One or more embodiments relate to a substrate mounting unit and a substrate processing apparatus including the same, and more particularly, to a substrate mounting unit for preventing deterioration of process uniformity due to sagging or deformation of a chamber at a high temperature, and a substrate processing apparatus including the substrate mounting unit.
A substrate processing apparatus for processing a semiconductor or display substrate, such as a chemical vapor deposition (CVD) reactor or an atomic layer deposition (ALD) reactor, includes a gas supply unit, a substrate support unit, an exhaust unit, and other accessory components. In order to maintain smooth substrate handling and stable process results, the components need to be properly placed in designated locations within the reactor. However, in a high-temperature process, the components may be dislocated from the designated locations within the reactor or may be out of alignment with each other due to thermal expansion or vacuum force applied to the reactor or components constituting the reactor. In this case, a stable substrate process is difficult.
For example, thermal deformation of a reactor lid including a gas supply unit may cause a distance between the gas supply unit and an oppositely arranged substrate support unit to become inconsistent with location, thereby reducing the uniformity of a thin film deposited on a substrate. In addition, exhaust flow of gas within a reaction space becomes non-uniform due to thermal deformation at high temperatures and due to a mismatch in the center of symmetry between the substrate support unit and the reactor components surrounding the substrate support unit.
In addition, in contrast to the environment (i.e., room temperature and atmospheric pressure) in which the initial installation and maintenance of the substrate processing apparatus takes place, in the case of high temperature and vacuum conditions under which substrate processing is performed, misalignment of the substrate support unit occurs due to thermal deformation or vacuum force applied to the substrate processing apparatus. Accordingly, there is a problem in that the symmetry of arrangement with respect to the components in the reactor is lost.
One or more embodiments include maintaining a constant gap between a gas supply unit and a substrate mounting unit arranged opposite thereto, that is, a reaction space, under a high temperature and/or vacuum environment.
One or more embodiments include maintaining a constant gap between a substrate mounting unit and a gas flow control unit surrounding the substrate mounting unit under a high temperature and/or vacuum environment.
One or more embodiments include adjusting and correcting a position of a substrate mounting unit under a substrate processing temperature without lowering the temperature of a substrate processing apparatus.
Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments of the disclosure.
According to one or more embodiments, a substrate processing apparatus includes: a first plate; a second plate on the first plate; a position control unit configured to change a relative position of the second plate with respect to the first plate; and a support unit configured to permit movement of the second plate while supporting the second plate.
According to an example of the substrate processing apparatus, the support unit may be configured to prevent an over-constraint state of the second plate by the position control unit.
According to another example of the substrate processing apparatus, the support unit may include an elastic member configured to generate an elastic force that changes according to the movement of the second plate.
According to another example of the substrate processing apparatus, the substrate processing apparatus may include a substrate mounting unit connected to the second plate; and a driving unit connected to the first plate, wherein a first moving range of the substrate mounting unit moved by the driving unit may be greater than a second moving range of the substrate mounting unit moved by the position control unit.
According to another example of the substrate processing apparatus, the position control unit may include a vertical position control unit configured to vertically move the second plate with respect to the first plate.
According to another example of the substrate processing apparatus, the substrate processing apparatus may further include a bracket connected to the first plate, wherein the vertical position control unit may be fixed to the bracket and configured to apply a force toward an upper surface of the second plate.
According to another example of the substrate processing apparatus, the support unit may be below the vertical position control unit.
According to another example of the substrate processing apparatus, the substrate processing apparatus may further include a lower cover connected to the first plate, wherein the support unit may extend from the lower cover toward the second plate through a through hole of the first plate, and a side surface of the support unit may be apart from a side surface of the through hole.
According to another example of the substrate processing apparatus, the support unit may extend through at least a portion of the second plate, and the side surface of the support unit may be apart from a side surface of the second plate.
According to another example of the substrate processing apparatus, the substrate processing apparatus may further include a substrate mounting unit connected to the second plate, and the position control unit may further include a horizontal position control unit configured to horizontally move the second plate with respect to the first plate, wherein the horizontal position control unit may be configured to perform a compensating operation for horizontal movement of the substrate mounting unit caused by tilting of the second plate by the movement of the vertical position control unit.
According to another example of the substrate processing apparatus, a length from the center of the second plate to a contact point between the second plate and the vertical position control unit may be a first length, a length from the second plate to the substrate mounting unit may be a second length, and the vertical position control unit may move by a third length at the contact point, wherein the horizontal position control unit may be configured to move the second plate by a value obtained by multiplying the second length by the third length and dividing the first length.
According to another example of the substrate processing apparatus, the position control unit may include a horizontal position control unit configured to horizontally move the second plate with respect to the first plate.
According to another example of the substrate processing apparatus, the support unit may be arranged on a side surface of the second plate.
According to another example of the substrate processing apparatus, the substrate processing apparatus may further include a first bracket connected to the first plate, wherein the vertical position control unit may be fixed to the first bracket and configured to apply a force toward a side surface of the second plate.
According to another example of the substrate processing apparatus, the support unit may include an elastic member and an elastic force transmission unit connected to the elastic member, wherein the elastic force transmission unit may be configured to apply an elastic force generated by the elastic member to the side surface of the second plate.
According to another example of the substrate processing apparatus, the substrate processing apparatus may further include a second bracket connected to the first plate, wherein the elastic member and the elastic force transmission unit may be inserted into an accommodating portion of the second bracket, and the elastic force transmission unit may protrude from the side surface of the second bracket through the receiving part of the second bracket and contact a side surface of the second plate.
According to another example of the substrate processing apparatus, the elastic force transmission unit may have a round end, and the end of the elastic force transmission unit and an end of the horizontal position control unit may be configured to contact the side surface of the second plate at the same level.
According to another example of the substrate processing apparatus, the elastic force transmission unit may include: a body portion inserted into the elastic member; a round portion connected to the body portion; and an extension protruding from the body portion, wherein the extension may be in contact with the elastic member.
According to another example of the substrate processing apparatus, the horizontal position control unit may include two position control units arranged on a side surface of the second plate, wherein the two position control units and the support unit may be symmetrically arranged with respect to the center of the second plate, and as the two position control units move toward the center of the first plate by a first distance, the second plate may move toward the support unit by a second distance, wherein the second distance may be twice the first distance.
According to another example of the substrate processing apparatus, the second plate may include a first protrusion, a second protrusion, and a third protrusion, the position control unit may include a first position control unit on the first protrusion, a second position control unit on the second protrusion, a third position control unit on the third protrusion, a fourth position control unit next to the first protrusion, and a fifth position control unit next to the second protrusion, and the support unit may include a first support unit next to the third protrusion, a second support unit below the first position control unit, a third support unit below the second position control unit, and a fourth support unit below the third position control unit.
According to one or more embodiments, a substrate processing apparatus includes: a first plate including a first bracket, a second bracket, and a third bracket; a second plate arranged on the first plate and including a first protrusion, a second protrusion, and a third protrusion; a first position control unit arranged between the first bracket and an upper surface of the first protrusion; a second position control unit arranged between the second bracket and an upper surface of the second protrusion; a third position control unit arranged between the third bracket and an upper surface of the third protrusion; a fourth position control unit arranged between the first bracket and a side surface of the first protrusion; a fifth position control unit arranged between the second bracket and a side surface of the second protrusion; a first support unit arranged between the third bracket and a side surface of the third protrusion; a second support unit below the first position control unit; a third support unit arranged below the second position control unit; and a fourth support unit below the third position control unit.
According to one or more embodiments, a substrate processing apparatus includes: a first plate; a second plate on the first plate; a position control unit configured to move the second plate with respect to the first plate; and a support unit configured to provide an elastic force to receive the movement of the second plate by the position control unit.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein like reference numbers refer to like elements throughout. In this regard, the present embodiment may have different forms and should not be construed as being limited to the description described herein. Accordingly, embodiments are only described below with reference to the drawings to illustrate aspects of the present description. As used herein, the term “and/or” includes any and all combinations of one or more associated listed items. When an expression such as “at least one” precedes a list of elements, the entire list of elements is modified, not individual elements of the list.
Hereinafter, embodiments of the disclosure will be described in detail with reference to the accompanying drawings.
In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Rather, these embodiments are provided so that the disclosure will be thorough and complete, and will fully convey the scope of the disclosure to one of ordinary skill in the art.
The terminology used herein is for describing particular embodiments and is not intended to limit the disclosure. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “includes”, “comprises” and/or “including”, “comprising” used herein specify the presence of stated features, integers, steps, processes, members, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, processes, members, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, etc. may be used herein to describe various members, components, regions, layers, and/or sections, these members, components, regions, layers, and/or sections should not be limited by these terms. These terms do not denote any order, quantity, or importance, but rather are only used to distinguish one component, region, layer, and/or section from another component, region, layer, and/or section. Thus, a first member, component, region, layer, or section discussed below could be termed a second member, component, region, layer, or section without departing from the teachings of embodiments.
Embodiments of the disclosure will be described hereinafter with reference to the drawings in which embodiments of the disclosure are schematically illustrated. In the drawings, variations from the illustrated shapes may be expected because of, for example, manufacturing techniques and/or tolerances. Thus, the embodiments of the disclosure should not be construed as being limited to the particular shapes of regions illustrated herein but may include deviations in shapes that result, for example, from manufacturing processes.
Referring to
The reactor may be configured to perform processing on an object to be processed, such as a substrate. For example, the reactor may be configured to perform heating, deposition, etching, polishing, ion implantation, and/or other processing on the object to be processed. In some embodiments, the reactor may be configured to perform a movement function, a vacuum sealing function, a heating function, an exhaust function, and/or other functions for the object to be processed such that the object is processed in the reactor. In an optional embodiment, the reactor may be a reactor in which an atomic layer deposition (ALD) or a chemical vapor deposition (CVD) process is performed.
The upper body 1600 of the reactor may include a first gas inlet 100, a gas supply unit 200, an exhaust unit 600, and the ring 800. The lower body 1300 of the reactor may include a second gas inlet 900. The upper body 1600 and the substrate mounting unit 300 may form the reaction space 500. The lower body 1300 and the substrate mounting unit 300 may form the lower space 1000. A second gas generator 1900 may generate a filling gas, and the filling gas may be transmitted to the lower space 1000 through the second gas inlet 900.
