Claims
- 1. A perpendicular exchange biased device comprising:
a layer of buffer material on a surface of a substrate, a layer of ferromagnetic material on a surface of the buffer layer, wherein the magnetization of the ferromagnetic layer lies in a direction perpendicular to the plane of the layer of ferromagnetic material; and a layer of antiferromagnetic material on a surface of the layer of ferromagnetic material.
- 2. A device according to claim 1, wherein the buffer material comprises a material selected from the group of:
copper and diamond.
- 3. A device according to claim 2, wherein the layer of ferromagnetic material comprises a material selected from the group of:
nickel or an alloy containing nickel.
- 4. A device according to claim 3, wherein the layer of antiferromagnetic material comprises a manganese-based alloy.
- 5. A device according to claim 4, wherein the manganese-based alloy is selected from the group of: FeMn, RhMn, PtMn and IrMn.
- 6. A device according to claim 1, wherein the buffer material comprises a (002) copper.
- 7. A device according to claim 1, wherein the buffer material comprises a (001) diamond.
- 8. A device according to claim 1, wherein the buffer material comprises one of: boron doped diamond or nitrogen doped diamond.
- 9. A method of making a perpendicular exchange biased device comprising:
positioning a layer of buffer material on a surface of a substrate, positioning a layer of ferromagnetic material on a surface of the layer of buffer material, wherein the magnetization of the ferromagnetic layer lies in a direction perpendicular to the plane of the layer of ferromagnetic material; and positioning a layer of antiferromagnetic material on a surface of the layer of ferromagnetic material.
- 10. The method of claim 9, wherein the buffer material comprises a material selected from the group of:
copper and diamond.
- 11. The method of claim 10, wherein the layer of ferromagnetic material comprises a material selected from the group of:
nickel or an alloy containing nickel.
- 12. The method of claim 11, wherein the layer of antiferromagnetic material comprises a manganese-based alloy.
- 13. The method of claim 12, wherein the manganese-based alloy is selected from the group of: FeMn, RhMn, PtMn and IrMn.
- 14. The method of claim 9, wherein the buffer material comprises a (002) copper.
- 15. The method of claim 9, wherein the buffer material comprises a (001) diamond.
- 16. The method of claim 9, wherein the buffer material comprises one of: boron doped diamond or nitrogen doped diamond.
- 17. The method of claim 9, wherein the step of positioning a layer of ferromagnetic material on a surface of the layer of buffer material, comprises the step of:
epitaxially growing the layer of ferromagnetic material on the surface of the layer of buffer material.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 60/386,997, filed Jun. 7, 2002.
Provisional Applications (1)
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Number |
Date |
Country |
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60386997 |
Jun 2002 |
US |