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APPARATUS FOR BONDING WIRE
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Publication number 20240038717
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Publication date Feb 1, 2024
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Samsung Electronics Co., Ltd.
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Daewoong Heo
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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WIRE BONDING APPARATUS
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Publication number 20230086643
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Publication date Mar 23, 2023
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Samsung Electronics Co., Ltd.
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JONGEUN LEE
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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WIRE BONDING APPARATUS
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Publication number 20220149001
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Publication date May 12, 2022
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SHINKAWA LTD.
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Naoki SEKINE
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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BONDING DEVICE
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Publication number 20180061803
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Publication date Mar 1, 2018
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KAIJO CORPORATION
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Akio Sugito
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR DEVICE
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Publication number 20180005981
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Publication date Jan 4, 2018
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Rohm Co., Ltd.
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Motoharu HAGA
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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CAPILLARY ALIGNMENT JIG FOR WIRE BONDER
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Publication number 20170209955
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Publication date Jul 27, 2017
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TEXAS INSTRUMENTS INCORPORATED
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Elmer Rad Bais Tabio
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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BONDING DEVICE
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Publication number 20170005065
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Publication date Jan 5, 2017
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KAIJO CORPORATION
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Akio Sugito
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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BONDING DEVICE
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Publication number 20170005064
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Publication date Jan 5, 2017
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KAIJO CORPORATION
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Akio Sugito
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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WIRE BOND STRENGTHENING
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Publication number 20160322329
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Publication date Nov 3, 2016
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SKYWORKS SOLUTIONS, INC.
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Aldrin Quinones GARING
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR DEVICE
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Publication number 20150200181
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Publication date Jul 16, 2015
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Rohm Co., Ltd.
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Motoharu HAGA
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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ANTIOXIDANT GAS SUPPLY UNIT
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Publication number 20140311590
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Publication date Oct 23, 2014
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SHINKAWA LTD.
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Toru MAEDA
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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-
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HEATER BLOCK FOR WIRE BONDING SYSTEM
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Publication number 20120318853
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Publication date Dec 20, 2012
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FREESCALE SEMICONDUCTOR, INC.
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Wai Keong Wong
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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WIRE BONDING METHOD
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Publication number 20120138662
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Publication date Jun 7, 2012
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Fujitsu Limited
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Takayoshi Matsumura
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR