Patent Application
20070177137
The present document incorporates by reference the entire contents of Japanese priority document, 2006-025755 filed in Japan on Feb. 2, 2006.
1. Field of the Invention
The present invention relates to a surface-defect inspection apparatus, a surface defect inspection method, and a surface defect inspection program, and, more particularly to a technique of detecting a defect using a one-dimensional imaging unit.
2. Description of the Related Art
Conventionally, a uniform light is irradiated onto the surface of a tested object, and a distribution of a reflected light is imaged, thereby detecting damage, unevenness, and stains on the surface of the tested object from the taken image.
Particularly, when a measured object is an object extended on the flat surface of roll paper or a sheet, or a cylindrical object, a line sensor is generally used as an imaging unit. The line sensor scans the measured object that moves or rotates on the line sensor, thereby obtaining a surface image and detecting a defect.
In detecting a defect in this way, a relative position between a light-receiving position of the reflection light and the line sensor can change due to a distortion of a shape of the tested object, an unsteady rotation, or vibration. In this case, a position of the defect on the surface of the measured object is detected by error sometimes due to this relative positional change.
According to a technique described in Japanese Patent Application Laid-open No. 2004-279367, an area sensor is provided in addition to a line sensor. When this area sensor receives a reflection light, a reflection light position of the measured object can be obtained. A position of the line sensor is controlled based on the reflection light position to make it possible to accurately detect a defect from the measured object.
According to the technique described in Japanese Patent Application Laid-open No. 2004-279367, an area sensor is used in addition to a line sensor that detects a defect of the tested object. This configuration makes the apparatus complex, and directly increases the cost of the apparatus. Because plural sensors are used, it becomes necessary to adjust and calibrate a relative positional relationship between the sensors. Therefore, after the introduction, the number of maintenance steps increases.
It is an object of the present invention to at least partially solve the problems in the conventional technology.
According to an aspect of the present invention, a surface-defect inspection apparatus includes an irradiating unit that irradiates a pattern light, having brightness or color changed in an inspection moving direction, to an inspection position of an inspection target object of which the inspection position is moved following a lapse of time; a one-dimensional imaging unit that carries out a one-dimensional imaging of the pattern light irradiated by the irradiating unit and reflected from the inspection position, to a direction crossing the inspection moving direction; a change detecting unit that detects a change of brightness or color from a one-dimensional image obtained by the one-dimensional imaging unit; and a control unit that controls a moving unit, which moves the inspection target object or the one-dimensional imaging unit, to keep constant a distance between the inspection position of the inspection target object and the one-dimensional imaging unit, based on a change of the brightness or color detected by the change detecting unit.
According to another aspect of the present invention, a surface-defect inspection method includes irradiating a pattern light, having brightness or color changed in an inspection moving direction, with an irradiating unit onto an inspection position of an inspection target object of which the inspection position is moved following a lapse of time; carrying out a one-dimensional imaging of the pattern light irradiated by the irradiating unit and reflected from the inspection position, to a direction crossing the inspection moving direction with a one-dimensional imaging unit; detecting a change of brightness or color from a one-dimensional image obtained by the one-dimensional imaging unit at the carrying; and controlling movement of the inspection target object or the one-dimensional imaging unit, to keep constant a distance between the inspection position of the inspection target object and the one-dimensional imaging unit, based on a change of the brightness or color detected at the detecting.
According to another aspect of the present invention, a computer program product causes a computer to execute the above method.
The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.
Exemplary embodiments according to the present invention will be explained below in detail with reference to the accompanying drawings.
The tested object 151 can have any shape. In the first embodiment, an example of a photosensitive drum formed in a cylindrical shape is explained. When the tested object 151 rotates, a test position to which the line light source 101 described later irradiates a pattern light moves along time. Accordingly, the line sensor 102 can test the surface of one rotation of the tested object 151.
The line light source 101 irradiates a pattern light having a predetermined pattern in a longitudinal direction of the tested object, to the rotating tested object.
Although there is no particular limit to a predetermined cycle in which the above brightness changes, the cycle is set to ten or more times of the size of a defect to be detected in the first embodiment. For example, when the size of a defect to be detected is about 0.1 to 3 millimeters, a cycle in which brightness changes is set to 30 millimeters or more. When the cycle is set like this, the casing 104 described later decreases the effect that the pattern light gives at the time of detecting a defect. In other words, an erroneous detection of a defect can be decreased.
