Claims
- 1. A method for fabricating high precision, thermally stable electromagnetic coil vanes, comprising the steps of:
drilling a through hole in a substrate; depositing a thin layer of a metal over an entire surface of opposing surfaces of the substrate; depositing a resist and photolithographically forming wire patterns in the thin layer of metal on the opposing surfaces of the substrate; depositing a metal on the wire patterns until a desired thickness is obtained; removing the resist and the thin metal layer deposited on each of the opposing surfaces of the substrate; and heating the substrate and the deposited metal thereon to bond the metal to the substrate.
- 2. The method as recited in claim 1, wherein the bond is a eutectic bond.
- 3. The method as recited in claim 1, that further includes the step of depositing the thin layer of metal in the through hole.
- 4. A method as recited in claim 1, wherein the wire patterns have a ratio of a wire width to a gap of at least 2.5:1.
- 5. The method as recited in claim 1, wherein the substrate has a low coefficient of thermal expansion.
- 6. The method as recited in claim 5, wherein the substrate is ceramic.
- 7. The method as recited in claim 1, wherein the deposited thin metallic layer comprises copper.
- 8. The method as recited in claim 7, wherein the deposited thin metallic layer has a thickness of 2-3 microns.
- 9. The method as recited in claim 1, wherein the deposited thick metallic layer comprises copper.
- 10. The method as recited in claim 1, wherein the deposited thin metallic layer is applied by electroless deposition.
- 11. The method as recited in claim 1, wherein the thick metal layer is applied by electrolytic plating.
- 12. The method as recited in claim 1, wherein the heating is done at a temperature substantially equal to the melting point of a eutectic composition of copper and an oxide of the copper.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to U.S. patent application Ser. Nos. 09/324,899, filed Jun. 3, 1999, by Rodney Kendall for “Toroidal Charged particle Deflector With High Mechanical Stability and Accuracy” (Nikon Corporation Docket NC98-592), and 09/325,162, filed Jun. 3, 1999, by Rodney Kendall and David Pinckney for “Fabrication Method of High Precision, Thermally Stable Electromagnetic Coil Vanes” (Nikon Corporation Docket NC98-591), and assigned to a common assignee herewith. U.S. patent application Ser. Nos. 09/324,899 and 09/325,162 are incorporated herein by reference.