Claims
- 1. A sealing member, comprising a generally circular, flexible structure and a plurality of lobes spaced about said circular structure.
- 2. The sealing member of claim 1 wherein said plurality of lobes is three.
- 3. The sealing member of claim 1 wherein said structure is clover shaped.
- 4. The sealing member of claim 1 wherein said structure is fabricated from a fluoropolymer.
- 5. A semiconductor wafer processing substrate support assembly, comprising:
a substrate support platform having a centrally disposed recess; and a first sealing member having a plurality of lobes, the first sealing member circumscribing said centrally disposed recess.
- 6. The processing chamber of claim 5 wherein said centrally disposed recess is defined by a plurality of walls extending from a first surface of said support platform to a bottom of said support platform.
- 7. The processing chamber of claim 6 wherein said first surface of said support platform comprises a groove circumscribing said centrally disposed recess for receiving said first sealing member.
- 8. The processing chamber of claim 5 further comprising a base disposed above said centrally disposed recess.
- 9. The processing chamber of claim 8 wherein said first sealing member is disposed between said base and said substrate support platform.
- 10. The processing chamber of claim 9 further comprising a plate disposed above said base.
- 11. The processing chamber of claim 10 wherein a second sealing member having a plurality of lobes is disposed between said base and said plate.
- 12. The processing chamber of claim 11 further comprising a substrate support disposed above said plate.
- 13. The processing chamber of claim 12 wherein a third sealing member having a plurality of lobes is disposed between said plate and said substrate support.
- 14. The processing chamber of claim 13 wherein said first, second, and third sealing members are clover shaped.
- 15. The processing chamber of claim 13 wherein said first, second, and third sealing members are fabricated from a fluoropolymer.
- 16. The processing chamber of claim 13 wherein a plurality of lift-pin holes extend from a lower surface of said support platform to an upper surface of said substrate support wherein said first, second, and third sealing members extend radially inward of said plurality of lift-pin holes.
- 17. The processing chamber of claim 13 wherein at least one of said first, second, and third sealing members circumscribe a RF cable disposed in an RF conduit.
- 18. The processing chamber of claim 13 wherein at least one of said first and second sealing members circumscribe a pair of fluid supply lines disposed in a pair of fluid supply line conduits.
- 19. The processing chamber of claim 13 wherein at least one of said first, second, and third sealing members circumscribe a wafer temperature probe cable disposed in a temperature monitor cable channel.
- 20. The processing chamber of claim 13 wherein at least one of said first, second, and third sealing members circumscribe at least one backside gas passage coupled to at least one backside gas supply line.
- 21. A semiconductor wafer processing chamber, comprising:
a substrate support platform having a centrally disposed recess; a base disposed above said centrally disposed recess; a plate disposed above said base; a substrate support disposed above said plate; a plurality of lobed sealing members disposed between the base, plate, and substrate support.
- 22. The processing chamber of claim 21 wherein a first lobed sealing member of said plurality of lobed sealing members is disposed between said support platform and said base, a second lobed sealing member is disposed between said base and said plate, and a third lobed sealing member is disposed between said plate and said substrate support; and
- 23. The processing chamber of claim 21 wherein at least one platform arm extending radially from a sidewall of said processing chamber to said substrate support platform.
- 24. The processing chamber of claim 21 wherein said centrally disposed recess is defined by a plurality of walls extending from a first surface of said support platform to a bottom of said support platform.
- 25. The processing chamber of claim 23 wherein said first surface of said support platform comprises a groove circumscribing said centrally disposed recess for receiving said first lobed sealing member.
- 26. The processing chamber of claim 25 wherein a plurality of lift-pin holes extend from a lower surface of said support platform to an upper surface of said substrate support wherein said plurality of lobed sealing members extend radially inward of said plurality of lift-pin holes.
- 27. The processing chamber of claim 21 wherein said plurality of lobed sealing members is fabricated from a fluoropolymer.
- 28. The processing chamber of claim 21 wherein at least one of said plurality of lobed sealing members circumscribe a RF cable disposed in the base.
- 29. The processing chamber of claim 21 wherein said first and second lobed sealing members circumscribe a pair of fluid supply lines disposed in the base.
- 30. The processing chamber of claim 21 wherein at least one of said plurality of lobed sealing members circumscribe at least one backside gas supply line coupled to at least one backside gas passage disposed in the base.
- 31. The processing chamber of claim 21 wherein at least one of said plurality of lobed sealing members circumscribe a temperature sensor coupled to a temperature probe cable disposed in the base.
CROSS REFERENCE
[0001] This application claims benefit of United States Provisional Application No. 60/185,283, filed Feb. 28, 2000, which is hereby incorporated by reference in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60185283 |
Feb 2000 |
US |