The line light source 101 can use any means to irradiate a pattern light. In the first embodiment, the line light source 101 is covered with a mask assigned with a pattern. In addition to the covering with a mask, a light emission pattern of the line light source can be controlled.
As explained above, when the brightness of the pattern light has an inclination, the line sensor 102 described later can detect a distance between the inspection position of the tested object 151 and the line sensor 102, that is, a movement of the inspection position of the tested object generated due to an eccentricity or an unsteady rotation. Details thereof will be described later.
A pattern light irradiated by the line light source 101 can be the one having a change of brightness in the sub-scanning direction, and is not limited to the above pattern light.
In (a), (b), and (c) in
The line sensor 102 images the tested object 151 that rotates in the sub-scanning direction in the main scanning direction. Reference numeral 161 shown in
When an abnormal part such as a projection is present on the tested object 151, a scattering direction of the reflection light becomes not constant. Therefore, the scattering distribution of the reflected light becomes wide, or an angle at which a regular reflection light is generated changes. The line sensor 102 images the reflection light, and the casing 104 described later analyzes the line image of the imaged line, thereby detecting an abnormal part of the tested object 151.
The line image according to the first embodiment is one-dimensional image data obtained by the line sensor 102. The imaged line image can be any image when a change of brightness of a reflected pattern light can be detected from this image.
During a rotation of the tested object 151 to carry out a test, a relative distance between an inspection position of the tested object 151 and an installation position of the line sensor 102 changes due to a mild uneven surface of the tested object 151 which is not a defect. When this distance changes, brightness of the reflected light of the pattern light imaged by the line sensor 102 changes. A contribution rate of the variation of the brightness when the relative distance between the tested object 151 and the line sensor 102 changes is different depending on an angle formed between a direction from an inspection position of the tested object 151 to the line sensor 102 and a direction of a changed position of the tested object 151. The contribution rate represents a rate of a changed quantity of a phase detected by the line sensor 102 to a changed quantity of a position of the tested object 151.
In other words, when an angle formed by a line between the line light source 101 and the tested object 151 and a line between the line sensor 102 and the line light source 101 becomes 90 degrees, a contribution rate when the tested object 151 moves to a lateral direction becomes equal to a contribution rate when the tested object 151 moves to a depth direction. However, detection precision is affected more by a change of an angle component, that is, a change of the tested object 151 in a direction perpendicular to the line sensor 102, than a change of a reflection surface of the tested object 151. Therefore, it is preferable that the angle formed by a line between the line light source 101 and the tested object 151 and a line between the line sensor 102 and the line light source 101 is smaller than the above angle.
According to the conventional practice, a defect is detected without controlling the line sensor 102, so that a relative distance between an inspection position of the tested object 151 and a position of the line sensor 102 becomes constant. However, detection sensitivity of detecting unevenness is different depending on a distance between the imaging position of the line sensor 102 and a bright-line. In other words, only a defect having no problem can be detected even when the detection sensitivity changes. The bright-line connects between crests of a reflection light quantity distribution of light reflected from the tested object 151.
Because a change of a relative position between the tested object 151 and the line sensor 102 is not detected as a defect, a position of low sensitivity, that is, an area having a small light quantity in the reflection light quantity distribution is conventionally set as a position to be imaged by the line sensor 102. However, when the line sensor 102 is set in this way, a defect candidate that can be accurately detected at a position of high sensitivity is erroneously detected.
On the other hand, according to the surface-defect inspection apparatus 100 of the first embodiment, the line sensor 102 images a reflection light of the pattern light, and the casing 104 analyzes this reflection light, and controls a position of the line sensor 102 based on a result of the analysis. Accordingly, the surface-defect inspection apparatus 100 can keep the relative position between the inspection position of the tested object 151 and the position of the line sensor 102, at substantially a constant level. Therefore, a position of low sensitivity does not need to be the imaging point, unlike the conventional practice. In other words, because the line sensor 102 can be set at a position having highest precision of detecting a defect in the reflection light quantity distribution, detection precision can be increased.
With reference to
The linear stage 103 is mounted with the line sensor 102, and guides the movement of the line sensor 102 to a sub-scanning direction. The position of the line sensor 102 that moves on the linear stage 103 is controlled by the casing 104 (described later). The linear stage 103 guides the moving direction of the line sensor 102, thereby facilitating the control of the position.