The ring 800 may surround the substrate mounting unit 300 and may be arranged between the substrate mounting unit 300 and the upper body 1600. The ring 800 may generally have a circular ring shape, but is not limited thereto. For example, when the substrate mounting unit 300 has a quadrangular shape, the ring 800 may have a quadrangular ring shape. The ring 800 may be fixed to the upper body 1600. In an optional embodiment, the ring 800 may be movably installed on the upper body 1600.
A gap G may be between the ring 800 and the substrate mounting unit 300. The reaction space 500 and the lower space 1000 may communicate with each other through the gap G. In this case, a filling gas may be introduced into the lower space 1000 through the second gas inlet 900. This filling gas forms a gas curtain in the gap G between the substrate mounting unit 300 and the ring 800 to prevent gas in the reaction space 500 from flowing into the lower space 1000.
In some embodiments, the filling gas may be nitrogen or argon. Alternatively, gas having a lower discharge rate than the gas supplied to the reaction space 500 may be supplied to the lower space 1000 through the second gas inlet 900 in order to prevent parasitic plasma from being generated in the lower space 1000 when the plasma is generated in the reaction space 500.
The ring 800 may be between the upper body 1600 and the substrate mounting unit 300. For example, the ring 800 may be a gas flow control ring (FCR). The ring 800 may control pressure balance between the reaction space 500 and the lower space 1000 by adjusting a width of the gap G between the upper body 1600 and the substrate mounting unit 300.
In more detail, the ring 800 adjusts a width of the gap G between the upper body 1600 and the substrate mounting unit 300, that is, a width of the gap between the ring 800 and the substrate mounting unit 300. Thus, the ring 800 may control a flow rate of a filling gas and a process gas around the gap G, thereby controlling the pressure of the filling gas and process gas.
The substrate mounting unit 300 may include a susceptor body for supporting the substrate and a heater for heating the substrate supported by the susceptor body. For loading/unloading of the substrate, the substrate mounting unit 300 may be configured to be vertically movable by being connected to a driving unit 1100.
The substrate processing apparatus may include a first plate P1 and a second plate P2 arranged between the substrate mounting unit 300 and the driving unit 1100. The first plate P1 may be connected to the driving unit 1100. The second plate P2 may be on the first plate P1, and the first plate P1 and the second plate P2 may be connected to each other through a support unit SU.
The first plate P1, the second plate P2, and the substrate mounting unit 300 may move by the driving of the driving unit 1100. In more detail, a driving force generated by the driving unit 1100 may be transmitted to the first plate P1, and the transmitted driving force may be transmitted from the first plate P1 to the second plate P2 through the support unit SU. As a result, the substrate mounting unit 300 connected to the second plate P2 may also be moved by the driving of the driving unit 1100.
The substrate processing apparatus may further include a position control unit PU and the support unit SU. The position control unit PU may be configured to change a relative position of the second plate P2 with respect to the first plate P1 to maintain a constant interval of the reaction space 500 or to maintain a constant interval of the gap G between the substrate mounting unit 300 and the ring 800.
The driving unit 1100 may be configured to elevate the substrate mounting unit 300 to load/unload the substrate onto the substrate mounting unit 300. However, the position control unit PU may be configured to tilt and/or horizontally move the substrate mounting unit 300 for fine adjustment of the position of the substrate mounting unit 300. In addition, the driving unit 1100 may simultaneously move the first plate P1 and the second plate P2, while the position control unit PU may move only the second plate P2 without moving the first plate P1.
The driving unit 1100 and the position control unit PU may have movement ranges of different scales. The driving unit 1100 may have a movement range of, for example, several tens of cm, while the position control unit PU may have a movement range of several millimeters. In other words, a first movement range of the substrate mounting unit 300 moved by the driving unit 1100 may be greater than a second movement range of the substrate mounting unit 300 moved by the position control unit PU.
The support unit SU may be configured to support the second plate P2. In more detail, a static support function and a dynamic support function for the support unit SU may be performed. First, with respect to the static support function, the support unit SU may be configured to provide a fixing force for fixing the second plate P2 so that the substrate mounting unit 300 may be maintained at a certain intended position. In other words, the support unit SU may perform a function of supporting the second plate P2 so that the second plate P2 may maintain a static state.
With respect to the dynamic support function, when the second plate P2 is moved by the position control unit PU, the support unit SU may allow the second plate P2 to move. The support unit SU may provide a support force for the second plate P2 while allowing the movement of the second plate P2. In other words, the support unit SU may support the second plate P2 with respect to relative movement of the second plate P2 with respect to the first plate P1, and the support unit SU may support the second plate P2 in a dynamic state of the second plate P2.
The support unit SU may be configured to transmit a fixing force of the first plate P1 with respect to the second plate P2 connected to the substrate mounting unit 300. In other words, the support unit SU may connect the first plate P1 to the second plate P2 such that a driving force generated by the driving unit 1100 may be transmitted from the first plate P1 to the second plate P2. A bolt or the like may be used for such a connection mechanism, but it should be noted that the transfer of a fixing force by the bolt or the like makes the second plate P2 over-constrained (i.e., a state that does not allow the movement of the second plate P2), thereby limiting relative movement between the first plate P1 and the second plate P2.
