et al. | Mar 2015 | B1 |
8990488 | Haywood | Mar 2015 | B2 |
20040156590 | Gunn et al. | Aug 2004 | A1 |
20060140553 | Theodoras et al. | Jun 2006 | A1 |
20100008675 | De Dobbelaere | Jan 2010 | A1 |
20110127633 | Nadeau et al. | Jun 2011 | A1 |
20110216997 | Gothoskar et al. | Sep 2011 | A1 |
20110229092 | Fujiwara | Sep 2011 | A1 |
20110317958 | Nadeau et al. | Dec 2011 | A1 |
20120280344 | Shastri et al. | Nov 2012 | A1 |
20130004167 | Kim | Jan 2013 | A1 |
20130202255 | Togami et al. | Aug 2013 | A1 |
20130243368 | Levy et al. | Sep 2013 | A1 |
20130315528 | Levy | Nov 2013 | A1 |
20140169789 | Bhoja | Jun 2014 | A1 |
20140284463 | Kuroda et al. | Sep 2014 | A1 |
20140286646 | Zbinden et al. | Sep 2014 | A1 |
20140306131 | Mack et al. | Oct 2014 | A1 |
20140369651 | Ben David et al. | Dec 2014 | A1 |
20140369693 | Peterson et al. | Dec 2014 | A1 |
20150010268 | Badihi et al. | Jan 2015 | A1 |
20150016784 | Shastri et al. | Jan 2015 | A1 |
20150021291 | Shastri et al. | Jan 2015 | A1 |
20150023452 | Riani et al. | Jan 2015 | A1 |
20150037029 | Waldman et al. | Feb 2015 | A1 |
20150110501 | Pobanz | Apr 2015 | A1 |
20150338586 | Sunaga et al. | Nov 2015 | A1 |
20170205592 | Pfnuer | Jul 2017 | A1 |
Entry |
---|
Non-Final Office Action for U.S. Appl. No. 15/201,095, dated Jun. 21, 2017, 7 pages. |
Final Office Action for U.S. Appl. No. 15/201,095, dated Nov. 27, 2017, 6 pages. |
Advisory Action for U.S. Appl. No. 15/201,095, dated Mar. 2, 2018, 5 pages. |
Non-Final Office Action for U.S. Appl. No. 15/201,095, dated Jun. 4, 2018, 7 pages. |
Notice of Allowance for U.S. Appl. No. 15/201,095, dated Nov. 6, 2018, 9 pages. |
Corrected Notice of Allowability for U.S. Appl. No. 15/201,095, dated Feb. 15, 2019, 3 pages. |
Number | Date | Country | |
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20190187371 A1 | Jun 2019 | US |
Number | Date | Country | |
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Parent | 15201095 | Jul 2016 | US |
Child | 16286364 | US |