The input processor 601 inputs a signal transmitted from the line sensor 102.
The lowpass filter 606 filters a signal input by the input processor 601, and removes a frequency component indicating a change of brightness in the main scanning direction of a pattern light irradiated by the line light source 101. Accordingly, erroneous detections of a defect of the tested object 151 based on a change of brightness of a pattern light decrease, and defect detection precision improves.
The defect-inspection image processor 607 generates a surface image indicating a change of brightness of the surface of the tested object 151, from the signal from which a frequency component of the brightness of the pattern light is removed. The defect-inspection determining unit 608 detects a defect of the surface of the tested object 151 from the surface image. Generation of the surface image carried out by the defect-inspection image processor 607 and detection of a defect carried out by the defect-inspection determining unit 608 can be based on any one of known methods.
The bandpass filter 602 filters a signal input by the input processor 601, and extracts a frequency component indicating a change of pattern brightness in the main scanning direction of pattern light irradiated by the line light source 101. Accordingly, precision of detecting a phase of the frequency component improves.
The phase detector 603 detects a change of a phase, from a signal of a frequency component indicating a change of brightness of a pattern in the main scanning direction of a pattern light. When this change of a phase is detected, a variation between the position of the line sensor 102 and the position of the tested object 151 can be detected.
In other words, when a relative positional relationship between the position of the line sensor 102 and the position of the tested object 151 changes, the position of the tested object 151 imaged by the line sensor 102 deviates to a sub-scanning direction. In this case, because a stripe enters in a sub-scanning oblique direction based on the reflection light of the imaged pattern light, the phase of the frequency component of the pattern light imaged in the imaged line is deviated.
This means that when the phase detector 603 detects a quantity of the phase component of the cycle of the pattern light, the position imaged by the line sensor 102 can be detected. Because the position of the imaged pattern light can be specified, the imaging position controller 605 described later can control the position of the line sensor 102.
A change of a phase component of the cycle of the imaged line taken by the line sensor 102 is due to a change of the tested object 151 or a change of the position of the line sensor 102. As one example of a change of the tested object 151, an eccentricity of the tested object 151 is explained.
Although not shown in
When the tested object 151 is eccentric to the direction of the arrowhead 705, and when the line sensor 102 images the left side of the bright-line 702 on the paper, the bright-line moves to a direction away from the line sensor 102. When the line sensor 102 images the right side of the bright-line 702 on the paper, the bright-line moves to a direction toward the line sensor 102.
A case when the position of the line sensor 102 changes is explained next.
As explained above, when the line sensor 102 moves to the direction of the arrowhead 805, and when the line sensor 102 images the left side of the bright-line 702 on the paper, the line sensor 102 moves to a direction toward the bright-line. When the line sensor 102 images the right side of the bright-line 702 on the paper, the line sensor 102 moves to a direction away from the bright-line.
As explained above, a positional relationship between the bright-line and the imaged line taken by the line sensor 102 needs to take into account the above various conditions. However, according to the first embodiment, the position of the line sensor 102 is not controlled using the positional relationship between the bright-line and the imaged line. Therefore, it is not necessary to take into account these conditions. Specifically, when a phase of the imaged line is deviated due to a movement of the tested object 151, the imaging position controller 605 described later controls the line sensor 102 to further move to a position in the phase deviation direction.
The reasons for the above are explained. First, when the tested object 151 is eccentric to the sub-scanning advancing direction, the line sensor 102 needs to be moved to the same sub-scanning advancing direction to enable the line sensor 102 to image the same position as that before the eccentricity. The tested object 151 and the line sensor 102 are moved to the sub-scanning advancing direction, because the phase of the imaged line is deviated to the same direction, as shown in
As explained above, when a movement like eccentricity occurs in the tested object 151, the phase detector 603 can detect a change of the phase, from the signal input by the bandpass filter 602.
The noise removing unit 604 removes noise from the phase detected by the phase detector 603. The detection of the phase of the reflected pattern light is stable against the movement of the tested object 151, in comparison with the detection of a change of the reflection quantity. However, there is an influence of measurement noise. To cut the imaging noise component, the noise removing unit 604 has a noise removing filter between the phase detector 603 and the imaging position controller 605. Accordingly, measurement noise can be decreased.
