The present invention relates to a shower plate and a plasma processing device using the same.
Traditionally, to manufacture semiconductor devices and etc., plasma processing devices are used for carrying out microwave plasma CVD (Chemical Vapor Deposition) and etc. for forming thin films. Such plasma processing devices are provided with a chamber, a slot antenna, a dielectric partition wall, a plasma excitation gas supplying section, a mounting table and a shower plate (for example, see Japanese Patent Application Publication No. 2002-299241).
The shower plate transmits plasma generated above the shower plate to below the shower plate, and further feeds process gas directly below the shower plate.
By the way, this shower plate becomes hot because of exposure to plasma. Therefore, flow passages are provided in the shower plate for flowing a heat medium for cooling the shower plate. Since the temperature of the shower plate affects the process conducted in the plasma device, satisfactory cooling of the shower plate has been desired.
The present invention was created in light of the circumstances described above, and aims to provide a shower plate containing flow passages to facilitate a satisfactory cooling of the shower plate, and a plasma processing device utilizing the shower plate.
To accomplish the objective, a shower plate of a first aspect of the present invention includes:
a first member;
a second member which is overlapped and joined to the first member; and
a groove formed at a surface of the first member, the surface facing the second member, and the groove functioning as a flow passage in which a heat medium flows by overlapping with the second member,
wherein a sidewall of the flow passage bends in a plane which is parallel to a joint plane of the first member and the second member.
To accomplish the objective, a plasma processing device of a second aspect of the present invention includes the shower plate of the first aspect.
To accomplish the objective, a shower plate of a third aspect of the present invention includes:
a first member;
a second member which is overlapped and joined to the first member;
a groove formed at a surface of the first member, the surface facing the second member, and the groove functioning as a flow passage in which a heat medium flows by overlapping with the second member; and
at least one fin formed in the flow passage.
To accomplish the objective, a plasma processing device of a fourth aspect of the present invention includes the shower plate of the third aspect.
According to the present invention, it is possible to provide a shower plate containing a flow path for achieving satisfactory cooling of the shower plate and a plasma device using the same.
100 Plasma processing device
101 Plasma generation chamber (chamber)
101
a Plasma excitation space
101
b Process space
102 Top plate (dielectric plate)
103 Antenna
103
a Waveguide (shield member)
103
b Radial line slot antenna (RLSA)
103
c Slow-wave plate (dielectric)
104 Waveguide tube
104
a Outer waveguide tube
104
b Inner waveguide tube
105 Plasma gas supplying section
106 Substrate holding table
300, 400, 500, 600, 700 Shower plate
301, 401, 501, 601, 701 First flat plate
301
a, 401a, 501a, 601 Flow passages (for process gas)
301
b, 401b, 501b, 601b Vent
302, 402, 502, 602, 702 Second flat plate
303,403,503,603,703 Third flat plate
303
a, 403a, 503a, 603a, 603c, 703a Flow passages (for heat medium)
304, 404, 504, 604 Process gas feed passage
305, 405, 505, 605 Process gas inlet
503
b, 503c Fin
603
b Barrier
Embodiments of shower plates of the present invention and a plasma processing device using the same are explained, using figures. In these embodiments, explanation is offered, using shower plates employed in a microwave plasma CVD device as an example.
Configuration of a plasma processing device employing a shower plate of a first embodiment of the present invention is shown in
The plasma processing device 100 is composed of a plasma generating chamber (chamber) 101, a top plate (dielectric plate) 102, an antenna 103, a waveguide tube 104, a plasma gas supplying section 105 and a substrate holding table 106. The antenna 103 is composed of a waveguide (shield member) 103a, a radial line slot antenna (RLSA) 103b and a Slow-wave plate (dielectric) 103c. The waveguide tube 104 is a coaxial waveguide tube composed of an outer waveguide tube 104a and an inner waveguide tube 104b.
The plasma generating chamber 101 of the plasma processing device 100 is covered with the top plate 102 made of a dielectric material such as quartz or alumina that transmits microwave. The inside of the plasma generating chamber 101 is maintained in vacuum state by a vacuum pump. The antenna 103 is provided above the top plate 102.