On the other hand, according to embodiments, the support unit SU may prevent the second plate P2 from being over-constrained by the position control unit PU. As described above, when the driving unit 1100 and the substrate mounting unit 300 are mechanically fixed using a bolt or the like, fine adjustment of the substrate mounting unit 300 is impossible due to an over-constrained state. On the other hand, because the support unit SU according to embodiments is configured to prevent such an over-constrained state, fine adjustment of the substrate mounting unit 300 may be achieved.
A stretchable portion 1200 may be between a lower surface of the lower body 1300 and the second plate P2. The stretchable portion 1200 may be arranged between the lower surface of the lower body 1300 and the second plate P2 to isolate the lower space 1000 from the outside.
The stretchable portion 1200 may be stretched and contracted according to movement of the substrate mounting unit 300 and the second plate P2. For example, the stretchable portion 1200 may have a corrugated configuration (e.g., a bellows). When the first plate P1, the second plate P2, and the substrate mounting unit 300 are raised by the driving unit 1100, the stretchable portion 1200 may contract. When the first plate P1, the second plate P2, and the substrate mounting unit 300 are descended by the driving unit 1100, the stretchable portion 1200 may expand.
In an optional embodiment, the stretchable portion 1200 may be configured to have elasticity. For example, the elasticity of the stretchable portion 1200 may be adjusted to be stretched or contracted in response to vertical movement of the substrate mounting unit 300 so that shielding between the lower surface of the lower body 1300 and the second plate P2 may be maintained. Due to the shielding of the stretchable portion 1200, the reaction space 500 and the lower space 1000 (of
A process gas introduced through the first gas inlet 100 may be supplied to the reaction space 500 and the substrate through the gas supply unit 200. The gas supply unit 200 may be a showerhead, and a base of the showerhead may include a plurality of gas supply holes formed to eject the process gas (e.g., in a vertical direction). A process gas supplied on the substrate may undergo a chemical reaction with the substrate or a chemical reaction between gases, and then deposit a thin film or etch a thin film on the substrate.
In a plasma process, radio frequency (RF) power may be electrically connected to the gas supply unit 200 functioning as one electrode. In more detail, an RF rod 400 connected to RF power may be connected to the gas supply unit 200. In this case, upper RF power may be supplied to the gas supply unit 200 through an RF generator, an RF matcher, and the RF rod 400, and a reaction gas introduced into the reaction space 500 through the first gas inlet 100 may be activated to generate plasma.
In the reaction space 500, a residual gas or un-reacted gas remaining after the chemical reaction with the substrate may be exhausted to the outside through an exhaust space 700 in an exhaust duct 600 and an exhaust pump (not shown). An exhaust method may be upper exhaust or lower exhaust.
Referring to
The position control unit PU may include a fixed body fixed to the first plate P1 and a moving body configured to move to change a length of the position control unit PU. In some embodiments, the moving body may include a round end, and the end may contact the substrate mounting unit 300 to form a contact point.
The support unit SU may include an elastic member. The elastic member may be configured to generate an elastic force that changes according to movement of the second plate P2. The elastic force of the elastic member may be selected as an appropriate value to accommodate the movement of the second plate P2 by the position control unit PU. In other words, the elastic force of the elastic member may be selected to be a value that allows the second plate P2 to be fixed at an intended position while preventing over-constraint of the second plate P2.
Referring to
In an optional embodiment, the substrate processing apparatus may further include a bracket BR connected to the first plate P1. The bracket BR may be configured separately from the first plate P1 or may be integrally formed with the first plate P1. The vertical position control unit PU_V may be fixed to the bracket BR. The vertical position control unit PU_V fixed to the first plate P1 through the bracket BR may apply a force toward the upper surface of the second plate P2, and by the force, the second plate P2 may be tilted or moved in the vertical direction.
The support unit SU may be below the vertical position control unit PU_V. In some embodiments, the vertical position control unit PU_V and the support unit SU may be symmetrically arranged with respect to the second plate P2. Accordingly, the support unit SU may generate a support force (e.g., an elastic force) corresponding to a force applied toward the upper surface of the second plate P2 generated by the vertical position control unit PU_V.
When tilting of the gas supply unit 200 occurs in a high-temperature vacuum process, the vertical position control unit PU_V may be used to tilt the substrate mounting unit 300 to correspond to such tilting. For example, when the vertical position control unit PU_V on the left side with reference to
Although the drawing shows that a plurality of vertical position control units are arranged, they may be singular. In some embodiments, there may be two vertical position control units as shown in
Referring to
In an optional embodiment, the substrate processing apparatus may further include a first bracket BR1 connected to the first plate P1. The first bracket BR1 may be configured separately from the first plate P1 or may be integrally formed with the first plate P1. In this case, the horizontal position control unit PU_H may be fixed to the first bracket BR1. The horizontal position control unit PU_H fixed to the first plate P1 through the first bracket BR1 may apply a force toward one side surface of the second plate P2, and by the force, the second plate P2 may move in the horizontal direction.
The support unit SU may be on the other side surface of the second plate P2. In some embodiments, the horizontal position control unit PU_H and the support unit SU may be symmetrically arranged with respect to the center of the second plate P2. Accordingly, the support unit SU may generate a support force (e.g., an elastic force) corresponding to a force applied toward a side surface of the second plate P2 generated by the horizontal position control unit PU_H.
