SUBSTRATE PROCESSING APPARATUS

Abstract

A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a substrate replacement group. The substrate replacement group has a stack of three cleaning/drying processing units. The cleaning/drying processing unit subjects the substrate after exposure processing to cleaning and drying processing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a substrate processing apparatus according to a first embodiment of the present invention;

FIG. 2 is a schematic side view of the substrate processing apparatus shown in FIG. 1 as viewed from the +X direction;

FIG. 3 is a schematic side view of the substrate processing apparatus shown in FIG. 1 as viewed from the −X direction;

FIG. 4 is a schematic side view of an interface block as viewed from the +Y side;

FIG. 5 is a diagram for explaining the configuration of a cleaning/drying processing unit;

FIG. 6 is a diagram for explaining the operation of the cleaning/drying processing unit;

FIG. 7 is a schematic view showing a nozzle for cleaning processing and a nozzle for drying processing that are integrally formed;

FIG. 8 is a schematic view showing another example of a nozzle for drying processing;

FIG. 9 is a diagram for explaining a method of subjecting a substrate to drying processing using the nozzle for drying processing shown in FIG. 8;

FIG. 10 is a schematic view showing another example of a nozzle for drying processing;

FIG. 11 is a schematic view showing another example of a cleaning/drying processing unit;

FIG. 12 is a diagram for explaining a method of subjecting a substrate to drying processing using the cleaning/drying processing unit shown in FIG. 11;

FIG. 13 is a vertical sectional view showing an example of the internal configuration of a two-fluid nozzle used for cleaning and drying processing; and

FIG. 14 is a diagram for explaining a method of subjecting a substrate to cleaning and drying processing using the two-fluid nozzle shown in FIG. 13.

Claims

1. A substrate processing apparatus that is arranged adjacent to an exposure device, comprising: a processing section for subjecting a substrate to processing; andan interface that transfers and receives the substrate between said processing section and said exposure device,said interface including a drying processing unit that subjects the substrate to drying processing after exposure processing by said exposure device,a platform on which the substrate is temporarily placed,a first transport unit that transports the substrate among said processing section, said platform, and said drying processing unit, anda second transport unit that transports the substrate among said platform, said exposure device, and said drying processing unit,said second transport unit carrying the substrate after the exposure processing by said exposure device into said drying processing unit,said first transport unit carrying the substrate after the drying processing by said drying processing unit out of said drying processing unit.

2. The substrate processing apparatus according to claim 1, wherein said drying processing unit subjects the substrate to cleaning processing before subjecting the substrate to the drying processing.

3. The substrate processing apparatus according to claim 1, wherein said interface further includes a cleaning processing unit that subjects the substrate to cleaning processing before the exposure processing by the exposure device, andsaid first transport unit transports the substrate among said processing section, said cleaning processing unit, said platform, and said drying processing unit.

4. The substrate processing apparatus according to claim 3, wherein said cleaning processing unit subjects the substrate to the drying processing after subjecting the substrate to the cleaning processing.

5. The substrate processing apparatus according to claim 1, wherein said platform is a temperature control waiting unit that makes the substrate before the exposure processing by said exposure device wait until the substrate can be carried into said exposure device while keeping the substrate at a predetermined temperature.

6. The substrate processing apparatus according to claim 1, wherein said second transport unit includes first and second holders that each hold the substrate,said first holder holds, when the substrate before the exposure processing by said exposure device is transported, the substrate, andsaid second holder holds, when the substrate after said exposure processing is transported, the substrate.

7. The substrate processing apparatus according to claim 6, wherein said second holder is provided below said first holder.