The waveguide tube 104 is connected to the antenna 103. The waveguide 103a of the antenna 103 is connected to the outer waveguide tube 104a of the waveguide tube 104. The radial line slot antenna 103b of the antenna 103 is connected to the inner waveguide tube 104b. The Slow-wave plate 103c is positioned between the waveguide 103a and the radial line slot antenna 103b and constricts wavelength of the microwave. The Slow-wave plate may be constructed from a dielectric material such as quartz, alumina and etc.
Microwave is supplied from a microwave source via the waveguide tube 104. The microwave is transmitted in the radial direction between the waveguide 103a and the radial line slot antenna 103b, and emitted from the slot of the radial line slot antenna 103b.
The plasma gas supplying section 105 is provided below the top plate 102. Vents are provided in the plasma gas supplying section 105, and plasma excitation gas is discharged into the plasma excitation space 101a through these vents. Plasma excitation gas containing, for example, argon (Ar), krypton (Kr), xenon (Xe) and etc. is supplied from the plasma gas supplying section 105 to the plasma excitation space 101a, and the plasma gas is excited by microwave to generate plasma.
The shower plate 300 is provided below the plasma excitation space 101a in the chamber 101. The shower plate 300 is made of a metal such as stainless steel, aluminum and etc. As shown in
Since the shower plate becomes hot during plasma processing, a plurality of flow passages 303a are provided in the shower plate 300 for passing a heat medium. In this first embodiment, the flow passages 303a are provided by bending at an angle of 90° which is the angle of the intersections of the lattice. Based on this, the shower plate 300 is divided into fan-shaped areas Z1-Z4 with a central angle of 90°, and a heat medium whose temperature has been adjusted for the temperature of each area Z1-Z4 is introduced into the flow passage 303a. With this, it becomes possible to adjust the temperature of the shower plate 300 for each of the areas Z1-Z4. Moreover, as shown in
When forming an oxide film, a nitride film, or an oxynitride film of silicon on a silicon wafer, O2, NH3, N2, H2 or etc. is supplied as process gas from the shower plate 300 to the process space 101b. When carrying out an etching process on a silicon wafer or etc., fluorocarbon or etc. is supplied as process gas.
In the first embodiment, the shower plate 300 is constituted with three flat plates, namely, a first plate 301, a second flat plate 302 and a third flat plate 303. The shower plate 300 is formed by thermal-diffusion-welding these flat plates. Concretely, as shown in
Further, as shown in
The second flat plate 302 is formed so that the lattice intersects at 90° in the middle region as shown in
The third flat plate 303 is formed such that the lattice intersects at 90° in the middle region (central area) as shown in
As evident from
In addition, in this first embodiment, the shower plate 300 is divided into four regions almost uniform from the centre, and it is possible to regulate temperature, flow rate and etc. of the heat medium according to the temperature in each region of the shower plate. By this, a better temperature control is possible based on the temperature of the shower plate. In other words, in this first embodiment, not only is the cooling efficiency in the middle region improved, but the temperature uniformity in the shower plate can also be improved since a better temperature control is possible in response to the temperature in each region of the shower plate.
The shower plate 400 of the second embodiment of the present invention is shown in
The shower plate of this second embodiment differs from the shower plate 300 of the first embodiment with regard to the configuration of the flow passages for the heat medium flow. Detailed descriptions that are common with the shower plate of the first embodiment will be omitted.
Similar to the first embodiment, the shower plate 400 of this second embodiment is composed of a first flat plate 401, a second flat plate 402 and a third flat plate 403. The middle regions of each flat plate are formed as lattices intersecting at 90°. In this second embodiment, the temperature control is also done by dividing the shower plate into four regions Z1-Z4. To achieve the uniform process in the plate, flow passages 401a and vents 401b for process gas supply are provided in each of the four regions Z1-Z4 and in the middle region of the first flat plate 401. Similar to the first embodiment, the process gas is supplied to the flow passages 401a through the process gas feed passage 404 and the process gas inlets 405.
