Claims
- 1. A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, said tape comprising: an electrically insulating flexible film; a plurality of electrically conductive circuit patterns consisting of copper or copper-alloy formed on said insulating film; each of said circuit patterns having an inner lead portion and an outer lead portion; a solder plated film, consisting of tin or tin-lead plated film, formed on said inner and outer lead portions of the respective circuit pattern;
- a first plated film and a second plated film formed on at least said outer lead portion as underlayers of said solder formed film;
- said first plated film formed on said circuit pattern consisting essentially of nickel; and
- said second plated film formed on said first plated film consisting of gold and/or palladium.
- 2. A tape as set forth in claim 1, wherein said inner lead portion of the circuit pattern has respective surfaces and said solder plated film is formed on one of said surfaces which is to be abutted against a semiconductor device.
- 3. A tape as set forth in claim 1, wherein said inner lead portion of the circuit pattern has a tip which protrudes from said insulating flexible film.
- 4. A tape as set forth in claim 1, wherein said first plated layer has a thickness of 0.1 to 1.5 .mu.m and the second plated layer has a thickness of 0.01 to 1.0 .mu.m.
- 5. A tape as set forth in claim 1, wherein a thickness of said solder-plated film is not more than 1.5 .mu.m.
- 6. A tape as set forth in claim 1, wherein said tape further comprises:
- a metal plated film consisting of gold or indium formed to cover said solder plated film on the circuit pattern.
- 7. A tape as set forth in claim 6, wherein a thickness of said gold or indium plated film is 0.01 to 0.5 .mu.m.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2-200183 |
Jul 1990 |
JPX |
|
2-200184 |
Jul 1990 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 099,051, filed Jul. 28, 1993, now abandoned which is a continuation of application Ser. No. 07/735,828, filed Jul. 25, 1991, now abandoned.
US Referenced Citations (12)
Foreign Referenced Citations (10)
Number |
Date |
Country |
373241 |
Jun 1990 |
EPX |
55-96662 |
Jul 1980 |
JPX |
59-010252 |
Jan 1984 |
JPX |
59-159553 |
Sep 1984 |
JPX |
62-40753 |
Feb 1987 |
JPX |
63-065633 |
Mar 1988 |
JPX |
63-133539 |
Jun 1988 |
JPX |
63-142644 |
Jun 1988 |
JPX |
2-90661 |
Mar 1990 |
JPX |
2222554 |
Sep 1990 |
JPX |
Non-Patent Literature Citations (6)
Entry |
"Tab Implementation and Trends" by P. Hoffman, Solid State Technology, vol. 31, No. 6, Jun. 1988, pp. 85-88, Port Washington, N.Y. USA. |
Abstract for JP-51-8757, (Aug. 21, 1980). |
Abstract for JP-58-139455, (Aug. 18, 1983). |
Abstract for JP-60-143636, (Jul. 29, 1985). |
Abstract for JP-60-147147, (Aug. 3, 1985). |
Abstract for JP-62-14452, (Jan. 23, 1987). |
Continuations (2)
|
Number |
Date |
Country |
Parent |
99051 |
Jul 1993 |
|
Parent |
735828 |
Jul 1991 |
|