An average value filter, a lowpass filter, and a median filter are available as filters that can be used in the noise removing unit 604. These filters can be mounted based on the assumption that a change due to an assumed eccentricity does not have a high frequency component.
A line image taken when a measured object generates an unsteady rotation is explained.
In the first embodiment,
The imaging position controller 605 has a destination position calculator 611 that calculates a position of-the moving destination of the line sensor 102 based on a changed of the detected phase, thereby controlling the line sensor 102 to move to the calculated position. A principle of calculating a movement destination is explained.
A mapping function of a position y at which the line sensor 102 is installed and a phase Φ of a predetermined frequency component at this position is set as Φ(y). This Φ (y) is obtained as the expression (1) using the above variables.
Φ(y)=2π*y*tan(θ1)/T (1)
A phase of a reflection light that the line sensor 102 images at the position of the tested object is expressed as φ(y).
A phase of the imaged position is expressed as φ(y). A position of the line sensor 102 is controlled so that the following expression is established for Φ and Φ.
φ(y)−φ(y)=K (2)
With the above arrangement, the line sensor 102 can follow a movement of the tested object 151 due to an eccentricity, so that the line sensor 102 can keep a relative positional relationship at a constant level. A variable K is a constant representing an observation condition.
When the expression (2) is substituted for the expression (1), 2π*y*tan(θ1)/T−φ(y)=K is established. y is then solved.
y={K+φ(ynow)}*T/{2π*tan(θ1)} (3)
Because φ (ynow) is a phase imaged by the line sensor 102, the position y as a moving destination of the line sensor 102 is specified. In other word, the destination position calculator 611 can calculate a position of the moving destination from the input phase, by using the expression (3). Any other method other than the expression (3) can be used to calculate a position of the moving destination from the change of the pattern light.
The imaging position controller 605 controls the line sensor to move to the position calculated by the destination position calculator 611. Accordingly, the line sensor 102 can follow a movement of the rotating tested object 151 such as an eccentricity. The imaging position controller 605 can keep constant a relative distance between the position of the tested object 151 and the position of the line sensor 102. Therefore, a defect of the tested object 151 can be detected in high precision.
The process control, from the imaging by the line sensor 102 until the moving of the line sensor 102, carried out by the surface-defect inspection apparatus 100 having the above configuration according the present invention is explained below.
First, the line sensor 102 images the tested object 151 to which the line light source 101 irradiates a pattern light (step S1201).
Next, the input processor 601 inputs a signal indicating image data input by the line sensor 102 (step S1202).
The bandpass filter 602 filters the image data input by the input processor 601, thereby extracting a predetermined frequency component (step S1203). Although not shown, the input processor 601 inputs image data to the lowpass filter 606 as well. After the lowpass filter 606 carries out the filtering, the defect-inspection image processor 607 and the defect-inspection determining unit 608 inspect a defect.
The phase detector 603 detects a phase of an extracted predetermined frequency component (step S1204). The noise removing-unit 604 removes noise from the detected phase (step S1205).
The destination position calculator 611 calculates a position of the moving destination of the line sensor 102, from the noise-removed phase (step S1206).
The imaging position controller 605 controls the line sensor 102 to move to the calculated moving destination (step S1207).
The surface-defect inspection apparatus 100 determines whether the tested object 151 has been tested (step S1208). The end of the test can be determined based on whether the whole surface of the tested object 151 has been tested after making one rotation.
When it is determined that the test of the surface-defect inspection apparatus 100 has not yet ended (NO at step S1208), the line sensor images the tested object 151 (step S1201). When it is determined that the surface-defect inspection apparatus 100 has ended the test (YES at step S1208), the process ends.
In the first embodiment, the line sensor 102 images the tested object 151 in the main scanning direction orthogonal with the sub-scanning direction in which the tested object 151 moves. However, the one-dimensional imaging unit such as the line sensor 102 is not limited to image the tested object in a direction orthogonal with the moving direction of the tested object, and can move in any direction obliquely crossing the moving direction. This is because when the one-dimensional imaging unit moves to a direction obliquely crossing the moving direction of the tested object, a change of brightness of the pattern light can be detected when the distance between the one-dimensional imaging unit and the tested object changes.
