“Rapid Characterization and Modeling of Pattern-Dependent Variation in Chemical-Mechanical Polishing”; Brian E. Stine, Dennis O. Ouma, Member, IEEE, Rajesh R. Divecha, Member, IEEE, Duane S. Boning, IEEE, James E. Chung, Member, IEEE, Dale L. Harington, Member, IEEE, C. Randy Harwood, O. Samuel Nakagawa, and Soo-Young Oh, Member, IEEE; 1998 IEEE, pp. 129 to 140. |
“The Physical and Electrical Effects of Metal-Fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes”; Brian E. Stine, Duane S. Boning, member, IEEE, James E. Chung, Lawrence Camilletti, Frank Kruppa, Edward R. Equi, William Loh, Sharad Prasad, Moorthy Muthukrishnan, Daniel Towery, Micahel Berman, and Ashook Kapoor. 1998 EEE, pp. 665 to 679. |