In each region of the third shower plate 403, two flow passages 403a are provided for heat medium. In this second embodiment, the cross sectional area of the flow passage 403a in the vicinity of the inlet of the heat medium is made smaller than the cross sectional area of the flow passage 403a in the area except in the vicinity of the inlet. Due to this, the side wall of the flow passage 403a is bent in a plane parallel to a joint surface of the third shower plate 403 and the second shower plate 402. For example, as shown in
In the shower plate 400 of this second embodiment, by making smaller the cross sectional area of the flow passage near the inlet of the heat medium, the cooling efficiency is improved, and the temperature in the shower plate can be efficiently controlled to be uniform. As explained above, the temperature in the middle region of the shower plate more easily become high than that of the peripheral region. By narrowing the flow passage of the shower plate near the heat medium inlet, the contact area of the heat medium, which is the heat conduction area, can be reduced. By this, a decrease of the cooling efficiency due to temperature elevation of the heat medium can be avoided before the heat medium, which is introduced into the shower plate, reaches the high temperature middle region.
The shower plate of the third embodiment of the present invention is shown in
The shower plate of this embodiment differs from the shower plate of the second embodiment in that fins are provided in the flow passages of the heat medium. Detailed descriptions that are common with the shower plates of the above embodiments will be omitted.
Similar to the first embodiment, the shower plate 500 of this third embodiment is composed of a first flat plate 501, a second flat plate 502 and a third flat plate 503. The middle regions of each flat plate are formed such that lattices intersect at 90°. Similar to the first embodiment, even in this third embodiment, the temperature control is also performed by dividing the shower plate into four regions Z1-Z4. To achieve the uniform process in the plate, flow passages 501a and vents 501b for supplying process gas are provided in each of the four regions Z1-Z4 and in the middle region of the first flat plate 501. Similar to the second embodiment, the process gas is supplied to the process gas flow passages 501a through the process gas feed passage 504 and the process gas inlets 505.
In each region of the third shower plate 503, two flow passages 503a are provided for heat medium. Similar to the second embodiment, in this third embodiment, the cross sectional area of the flow passage 503a in the vicinity of the inlet of the heat medium is made smaller than the cross sectional area of the flow passage 503a in the area except in the vicinity of the inlet.
In this third embodiment, as shown in
By providing the fins in the flow passages as in this third embodiment, the contact area of the heat medium can be increased in the region where the fins are provided. By this, it is possible to increase the cooling efficiency. In addition, in this embodiment, fins are provided only in the middle region of the shower plate. Due to this, it is possible to decrease the contact area of the heat medium in the peripheral region, where the temperature is lower than that in the middle region, compared to the contact area in the middle region. Accordingly, it is possible to further improve the cooling efficiency in the middle region of the shower plate, where the temperature becomes high.
The shower plate 600 of the fourth embodiment of the present invention is shown in
Similar to the first embodiment, the shower plate 600 of this fourth embodiment is composed of a first flat plate 601, a second flat plate 602 and a third flat plate 603. The middle regions of each flat plate are formed as lattices intersecting at 90°. Similar to the first embodiment, in this fourth embodiment, the temperature control is also done by dividing the shower plate into four regions Z1-Z4. To achieve uniform process in the plate, flow passages 601a and vents 601b for supplying process gas are provided in each of the four regions Z1-Z4 and in the middle region of the first flat plate 601. Similar to the second embodiment, the process gas is supplied to the flow passages through a process gas feed passage 604 and process gas inlets 605.
In each region of the third shower plate 603, two flow passages 603a and 603c for heat medium are provided in one lattice, and each flow passage is separated by a barrier wall 603b as shown in
The barrier wall, for example as shown in
By providing the two flow passages for heat medium in a single lattice, it is possible to increase the number of flow passages provided in the shower plate and thus to improve the cooling efficiency.
In addition, in this embodiment as shown in
The present invention is not limited to the embodiments described above, and various modifications and applications are possible. In the embodiments described above, although the explanation was offered with the examples of the configuration of the shower plates assembled from flat members, it is not limited to this, and the members can be curved.
It is possible to suitably combine the various features of the above embodiments. For example, it is possible to provide two flow passages on a single lattice as in the fourth embodiment, to vary the width of these flow passages as in the second embodiment, and to further provide fins in the flow passage as in the third embodiment. In addition, after providing two flow passages on a single lattice as in the fourth embodiment, it is possible to provide a fin in each flow passage.