In the first embodiment, a change of the position of the tested object 151 is detected based on a change of brightness in the sub-scanning direction of the pattern light. However, instead of the change of brightness in the sub-scanning direction of the pattern light, a change of color can be also used.
In the first embodiment, a change of a relative distance between the position of the line sensor 102 and the position of the tested object 151 can be detected from the brightness of the imaged line image data. Therefore, a movement of the line sensor 102 can be controlled to keep constant the relative distance. Accordingly, the surface-defect inspection apparatus 100 can detect the defect of the tested object in high precision.
In the first embodiment, a position of the imaged pattern light can be detected from the phase component detected by the phase detector 603. Therefore, a position of the line sensor 102 can be controlled, without being affected by the change of a reflection rate of the tested object 151 or the change of brightness of the light source.
While the cycle of the brightness of the pattern light is set ten or more times of the size of the defect, thereby suppressing the reduction of the defect detection precision, the suppressing method is not limited to that described in the first embodiment. An irradiation of the pattern light to an area other than the defect measurement area is explained in a second embodiment of the present invention. A surface-defect inspection apparatus according to the second embodiment includes a configuration substantially equivalent to the configuration shown in
When the line light source 1301 irradiates the light to the measurement area, a measurement is possible like in the conventional manner, and when the line light source 1301 irradiates a pattern light to the non-measurement area, a movement of the line sensor 102 can be controlled.
The pattern light irradiated in the second embodiment includes a stripe having different brightnesses in a sub-scanning oblique direction, like in the first embodiment. A predetermined distance in which brightness of the stripe changes does not need to be set to ten or more times of the size of the defect, like in the first embodiment. This distance can be further decreased. This is because the stripe is provided in the non-measurement area, and a defect is not detected in the non-measurement area.
The phase detector 1402 detects a moving phase from the imaged data of the non-measurement area in the filtered frequency component. Explanations of the phase detector 1402 are omitted because other processes are similar to those processed by the phase detector 603.
In the surface-defect inspection apparatus according to the second embodiment, the effect similar to that obtained from the first embodiment is obtained because the pattern light is irradiated to the outside of the measurement area, and a defect can be detected in higher precision because there is no erroneous detection of a defect due to the pattern light.
The surface defect inspection program executed by the surface-defect inspection apparatus described above can be provided by being incorporated in a read only memory (ROM) or the like in advance. The casing of the surface-defect inspection apparatus includes a controller such as a central processing unit (CPU), a memory device such as a ROM or a random access memory (RAM), an external memory unit such as a hard-disk drive (HDD) or a compact disk (CD) drive unit, a display device such as a display unit, and an input device such as a keyboard and a mouse. The casing can also include a hardware configuration using a normal computer.
A surface defect inspection program executed by the surface-defect inspection apparatus according to the second embodiment can be provided by being recorded into a computer-readable recording medium such as CD-ROM, a flexible disk (FD), a compact disk recordable (CD-R), and a digital versatile disk (DVD), in an installable or executable format.
The surface defect inspection program executed by the surface-defect inspection apparatus according to the second embodiment can be stored into a computer connected to a network such as the Internet, and can be provided by downloading the program via the network. The surface defect inspection program executed by the surface-defect inspection apparatus according to the second embodiment can be also provided or distributed via the network such as the Internet.
The surface defect inspection program executed by the surface-defect inspection apparatus according to the second embodiment has a module configuration including the above. units (the input processor, the bandpass filter, the phase detector, the noise removing unit, the imaging position controller (the lowpass filter), the defect-inspection image processor, and the defect-inspection determining unit). As actual hardware, the CPU reads the surface defect inspection program from the memory medium, and executes this program, thereby loading each unit onto the main memory device. The input processor, the bandpass filter, the phase detector, the noise removing unit, the imaging position controller (the lowpass filter), the defect-inspection image processor, and the defect-inspection determining unit are generated on the main memory device.
The present invention has an object of detecting a defect in high precision by controlling constant the relative positional relationship formed by a regular reflection light between an irradiating unit (such as a line light source), a tested object (such as a photosensitive drum), and a one-dimensional imaging unit (such as a line sensor). In the above explanations, the one-dimensional imaging unit is moved to change the relative positional relation. However, it is needless to mention that there is a method of moving the irradiating unit and the tested object after detecting a change of a relative position of the pattern light, and also a method obtaining the equivalent effect by controlling a reflection angle using a reflecting unit additionally installed on the path.