In an optional embodiment, the substrate processing apparatus may further include a second bracket BR2 connected to the first plate P1. The second bracket BR2 may be configured separately from the first plate P1 or may be integrally formed with the first plate P1. In this case, the support unit SU may be fixed to the second bracket BR2. The support unit SU fixed to the first plate P1 through the second bracket BR2 may support the second plate P2 in the horizontal direction while allowing movement of the second plate P2 by the force generated by the horizontal position control unit PU_H.
In some embodiments, as shown in
In another example, as shown in
Although not shown in the drawings, any number of horizontal position control units PU_H and support units SU may be arranged. For example, two support units SU and two horizontal position control units PU_H may be arranged, and in another example, two support units SU and four horizontal position control units PU_H may be arranged. The horizontal position control unit PU_H and the support unit SU arranged in this way may be symmetrically arranged to have the same angular distance from each other.
Referring to
On the other hand, widths B1 and B2 of the gap G between the substrate supporting apparatus 3 and the ring 8 remain the same (i.e., B1=B2), thereby balancing the pressure between the reaction space 500 and the lower space 1000 over the entire section of the gap G.
However, as described above, in a high temperature process, a mismatch, that is, misalignment, of each portion of a reactor occurs due to a difference in thermal expansion due to the temperature difference between portions of a chamber and the reactor. For example, due to a difference in thermal expansion between an upper wall 1700 of the chamber, an upper reactor 1600, a lower reactor 1300, and a lower wall 2000 of the chamber, misalignment between components of the reactor may occur, which may cause tilting of the gas supply unit 200 or a shift in a centering position (center of symmetry) of the substrate mounting unit 300 with respect to the ring 800. In other words, the distances A1 and A2 of the reaction space 500 may not be constant over the entire section (A1≠A2), and/or the widths B1 and B2 of the gap G may not be constant over the entire section (B1≠B2).
In addition, in a high temperature process, because a temperature difference between the substrate mounting unit 300 and the ring 800 is great (e.g., the temperature of the substrate mounting unit 300 is about 500° C., and the temperature of the ring 800 is about 200° C.), the temperature distribution in the substrate mounting unit 300 may vary according to an alignment state of the substrate mounting unit 300 and the ring 800. This is because the closer the ring 800 is to the substrate mounting unit 300, the greater the influence on thermal conductivity of the substrate mounting unit 300.
As such, when the width of the reaction space 500 is not constant (A1≠A2) or the width of the gap G is not constant (B1≠B2), non-uniformity of a thin film on the substrate, particularly, non-uniformity of a thin film at the edge of the substrate, may be caused, and a defect rate of a semiconductor device may be increased. Therefore, there is a need for a method of compensating for the substrate mounting unit 300 such that the width of the reaction space 500 is kept constant (A1=A2) in response to the tilting of the gas supply unit 200 that occurs in high temperature and compensating for movement of the center of the substrate mounting unit 300 with respect to the ring 800 such that the width of the gap G is constant (B1=B2).
In addition, in order to solve a misalignment problem caused by thermal deformation caused by such a high-temperature process or vacuum force applied to the substrate processing apparatus, there is a need for a method of correcting such deformation/misalignment during processing without stopping the operation of the substrate processing apparatus because it takes a lot of time to stop the operation of the substrate processing apparatus, make corrections through maintenance work, and restore the substrate processing apparatus back to its original state, which significantly reduces the operating efficiency of the substrate processing apparatus.
The substrate processing apparatus shown in
When the width of the reaction space 500 is not constant during the process (A1≠A2), the second plate P2 may be tilted using the vertical position control unit PU_V of the substrate processing apparatus. In addition, when the width of the gap G is not constant during the process (B1≠B2), a distance between the second plate P2 and the ring 800 may be adjusted using the horizontal position control unit PU_H of the substrate processing apparatus.
Tilting and/or spacing adjustment performed during the process may be performed while the substrate is unloaded, for example, during an idle state. For example, during the idle state in the process, fine calibration of the substrate mounting unit 300 may be performed by an operator entering a chamber space 1800 and operating the position control unit PU. As described above, the reaction space 500 and the lower space 1000 in a high temperature and/or vacuum state may be separated from the chamber space 1800 by the stretchable portion 1200, so that an operator may directly enter the chamber space 1800. In another example, by remotely controlling the position control unit PU during the idle state or during substrate processing, fine calibration of the substrate mounting unit 300 may be performed without an operator entering the chamber space 1800.
Referring to
In some embodiments, the first plate P1 may include a through hole TH, and the support unit SU_V including the coil-shaped elastic member may extend from the lower cover LC toward the second plate P2 through the through hole TH of the first plate P1. In this case, a side surface of the support unit SU_V and a side surface of the through hole TH of the first plate P1 may be apart from each other, i.e. a first separation space. During tilting and/or horizontal movement of the second plate P2, through this first separation space, contact between the support unit SU_V and a side surface of the through hole TH of the first plate P1 may be prevented, and the second plate P2 is easier to tilt and move.
