SUBSTRATE SUPPORT STRUCTURE, HEAT TREATMENT APPARATUS USING SAME, FIRST SHEET-LIKE OBJECT FOR USE IN THE SUBSTRATE SUPPORT STRUCTURE, METHOD OF MANUFACTURING THE SUBSTRATE SUPPORT STRUCTURE, HEAT TREATMENT APPARATUS, AND SUBSTRATE SUCKING METHOD

Abstract

A heat treatment apparatus includes a support sheet placed on an upper surface of a heat-treating plate. The support sheet has, formed on an upper surface thereof, projections for contacting and supporting a substrate, and a lip for contacting edge regions of the substrate. The support sheet is formed by an etching process, and therefore areas of the sheet around the projections are recessed, rather than being perforated as in the case of laser processing. These heat-treating plate and support sheet constitute a substrate support structure capable of supporting the substrate properly.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustrating the invention, there are shown in the drawings several forms which are presently preferred, it being understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown.

FIG. 1 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 1;

FIG. 2 is a plan view of a heat-treating plate;

FIGS. 3A through 3E are explanatory views showing an etching process;

FIG. 4 is a flow chart showing a procedure of treatment by the heat treatment apparatus;

FIG. 5 is a plan view of a modified support sheet;

FIG. 6 is a plan view of another modified support sheet;

FIG. 7 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 2;

FIG. 8A is a plan view of a heat-treating plate;

FIG. 8B is a fragmentary plan view of a support sheet;

FIG. 9 is a flow chart showing a procedure of treatment by the heat treatment apparatus;

FIG. 10 is a view schematically showing expansion of the support sheet;

FIG. 11 is a view schematically showing the support sheet about to lift;

FIG. 12 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 3;

FIG. 13 is a plan view of a heat-treating plate in Embodiment 4;

FIG. 14 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 5;

FIG. 15 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 6;

FIG. 16 is a plan view of a heat-treating plate;

FIG. 17 is a flow chart showing a procedure of treatment by the heat treatment apparatus;

FIG. 18 is a view schematically showing gas currents occurring in a minute space and grooves when a substrate is sucked;

FIG. 19 is a graph showing pressure variations occurring in the minute space and grooves when the pressure in the minute space is changed to a treating pressure;

FIG. 20 is a plan view of a heat-treating plate in Embodiment 7;

FIG. 21 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 8; and

FIG. 22 is a view in vertical section showing an outline of a heat treatment apparatus in Embodiment 9.

Claims

1. A substrate support structure for supporting a substrate, comprising: a plate body for supporting the substrate; anda first sheet-like object formed of resin and placed on an upper surface of said plate body, said first sheet-like object having projections formed on a front surface thereof for contacting and supporting the substrate;wherein said projections of said first sheet-like object are formed by an etching process.

2. A structure as defined in claim 1, wherein said first sheet-like object has a flat back surface.

3. A structure as defined in claim 1, wherein said first sheet-like object has a ring-like lip for contacting edge regions of the substrate, said lip being formed by the etching process.

4. A structure as defined in claim 1, wherein said first sheet-like object has first openings for sucking gas from a space formed between the substrate and said first sheet-like object.

5. A heat treatment apparatus for heat-treating a substrate, comprising: a substrate support structure as defined in claim 1; anda heating device for heating the substrate.

6. A first sheet-like object used in a substrate support structure having the first sheet-like object formed of resin and placed on an upper surface of a plate body for supporting a substrate, said first sheet-like object comprising: projections formed on a front surface of said first sheet-like object by an etching process, for contacting and supporting the substrate.

7. A method of manufacturing a substrate support structure for supporting a substrate, comprising: forming, by an etching process, projections on one surface of a first sheet-like object formed of resin, for contacting and supporting the substrate; andplacing, on a plate body, said first sheet-like object having said projections formed thereon, with said projections facing up.

8. A heat treatment apparatus for heat-treating a substrate, comprising: a heat-treating plate;a second sheet-like object placed on said heat-treating plate, said second sheet-like object having, formed on a surface thereof, a ring-like sealer for contacting edge regions of the substrate, and projections for contacting and supporting the substrate inwardly of said sealer; andfirst exhaust bores for exhausting gas from a space formed between the substrate and said second sheet-like object.