According to an aspect of the present invention, to achieve the above object, a moving unit is controlled to keep constant a distance between a one-dimensional imaging unit and an inspection position of a tested object, from a change of brightness or color of the taken one-dimensional image, thereby detecting a defect of the tested object in high precision.
According to another aspect of the present invention, a pattern light is irradiated to an area other than a tested area, and a light not including a pattern is irradiated to the tested area. Therefore, a defect of the tested object can be detected in higher precision.
According to still another aspect of the present invention, a change of a distance between an inspection position of a tested object and a position of a one-dimensional imaging unit can be detected from a change of a phase of the obtained one-dimensional image. Therefore, a distance between these positions can be easily maintained constant.
According to still another aspect of the present invention, by controlling the position of a one-dimensional imaging unit, a distance between the inspection position of the tested object and the distance of a one-dimensional imaging unit can be kept constant. Therefore, a defect of the tested object can be detected in higher precision.
According to still another aspect of the present invention, a position of a moving destination of a one-dimensional imaging unit can be calculated. Therefore, control of a position of the one-dimensional imaging unit becomes easy.
According to still another aspect of the present invention, a moving direction of a one-dimensional imaging unit can be specified easily, regardless of the installation position of the one-dimensional imaging unit.
According to still another aspect of the present invention, a change of a phase is detected after extracting a predetermined frequency component. Therefore, an inspection position of a tested object and a position of a one-dimensional imaging unit can be detected in high precision, without having the influence of other frequency component.
According to still another aspect of the present invention, control of a movement of a one-dimensional imaging unit becomes easy based on the guide of a guiding unit.
According to still another aspect of the present invention, a defect of the surface of a tested object is inspected in a one-dimensional image from which a predetermined frequency component is removed. Therefore, erroneous detections of a defect due to a pattern light can be decreased.
According to still another aspect of the present invention, a cycle of brightness of a pattern light and a size of a detected defect are differentiated. Therefore, erroneous detections of a defect due to a pattern light can be decreased.
According to still another aspect of the present invention, to achieve the object, a moving unit is controlled to keep constant a distance between a one-dimensional imaging unit and an inspection position of a tested object, from a change of brightness or color of the taken one-dimensional image, thereby detecting a defect of the tested object in high precision.
According to still another aspect of the present invention, a pattern light is irradiated to an area other than a tested area, and a light not including a pattern is irradiated to the tested area. Therefore, a defect of the tested object can be detected in higher precision.
According to still another aspect of the present invention, a change of a distance between an inspection position of a tested object and a position of a one-dimensional imaging unit can be detected from a change of a phase of the obtained one-dimensional image. Therefore, a distance between these positions can be easily maintained constant.
According to still another aspect of the present invention, by controlling the position of a one-dimensional imaging unit, a distance between the inspection position of the tested object and the distance of a one-dimensional imaging unit can be kept constant. Therefore, a defect of the tested object can be detected in higher precision.
According to still another aspect of the present invention, a position of a moving destination of a one-dimensional imaging unit can be calculated. Therefore, control of a position of the one-dimensional imaging unit becomes easy.
According to still another aspect of the present invention, a moving direction of a one-dimensional imaging unit can be specified easily, regardless of the installation position of the one-dimensional imaging unit.
According to still another aspect of the present invention, a change of a phase is detected after extracting a predetermined frequency component. Therefore, an inspection position of a tested object and a position of a one-dimensional imaging unit can be detected in high precision, without receiving the influence of other frequency component.
According to still another aspect of the present invention, control of a movement of a one-dimensional imaging unit becomes easy based on the guide of a guiding unit.
According to still another aspect of the present invention, a defect of the surface of a tested object is inspected in a one-dimensional image from which a predetermined frequency component is removed. Therefore, erroneous detections of a defect due to a pattern light can be decreased.
According to still another aspect of the present invention, a cycle of brightness of a pattern light and a size of a detected defect are differentiated. Therefore, erroneous detections of a defect due to a pattern light can be decreased.
According to still another aspect of the present invention, there is provided a surface defect detection program capable of causing a computer to execute a surface defect inspection method.
Although the invention has been described with respect to a specific embodiment for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2006-025755 | Feb 2006 | JP | national |