In the embodiments explained above, examples of the shower plates were offered with orthogonally intersecting lattices, but the present invention is not limited to this configuration. For example, as a shower plate 700 shown in
Further, in the second embodiment, though the explanation was offered with the case in which the flow passage is bent similar to that in the first embodiment, it is not limited to this and the flow passage may be provided linearly to laterally cross the shower plate. Moreover, when providing a narrow flow passage near the inlet, it is not limited to the configuration of narrowing the width, and the depth may be made shallow. Also both the width and depth may be varied. Furthermore, in the second embodiment, explanation was offered with the configuration example of varying the width of the flow passage in two stages of width 3w and width w. However, the width of the flow passage may also be varied by dividing into three stages of w, 2w and 3w, and further, may also be varied in multiple stages.
In the third embodiment, though the explanation was offered with the case in which the flow passage is bent similar to that in the first embodiment, it is not limited to this, and the flow passage may also be provided linearly. Further, the numbers of fins, height and etc. are optional. For example, as shown in
In the fourth embodiment, though the explanation was offered with the case in which the flow passage is bent similar to that in the first embodiment, it is not limited to this, and the flow passage may be provided on a straight line. Further, in the fourth embodiment, although a configuration of the two flow passages in a single lattice was offered, it is not limited to this, and it is possible to provide three or more flow passages. Further, as shown in
Further, in the flow passages in each embodiment described above, the inner surface of the flow passage that contacts with the heat medium may be roughened to enhance the contact area of the heat medium or to cause a turbulence of the heat medium so as to improve the cooling efficiency.
In all the above embodiments, explanation was offered with the examples of a configuration constituted with three plates. However, it is not limited to this, and it can be two plates or four or more plates. Further, in each of the embodiments described above, explanation was offered with examples, in which the flow passages for process gas are provided in the first flat plate, flow passages for heat medium are provided in the third flat plate, and there are no flow passages provided in the second flat plate. However, it is not limited to this and, for example, it is possible to provide a part of the flow passage for process gas on a side of the second flat plate facing the first flat plate. Similarly, the flow passage for heat medium may be provided on a side of the second flat plate facing the third flat plate. Furthermore, the flow passage for process gas may be provided in the first flat plate, and the flow passage for heat medium may be provided on a side of the second flat plate facing the third flat plate.
In addition, in each embodiment described above, examples were offered with the cases in which each plate was cut into lattice shape, and the shape demarcated by the ridges of the lattice becomes the openings for plasma passage. However, the shape of these openings is not limited to that described in the embodiments described above. The planar shape of the opening is arbitrarily designed, and for example, it is possible to form in a round shape.
In the embodiments described above, a microwave plasma processing device was offered as an example of plasma processing devices. However, it is not limited to this, and it is also possible to use various types of plasma processing devices such as a parallel plate high frequency excitation plasma processing device, an inductively coupled plasma processing device, and etc.
Moreover, in the embodiments described above, although the examples were offered with cases in which a heat medium cooled by a cooling device is used, it is not limited to this, and a heated heat medium may also be used to control the temperature of the shower plate.
The embodiments disclosed herein should be construed as exemplifications in any respect and not as limiting. The scope of the present invention is not indicated by the above descriptions but is indicated by the claims, and it is intended that the scope of the present invention includes all modifications within the scope of the claims and their equivalents.
The present application is based on Japan Patent Application No. 2008-076429 submitted on Mar. 24, 2008. All the specification, claims and drawings of the Japan Patent Application No. 2008-076429 are incorporated in the present specification by reference.
Number | Date | Country | Kind |
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2008-076429 | Mar 2008 | JP | national |
This application is a national phase application under 35 U.S.C. §371 of International Application Serial No. PCT/JP2009/054336, filed on Mar. 6, 2009, and claims the priority benefit under 35 U.S.C. §119 of Japanese Patent Application No. 2008-076429, filed on Mar. 24, 2008, which are hereby expressly incorporated by reference in their entirety for all purposes.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2009/054336 | 3/6/2009 | WO | 00 | 9/24/2010 |