Claims
- 1. A process for separating a common printed wiring board substrate into a plurality of substrates having at least one circuit connector connected between the substrates, comprising:(a) forming at least one notch in a beveled edge of a separation tool; (b) aligning at least one notch with at least one circuit connector; and (c) applying pressure between the separating tool and the common substrate.
- 2. The process of claim 1, wherein there are a plurality of circuit connectors and wherein the step of aligning further comprises aligning a notch in the beveled edge with each circuit connector.
- 3. The process of claim 1, wherein the step of applying pressure comprises applying sufficient pressure to cause the common substrate to separate in to a plurality of substrates.
- 4. The process of claim 1, wherein the location of at least one notch is adjustable and wherein the step of forming further comprises selecting a location for at least notch to enable alignment of the notch with at least one circuit connector.
CROSS REFERENCE TO CO-PENDING APPLICATIONS
This application is a divisional of application(s) Ser. No(s). 09/746,494, filed Dec. 21, 2000.
This application is related to US co-pending application, D/A0637, entitled “PROCESS FOR CONTEMPORANEOUS MANUFACTURE AND INTERCONNECTION BETWEEN ADJOINING PRINTED WIRING BOARDS”, filed concurrently herewith.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
789444 |
Dec 1980 |
SU |