Claims
- 1. A photosensitive composition comprising:(a) a cycloaliphatic diepoxide; (b) a polyfuntional (meth)acrylate selected from the group consisting of 1,4 cyclohexanedimethanol diacrylate, dipentaerythritol monohydroxypenta(meth)acrylate, and trimethylolpropane triacrylate; (c) a polytetrahydrofuran polyether polyol having a molecular weight in the range of 250 to 2900; (d) at least one cationic photoinitiator; (e) at least one free-radical photoinitiator; and (f) an acrylate of bisphenol A diepoxide.
- 2. The composition of claim 1, wherein the molecular weight of said polytetrahydrofuran polyether polyol is about 1,000.
- 3. The composition of claim 1, wherein said composition, after full cure by radiation and optionally heat, has a tensile modulus in the range of 180 to 850 N/mm2.
- 4. The composition of claim 1, wherein said composition, after full cure by radiation and optionally heat, has a tensile break elongation before yield or a tensile yield elongation greater than 6%.
- 5. The composition of claim 1, wherein said composition, after full cure by radiation and optionally heat, has a notched Izod impact strength greater than 50 J/m.
- 6. The composition of claim 1, wherein said composition, after full cure by radiation and optionally heat, has a tensile break before yield stress or a tensile yield stress greater than 13 N/mm2.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of U.S. application Ser. No. 09/113,271, filed Jul. 10, 1998 now U.S. Pat. No. 6,287,748, the contents of which are hereby incorporated in their entirety by reference. U.S. application Ser. No. 09/113,271 has issued on Sep. 11, 2001, as U.S. Pat. No. 6,287,748.
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Continuations (1)
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Parent |
09/113271 |
Jul 1998 |
US |
Child |
09/919997 |
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US |