9. An apparatus as defined in claim 8, wherein: said second sheet-like object has third openings formed outwardly of said sealer;said apparatus further comprises insert elements arranged in said third openings; andsaid third openings and said insert elements have gaps therebetween for permitting expansion and contraction of said second sheet-like object.

10. An apparatus as defined in claim 9, further comprising a lift restrictor disposed above and outwardly of said sealer and spaced from said second sheet-like object for restricting lifting of said second sheet-like object from said heat-treating plate.

11. An apparatus as defined in claim 10, further comprising: guide elements for horizontally positioning the substrate; anda positioning member for contacting and positioning said guide elements;wherein said guide elements are arranged in said third openings to act also as said insert elements, and said positioning member acts also as said lift restrictor.

12. An apparatus as defined in claim 9, further comprising guide elements for horizontally positioning the substrate, said guide elements being arranged in said third openings to act also as said insert elements.

13. An apparatus as defined in claim 8, further comprising weights arranged on said second sheet-like object outwardly of said sealer for permitting expansion and contraction of said second sheet-like object.

14. An apparatus as defined in claim 13, further comprising a lift restrictor disposed above and outwardly of said sealer and spaced from said second sheet-like object for restricting lifting of said second sheet-like object from said heat-treating plate.

15. An apparatus as defined in claim 14, further comprising: guide elements for horizontally positioning the substrate; anda positioning member for contacting and positioning said guide elements;wherein said guide elements are arranged on said second sheet-like object outwardly of said sealer to act also as said weights, and said positioning member acts also as said lift restrictor.

16. An apparatus as defined in claim 13, further comprising guide elements for horizontally positioning the substrate, said guide elements being arranged on said second sheet-like object outwardly of said sealer to act also as said weights.

17. An apparatus as defined in claim 8, further comprising a lift restrictor disposed above and outwardly of said sealer and spaced from said second sheet-like object for restricting lifting of said second sheet-like object from said heat-treating plate.

18. A heat treatment apparatus for heat-treating a substrate, comprising: a heat-treating plate;a second sheet-like object placed on an upper surface of said heat-treating plate, said second sheet-like object having projections formed thereon for contacting and supporting the substrate;a closing device for closing areas laterally of a space formed between the substrate and said second sheet-like object;second exhaust bores for exhausting gas from said space; andsuction bores formed in said heat-treating plate for sucking said second sheet-like object.

19. An apparatus as defined in claim 18, further comprising grooves formed in the upper surface of said heat-treating plate to communicate with said suction bores.

20. An apparatus as defined in claim 19, wherein said grooves have a height from bottoms thereof to the upper surface of said heat-treating plate, which is larger than a height of said projections.

21. An apparatus as defined in claim 19, wherein said grooves extend between edge regions and a center of said heat-treating plate.

22. An apparatus as defined in claim 18, further comprising grooves formed in the upper surface of said heat-treating plate to communicate with said second exhaust bores, said second exhaust bores acting also as said suction bores.

23. An apparatus as defined in claim 22, wherein said grooves have a height from bottoms thereof to the upper surface of said heat-treating plate, which is larger than a height of said projections.

24. An apparatus as defined in claim 22, wherein said grooves extend between edge regions and a center of said heat-treating plate.

25. An apparatus as defined in claim 18, wherein said second exhaust bores include plate bores formed in said heat-treating plate, and sheet bores formed in said second sheet-like object to communicate with said plate bores, said sheet bores being arranged adjacent edge regions of said heat-treating plate.

26. A substrate sucking method for sucking a substrate contacted and supported by projections formed on a second sheet-like object placed on an upper surface of a heat-treating plate, said method comprising: forming a first space between the substrate and said second sheet-like object;forming a second space between said second sheet-like object and said heat-treating plate; andexhausting gases from said first space and said second space while maintaining a pressure in said second space below a pressure in said first space.

27. A method as defined in claim 26, wherein, in time of gas exhaustion, a flow resistance to gas flows occurring in said second space is lower than a flow resistance in said first space.