Claims
- 1. A substrate for circuit board comprising:
- a layer made of a resin;
- a reinforcing member embedded in said layer, said reinforcing member composed of glass fibers which are made from a glass composition,
- said glass composition comprising at least 85 mol % of an oxide mixture, said oxide mixture consisting essentially of:
- 40 to 65 mol % of SiO.sub.2 ;
- MgO, CaO, SrO and BaO in amounts which total 20 to 45 mol % of said oxide mixture;
- TiO.sub.2 and ZrO.sub.2 in amounts which total 5 to 25 mol % of said oxide mixture;
- 0.5 to 15 mol % of NbO.sub.5/2 ;
- said composition having a dielectric constant .epsilon..sub.r of 9 or more at 1 MHz and 25.degree. C.; and
- said composition being characterized to show a devitrification temperature which is lower than a spinning temperature at which said composition exhibits a viscosity of 10.sub.2.5 poise.
- 2. A substrate for circuit board comprising:
- a layer made of a resin;
- a reinforcing member embedded in said layer, said reinforcing member composed of glass fibers which are made from a glass composition,
- said glass composition comprising at least 85 mol % of an oxide mixture, said oxide mixture consisting essentially of: 40 to 65 mol % of SiO.sub.2 ;
- Cao SrO and Bao in amounts which total 20 to 45 mol % of said oxide mixture;
- TiO.sub.2 and ZrO.sub.2 in amounts which total 5 to 25 mol % of said oxide mixture;
- 0.5 to 15 mol % of NbO.sub.5/2 ;
- 0.5 to 15 mol % of AlO.sub.3/2 ;
- said composition having a dielectric constant .epsilon..sub.r of 9 or more at 1 MHz and 25.degree. C.; and
- said composition being characterized to show a devitrification temperature which is lower than a spinning temperature at which said composition exhibits a viscosity of 10.sub.2.5 poise.
- 3. A substrate for circuit board as set forth in claim 1 or 2, wherein said reinforcing member is provided in the form of a glass cloth which is a woven fabric of said glass fibers.
- 4. A substrate for circuit board as set forth in claim 1 or 2, wherein said reinforcing member is provided in the form of a glass mat which is a unwoven fabric of said glass fibers.
- 5. A substrate for circuit board as set forth in claim 1 or 2, wherein said resin comprises a polyphenylene oxide composition comprising polyphenylene oxide and at least one member selected from the group consisting of cross-linking polymer and cross-linking monomer.
- 6. A substrate for circuit board as set forth in claim 5, wherein said resin comprises at least 7% by weight, based the total weight of the of polyphenylene oxide composition, of polyphenylene oxide.
- 7. A substrate for circuit board as set forth in claim 5, wherein said cross-linking polymer comprises at least one constituent selected from the group consisting of 1.2-polybutadiene, 1.4-polybutadiene, styrene-butadiene copolymer, denatured 1.2-polybutadiene, and rubbers.
- 8. A substrate for circuit board as set forth in claim 5, wherein said cross-linking monomer comprises at least one constituent selected from the group consisting of ester acrylate, epoxy acrylate, urethane acrylate, ether acrylate, melamine acrylate, alkyd acrylate, silicon acrylate, triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, divinyl benzene, diallyl phthalate, vinyl toluene, ethyl vinyl benzene, styrene, paramethylstyrene, and multifunctional epoxy.
- 9. A substrate for circuit board as set forth in claim 2, further comprising inorganic dielectric particles dispersed in said layer of resin.
- 10. A substrate for circuit board as set forth in claim 9, wherein said inorganic dielectric particles are substantially non-porous particles having an average particle size of 1 to 5 .mu.m and a specific surface area of 0.2 to 3.0 m.sup.2 /g.
- 11. A substrate for circuit board as set forth in claim 9, wherein said inorganic dielectric particles are porous particles.
- 12. A substrate for circuit board as set forth in claim 11, wherein said inorganic dielectric particles have an average particle size of 5 to 100 .mu.m and a specific surface area of 0.3 to 7.0 m.sup.2 /g.
- 13. A substrate for circuit board as set forth in claim 11, wherein said inorganic dielectric particles are agglomerated particles formed from primary particles thereof.
- 14. A substrate for circuit board as set forth in claim 13, wherein said agglomerated particles are formed by sintering of said primary particles.
- 15. A substrate for circuit board as set forth in claim 13, wherein said agglomerated particles are formed by sintering of said primary particles in the presence of a sintering aid.
- 16. A substrate for circuit board as set forth in claim 9, wherein said inorganic dielectric particles comprise a compound having a perovskite crystalline structure.
Priority Claims (4)
Number |
Date |
Country |
Kind |
3-017747 |
Feb 1991 |
JPX |
|
3-142163 |
Jun 1991 |
JPX |
|
3-143465 |
Jun 1991 |
JPX |
|
3-145901 |
Jun 1991 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 07/832,267 filed Feb. 7, 1992 now U.S. Pat. No. 5,284,807.
US Referenced Citations (9)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0013379 |
Jul 1980 |
EPX |
0227269 |
Jul 1987 |
EPX |
1561647 |
Feb 1969 |
FRX |
2172892A |
Oct 1986 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Patent Abstracts of Japan, vol. 13, No. 461 (C-645) Oct. 18, 1989 & JP-A-01 179 741, Jul. 17, 1989. |
Wold Patents Index Latest, Week 03, Derwent Publications Ltd., AN 90-096954 & JP-A-2 050 834, Feb. 20, 1990. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
832267 |
Feb 1992 |
|