In an additional embodiment, the support unit SU_V may extend through at least a portion of the second plate P2. For example, the second plate P2 may include a concave portion CV on a lower surface thereof, and an elastic member constituting the support unit SU may contact the concave portion CV. In this case, in the concave portion CV, a side surface of the support unit SU may be apart from a side surface of the concave portion CV of the second plate P2, i.e. a second separation space. Contact between the support unit SU_V and the second plate P2 may be prevented during tilting and/or horizontal movement of the second plate P2 through this second separation space.
In some embodiments, a support unit SU_H may extend through at least a portion of the second bracket BR2. For example, the second bracket BR2 may include an accommodating portion AC in a side thereof, and the support unit SU_H may be accommodated in the accommodating portion AC. In some embodiments, the side surface of the support unit SU_H may be apart from the upper surface/lower surface of the accommodating portion AC of the second bracket BR2, i.e. a third separation space. Contact between the support unit SU_H and the second bracket BR2 may be prevented during the tilting and/or horizontal movement of the second plate P2 through this third separation space, and the tilting and movement of the second plate P2 becomes easier.
In another embodiment, the support unit SU_H may include an elastic member SP and an elastic force transmission unit ED connected to the elastic member SP. The elastic force transmission unit ED may be configured to apply an elastic force generated by the elastic member SP to a side surface of the second plate P2. In an optional embodiment, the elastic member SP may directly contact a side surface of the second plate P2 without the elastic force transmission unit ED. In this case, the elastic force of the elastic member SP may be directly transmitted to the second plate P2.
The elastic force transmission unit ED may contribute to stably supporting the second plate P2 when applying the elastic force of the elastic member SP to the second plate P2. For example, when the elastic member SP is in direct contact with a side surface of the second plate P2 and is a coil-type elastic member, because there is no supporting member for supporting the elastic member SP, a contact point between the elastic member SP and the second plate P2 may be different from a contact point between the horizontal position control unit PU_H and the second plate P2. In this case, by introducing the elastic force transmission unit ED as a supporting member of the elastic member SP to have a contact point corresponding to a contact point level LV between the horizontal position control unit PU_H and the second plate P2, the second plate P2 may be stably supported by the support unit SU.
For example, the horizontal position control unit PU_H may have a round first end. In this case, the elastic force transmission unit ED may also have a round second end, and the horizontal position control unit PU_H and the elastic force transmission unit ED may be arranged such that the first end and the second end have the same contact point level LV. In this case, the first end of the horizontal position control unit PU_H and the second end of the elastic force transmission unit ED may contact a side surface of the second plate P2 at the same contact point level LV.
In some embodiments, in order to transmit the elastic force of the elastic member SP to the side surface of the second plate P2 while the elastic force transmission unit ED is connected to the second bracket BR2, the elastic member SP and the elastic force transmission unit ED may be inserted into the accommodating portion AC of the second bracket BR2. In this case, the elastic force transmission unit ED may protrude from the side surface of the second bracket BR2 through the accommodating portion AC of the second bracket BR2 to contact the side surface of the second plate P2.
A specific exemplary shape of the elastic force transmission unit ED is shown on the lower right of
Referring to
A filling gas supplied from the lower space 1000 below the reaction space 500 may be supplied to the first reaction space 500 and the second reaction space 500', respectively. In more detail, as shown in
The first plate P1 connected to the first substrate mounting unit 300 and a first plate P1' connected to the second substrate mounting unit 300' may be connected to a driving plate DP. The driving unit 1100 may be configured to raise/lower the driving plate DP, and by the operation of the driving unit 1100, the first substrate mounting unit 300 and the second substrate mounting unit 300' may be raised or lowered at the same time. In addition, when the driving plate DP is moved by the operation of the driving unit 1100, both the first plates P1 and P1' and the second plates P2 and P2' may move at the same time.
In contrast to the driving unit 1100, the position control unit PU of the first substrate mounting unit 300 connected between the first plate P1 and the second plate P2 may move only the first substrate mounting unit 300. Similarly, a position control unit PU' of the second substrate mounting unit 300' connected between the first plate P1' and the second plate P2' may move only the second substrate mounting unit 300'. In addition, the position control unit PU may move only the second plate P2 without moving the first plate P1.
Referring to
Referring to
In another example, a combination of the above-described operations may be performed, and an example thereof is shown in
In an optional embodiment, after the above-described tilting operation, a compensation operation using the horizontal position control unit PU_H may be performed. For example, when the second plate P2 is tilted by the movement of the vertical position control unit PU_V, displacement of the substrate mounting unit 300 in the horizontal direction may occur due to the tilting operation. The compensation operation may be defined as an operation for preventing the gap G between the ring 800 and the substrate mounting unit 300 from becoming non-uniform due to such a displacement.
As shown in
For example, as shown in
Referring to
The lids LD1, LD2, and LD3 may be configured to be arranged on upper surfaces of the protrusions respectively to provide points of contact with a position control unit and/or a support unit. In an optional embodiment, the lid may be implemented to be integrated with the protrusion. In another embodiment, as shown in
In more detail, a first position control unit PU_V1 on the first protrusion PR1 may contact an upper surface of the first lid LD1 on the first protrusion PR1 to form a first contact point. Accordingly, the first position control unit PU_V1 between the first bracket BR1 and an upper surface of the first protrusion PR1 may change the position of the first protrusion PR1 of the second plate P2 through the first contact point.
