TECHNIQUE FOR DEPOSITING METALLIC FILMS USING ION IMPLANTATION SURFACE MODIFICATION FOR CATALYSIS OF ELECTROLESS DEPOSITION

Abstract

Techniques for depositing metallic films using ion implantation surface modification for catalysis of electroless deposition are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for depositing a metallic film. The method may comprise depositing a catalyzing material on a structure, wherein the structure comprises a substrate, a dielectric layer on the substrate, and a resist layer on the dielectric layer, wherein the dielectric layer and the resist layer have one or more openings. The method may also comprise stripping the resist layer. The method may further comprise depositing a metallic film on the catalyzing material in the one or more openings of the structure to fill the one or more openings.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

In order to facilitate a fuller understanding of the present disclosure, reference is now made to the accompanying drawings, in which like elements are referenced with like numerals. These drawings should not be construed as limiting the present disclosure, but are intended to be exemplary only.

FIGS. 1A-1D depict a method for depositing a metallic film using an ion implantation surface modification for catalysis of electroless deposition bottom-up fill technique according to an embodiment of the present disclosure.

FIGS. 2A-2C depict a method for depositing a metallic film using an ion implantation surface modification for catalysis of electroless deposition technique according to an embodiment of the present disclosure.

Claims

1. A method for depositing a metallic film, the method comprising: depositing a catalyzing material on a structure, the structure comprising a substrate, a dielectric layer on the substrate, and a resist layer on the dielectric layer, the dielectric layer and the resist layer having one or more openings;stripping the resist layer; anddepositing a metallic film on the catalyzing material in the one or more openings of the structure to fill the one or more openings.

2. The method of claim 1, wherein the catalyzing material modifies at least one surface of the structure for catalyzing electroless deposition of the metallic film.

3. The method of claim 1, wherein the catalyzing material is deposited on the resist and the substrate.

4. The method of claim 3, wherein the catalyzing material mixes uniformly with the substrate to form a catalyzing layer.

5. The method of claim 4, wherein the catalyzing material is mixed to a predetermined depth.

6. The method of claim 5, wherein the predetermined depth is approximately 100 Å.

7. The method of claim 4, wherein the catalyzing layer provides improved metallic film surface adhesion.

8. The method of claim 1, wherein the catalyzing material comprises at least one of Pd, Ru, Rh, and Pt.

9. The method of claim 1, wherein the substrate is formed of at least one of Si, GaAs, Ge, SiC, InP, and GaN.

10. The method of claim 1, wherein the dielectric layer is formed of a low dielectric material.

11. The method of claim 10, wherein the low dielectric material comprises at least one of SiO2, SiON, boron phosphorus silicate glass (BPSG), carbon-doped glass (CDG), fluorine-doped glass (FDG), aerogels, or interlayer dielectrics.

12. The method of claim 1, wherein the one or more openings are formed by a patterning process.

13. The method of claim 12, wherein the patterning process comprises at least one of etching, masking, and photoresist processing.

14. The method of claim 1, wherein each of the one or more openings comprises a diameter of approximately 20 nm to 300 nm.

15. The method of claim 1, wherein each of the one or more openings comprises a high aperture ratio (HAR) of approximately 1:1 to 30:1.

16. The method of claim 1, wherein depositing the metallic film comprises a bottom-up fill.

17. The method of claim 1, wherein the metallic film comprises at least one of Cu, Ni, and CoWP.

18. A semiconductor structure formed from the method of claim 1.

19. A method for depositing a metallic film, the method comprising: depositing a catalyzing material on a structure, the structure comprising a substrate and a dielectric layer on the substrate;forming a catalyzing layer on the structure; anddepositing a metallic film on the catalyzing layer.

20. The method of claim 19, wherein the catalyzing material modifies at least one surface of the structure for catalyzing electroless deposition of the metallic film.

21. The method of claim 20, wherein the catalyzing layer is formed on the dielectric layer.

22. The method of claim 21, wherein the catalyzing layer comprises catalyzing material mixed uniformly with the dielectric layer.

23. The method of claim 22, wherein the catalyzing material is mixed to a predetermined depth of approximately 100 Å.

24. The method of claim 21, wherein the catalyzing layer provides improved metallic film surface adhesion.

25. The method of claim 19, wherein the catalyzing material comprises at least one of Pd, Ru, Rh, and Pt.

26. The method of claim 19, wherein the substrate is formed of at least one of Si, GaAs, Ge, SiC, InP, and GaN.

27. The method of claim 19, wherein the dielectric layer is formed of a low dielectric material.

28. The method of claim 27, wherein the low dielectric material comprises at least one of SiO2, SiON, boron phosphorus silicate glass (BPSG), carbon-doped glass (CDG), fluorine-doped glass (FDG), aerogels, or interlayer dielectrics.

29. The method of claim 19, wherein the metallic film comprises at least one of Cu, Ni, and CoWP.

30. A semiconductor structure formed from the method of claim 19.