Claims
- 1. A process for producing a stand-alone film, said process comprising the steps of:depositing a thin film by vapor deposition in a reactor chamber, said thin film being deposited on a substrate, said substrate being held within a pocket of a substrate platter, said substrate being heated to a temperature at which said depositing occurs; inputting an etch gas into said reactor, said etch gas flowing through said substrate platter and under said substrate held within said pocket, allowing said etch gas to remove said substrate to leave said thin film; cooling said thin film from said temperature at which said depositing occurs; and removing said thin film, said thin film being a stand-alone thin film.
- 2. A process for producing a stand-alone thin film as defined in claim 1 further including rotating said substrate platter during said depositing.
- 3. A process for producing a stand-alone film, said process comprising the steps of:depositing a thin film by vapor deposition in a reactor chamber, said thin film being deposited on a substrate, said substrate being held within a pocket of a substrate platter, said substrate being heated to a temperature at which said depositing occurs; inputting an etch gas into said reactor, said etch gas flowing through said substrate platter and under said substrate held within said pocket, allowing said etch gas to remove said substrate to leave said thin film; cooling said thin film from said temperature at which said depositing occurs; and removing said thin film, said thin film being a stand-alone thin film.
- 4. A process for producing a stand-alone thin film as defined in claim 3 further including rotating said substrate platter during said depositing.
- 5. A process for producing a stand-alone film, said process comprising the steps of:placing a substrate in a substrate holder within a reactor chamber, said substrate being selected for forming a thin film thereupon; heating said substrate to a predetermined temperature; depositing a thin film by vapor deposition in said reactor chamber upon said substrate, said heating being to said predetermined temperature at which said depositing occurs; inputting an etch gas into said reactor chamber, said etch gas flowing through said substrate holder and under said substrate, allowing said etch gas to remove said substrate to leave said thin film; determining when said substrate is removed from said thin film; cooling said thin film from said temperature at which said depositing occurs; and removing said thin film, said thin film being a stand-alone thin film.
- 6. A process as defined in claim 3 wherein said substrate is a foreign single crystal material.
- 7. A process as defined in claim 4 wherein said substrate is selected from a group consisting of silicon, SiC, GaP, Ge and GaAs.
- 8. A process as defined in claim 3 wherein said thin film is composed on a III-V material.
- 9. A process as defined in claim 6 wherein said thin film is a single crystal, polycrystal or amorphous.
- 10. A process as defined in claim 3 wherein at least one buffer layer is deposited first upon said substrate.
- 11. A process as defined in claim 3 wherein said depositing is of a plurality of layers to form said thin film of a predetermined thickness.
- 12. A process as defined in claim 3 wherein said stand-alone thin film has a thickness of less than about 0.025 inches and a diameter from about 2 to about 10 inches.
Parent Case Info
The present invention is a division of serial No. 09/062,723 filed April 14, 1998, now abandoned, which is number 07/991,502 filed Dec. 16, 1992, U.S. Pat. No. 5,252,366, issued Oct. 12, 1993 which is a division of serial number 07/469,128 filed Jan. 24, 1990, U.S. Pat. No. 5,129,360, issued Jul. 14, 1992.
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or for the Government for governmental purposes without the payment of any royalty thereon.
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
07/991502 |
Dec 1992 |
US |
Child |
09/062734 |
|
US |