A second position control unit PU_V2 on the second protrusion PR2 may contact an upper surface of the second lid LD2 on the second protrusion PR2 to form a second contact point. Accordingly, the second position control unit PU_V2 between the second bracket BR2 and an upper surface of the second protrusion PR2 may change the position of the second protrusion PR2 of the second plate P2 through the second contact point.
The third position control unit PU_V3 on the third protrusion PR3 may contact an upper surface of the third lid LD3 on the third protrusion PR3 to form a third contact point. Accordingly, the third position control unit PU_V3 between the third bracket BR and an upper surface of the third protrusion PR3 may change the position of the third protrusion PR3 of the second plate P2 through the third contact point.
In addition, the fourth position control unit PU_H1 next to the first protrusion PR1 may contact a side surface of the first lid LD1 on the first protrusion PR1 to form a fourth contact point. Accordingly, the fourth position control unit PU_H1 between the first bracket BR1 and a side surface of the first protrusion PR1 may change the position of the first protrusion PR1 of the second plate P2 through the fourth contact point.
A fifth position control unit PU_H2 next to the second protrusion PR2 may contact a side surface of the second lid LD2 on the second protrusion PR2 to form a fifth contact point. Accordingly, the fifth position control unit PU_H2 between the second bracket BR2 and a side surface of the second protrusion PR2 may change the position of the second protrusion PR2 of the second plate P2 through the fifth contact point.
The first support unit SU_H1 next to the third protrusion PR3 may contact a side surface of the third lid LD3 on the third protrusion PR3 to form a sixth contact point. Accordingly, the first support unit SU_H1 between the third bracket BR and a side surface of the third protrusion PR3 may change the position of the third protrusion PR3 of the second plate P2 through the sixth contact point.
In more detail, the first support unit SU_H1 may change the position of the third protrusion PR3 by passively moving in response to active movement of the fourth position control unit PU_H1 and the fifth position control unit PU_H2, and a detailed operation thereof will be described later with reference to
In addition, a second support unit SU_V1 below the first position control unit PU_V1 may penetrate the first plate P1 and the second plate P2 to contact the first lid LD1 to form a seventh contact point. Accordingly, the second support unit SU_V1 between the first lower cover LC1 and the first lid LD1 may change the position of the first protrusion PR1 of the second plate P2 through the seventh contact point.
In the same manner, a third support unit SU_V2 below the second position control unit PU_V2 may penetrate the first plate P1 and the second plate P2 and contact the second lid LD2 to change the position of the second protrusion PR2 of the second plate P2, and a fourth support unit SU_V3 below the third position control unit PU_V3 penetrates the first plate P1 and the second plate P2 and contacts the third lid LD3 to change the position of the third protrusion PR3 of the second plate P2.
Referring to
When the fourth position control unit PU_H1 and the fifth position control unit PU_H2 move by a first distance toward the center of the first plate P1 through the fourth and fifth contact points, the second plate P2 may move toward the first support unit SU_H1 by a second distance that is twice the first distance. The movement of the second plate P2 may be compared to movement of a triangular plate.
In more detail, as shown in
Referring to
In operation S122, after the first substrates are processed, the first substrates are unloaded. A first plate and a second plate may descend together by the driving of a driving unit, and substrates mounted on a substrate mounting unit may be unloaded. When a substrate processing apparatus as shown in
In operation S123, during the unloaded state of the substrates, that is, during an idle state, second substrates of a second lot may be transferred to a reaction chamber. The high temperature and/or vacuum environment described above may be maintained during the idle state in some embodiments. On the other hand, in operation S124, a fine calibration operation of the substrate mounting unit may be performed during the idle state. During the fine correction operation, the first plate may be fixed, and the second plate may be moved by a position control unit.
Thereafter, in operation S125, the substrates are loaded and the first plate and the second plate are raised together. In an embodiment in which a plurality of substrate mounting units are implemented, a second plate of a first substrate mounting unit and a second plate of a second substrate mounting unit may move in the same direction (i.e. upward towards a reaction space) during substrate loading. On the other hand, during a fine correction operation, the second plate of the first substrate mounting unit and the second plate of the second substrate mounting unit may move in different directions. For example, during the fine calibration operation, the second plate of the first substrate mounting unit may move in a clockwise direction, the second plate of the second substrate mounting unit may move in a counterclockwise direction. Thereafter, in operation S126, processing of the second substrates of the second lot is performed as subsequent substrate processing.
In another embodiment, the substrate unloading operation (operation S122) and the fine calibration operation of the substrate support unit (operation S124) may be performed at the same time. In this case, the first plate and the second plate may move in different directions. That is, because the first plate and the second plate are simultaneously lowered during the substrate unloading operation, but the first plate is fixed and the second plate is moved during the fine calibration operation, so when these are performed simultaneously, a moving direction (downward direction) of the first plate and a moving direction (downward direction + fine correction direction) of the second plate may be different from each other as a result.
Referring to
As shown in
The input signal input to the control unit CT may be a wired signal or a wireless signal. In this case, the fine calibration operation of the substrate mounting unit 300 may be remotely performed without an operator entering a chamber space. Because the operator does not enter the chamber space, the fine calibration operation may be performed not only in an idle state but also during substrate processing.
In a further embodiment, the fine calibration operation of the substrate mounting unit 300 may be performed automatically. For example, as shown in
In
The moving plate 3 is provided with a groove into which a sealing member is inserted so that a reactor 151 (of
Because the moving plate 3 is in direct contact with the heating block 1, the moving plate 3 is maintained at a high temperature in a high-temperature process. Accordingly, a coolant path is formed in the moving plate 3 so that the shielding unit provided in the first groove and/or the second groove is not cured by heat. A coolant inlet 11 and a coolant outlet 12 are provided on one surface of the moving plate 3.
In
In
Meanwhile, the bracket 10-c includes an alignment control unit 9 instead of a position control unit. The alignment control unit 9 prevents excessive movement or an over-constraint state of the moving plate 3 in the horizontal direction by the horizontal position control units 8-a and 8-b. Therefore, the alignment control unit 9 may include a first elastic body. For example, the first elastic body of the alignment control unit 9 may be a spring, and over-constraint by the horizontal position control units 8-a and 8-b may be controlled by using an elastic force of the spring. In an embodiment, the spring may be an elastic body such as a coil spring or a plate spring, and the elastic force may be 20 kgf to 30 kgf.
Tilting adjustment of a heating block is made by movement of the vertical position control units 7-a, 7-b, and 7-c installed in the vertical direction on the three brackets 5-a, 5-b, and 5-c. In more detail, when the vertical position control units 7-a, 7-b, and 7-c move in the forward direction (+), the vertical position control units 7-a, 7-b, and 7-c push an upper surface of the position control unit support units 10-a, 10-b, and 10-c in the vertical direction, and the position control unit support units 10-a, 10-b, and 10-c and the moving plate 3 are moved in the vertical direction. Any one of the vertical position control units may move individually or simultaneously. In an embodiment, by varying a movement distance of each vertical position control unit, tilting in the vertical direction may be more precisely controlled. In order to precisely control the movement in the vertical direction, that is, tilting, the position control unit support units 10-a, 10-b, and 10-c may include a second elastic body. For example, the second elastic body of the position control unit support units 10-a, 10-b, and 10-c may be a spring, and over-constraint by the vertical position control units 7-a, 7-b, and 7-c may be prevented by using an elastic force of the spring. In an embodiment, the spring may be an elastic body such as a coil spring or a plate spring, and each elastic force may be 5 kgf to 15 kgf (total 5 kgf to 15 kgf × 3 EA = 15 kgf to 45 kgf). Therefore, by using the first elastic body and the second elastic body, an over-constrained state may be prevented, and deformation and damage of fixed components due to residual stress may be prevented.
In the perspective view of
In
On the other hand, in
In
In
In
Tables 1 and 2 show conditions for horizontally moving the moving plate 3 to each direction from (1) to (6) in each reactor in
In
For the first reactor RC1 and the third reactor RC3 in a symmetrical relationship therewith, when the moving plate is to be moved horizontally in a direction of the center of the chamber (direction 1), the horizontal movement position control unit #4 moves in the reverse direction (-) by 1.0 α mm and the other horizontal movement position control unit #5 moves in the forward direction (+) by 0.5 α mm.
In addition, for the first reactor RC1 and the third reactor RC3 in a symmetrical relationship therewith, when the moving plate is to be moved horizontally in a direction of an exhaust port of the reactor (direction 4), the horizontal movement position control unit #4 moves in the forward direction (+) by 1.0 α mm and the other horizontal movement position control unit #5 moves in the reverse direction (-) by 0.5 α mm.
The movement of the moving plate may be equally applied to the second reactor RC2 and the fourth reactor RC4, and thus a detailed description thereof will be omitted.
In a multi-reactor chamber as shown in
The technical idea of the disclosure also provides a tilting function for tilting the substrate support unit.
In
On the other hand, when the heating block 1 moves horizontally while tilting, gaps between the heating block 1 and a gas flow control ring 2 becomes non-uniform (G≠G′). Accordingly, after the heating block 1 is tilted, in order to make the gap between the heating block 1 and the gas flow control ring 2 uniform, compensation movement of the moving plate 3 and the heating block 1 needs to be additionally performed. As shown in
In
In the embodiment of
Referring to
According to the disclosure, a substrate support unit may facilitate horizontal movement and tilt of the heating block as a chamber is deformed by thermal expansion and vacuum force at high temperatures. In addition, by maintaining the symmetry of arrangement between a heating block and surrounding components, it may contribute to the improvement of reproducibility and productivity of a substrate processing process. Furthermore, by stopping the operation of a substrate processing apparatus, lowering the temperature, and performing maintenance work, the existing maintenance process that reduces the uptime and the operation efficiency of the apparatus may be omitted, thereby contributing to the improvement of operation efficiency and productivity of the substrate processing apparatus.
It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the following claims.
This application claims priority to U.S. Provisional Pat. Application Serial No. 63/244,546, filed Sep. 15, 2021, and titled SUBSTRATE PROCESSING APPARATUS, the disclosure of which is hereby incorporated by reference in its entirety.
Number | Date | Country | |
---|---|---|---|
63244546 | Sep 2021 | US |