The present invention relates to wire feed systems, and more particularly, to improved wire feed systems for wire bonding machines.
In the manufacturer and processing of various semiconductor devices, wire bonding machines are often used to connect components in the devices. Such wire bonding machines typically include a wire feed system for feeding a wire on a wire spool to a bond head of the wire bonding machine. The bond head of the wire bonding machine typically carries a transducer (e.g., an ultrasonic transducer) and a bonding tool (e.g., a capillary tool, a wedge tool, etc.).
One function of the wire feed system of a wire bonding machine is to apply air pressure (or the like) to the wire for controlling the wire, for example, (1) to prevent wire damage during high speed motions, (2) for seating a ball of the wire in a capillary tool, etc. The wire extends from the wire feed system to a wire tensioning device adjacent the bond head.
U.S. Pat. No. 5,402,927 (“Adjustable Wire Tensioning Apparatus”) to Frasch discloses wire feed system 10 including: wire spool 11, stream of air 14, and limit stops 15, 16, amongst other parts. Stream of air 14 urges wire 12 to form a loose loop that is limited by limit stops 15 and 16. Wire 12 extends from wire feed system 10 to tensioning device 19, where tensioning device 19 applies a much greater force to the wire than the force applied by wire feed system 10. Tensioning device 19 works in conjunction with different air pressure sources such that the force applied via tensioning device 19 may be varied during the wire bonding cycle.
Thus, the '927 patent discloses an adjustable wire tensioning device. Unfortunately, the system disclosed in the '927 patent is deficient in providing an efficient variable tension to the wire in certain applications. For example, because the tensioning device is supported at the bond head, the systems used to provide adjustable tension adds weight/mass to the bond head. Because of the high speed precision motions carried out by a bond head, such additional weight/mass is undesirable, and such a configuration may not be able to carry out the desired number of wire bonds in a given time period because of the additional weight/mass. Further, because of the limited wire length between the bonding tool and the tensioning device, an adequate wire length is not provided for certain looping motions. Further still, the wire length between the air guide and the tensioner is not subject to the variable tension, which may result in a non-optimized tension setting for said wire length.
Thus, it would be desirable to a wire feed system for a wire bonding machine overcoming one or more of the deficiencies of the prior art.
According to an exemplary embodiment of the present invention, a wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide.
According to another exemplary embodiment of the present invention, a method of operating a wire feed system of a wire bonding machine is provided. The method includes providing a length of wire to an air guide of the wire feed system. The method also includes varying a tension applied to at least a portion of the length of wire provided to the air guide.
The invention is best understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawing are the following figures:
U.S. Pat. No. 5,402,927 entitled “Adjustable Wire Tensioning Apparatus,” and United States Patent Application Publication No. US 2006/0065695 entitled “Wire Feed System For A Wire Bonding Apparatus,” relate to wire bonding technology, and in particular to wire feed and tensioning systems, and are herein incorporated by reference in their entirety.
In the art of wire bonding, sufficient tension is applied to a wire during the wire bonding cycle, for example, (1) to help ball seating and (2) to prevent wire damage during high speed motions. At different portions of the wire bonding cycle, a desired (e.g., ideal) tension is different than at other portions of the wire bonding cycle. For example, during high speed motions (e.g., ascending to a reset height along the Z-axis, descending to first bond, etc.) a relatively high tension is desirable, for example, to be able to pull excess wire back (e.g., during ascension to reset height) and to seat the ball (e.g., while descending to first bond). In contrast, during certain looping motions, a significantly lower tension is desired because excessive tension could pull out bends made during the looping motions.
In a conventional wire bonding system that does not include a variable tension wire feed system, a single wire tension may be selected at the wire feed system. This tension may, and likely will be, lower than is desired for certain non-looping motions, and as such, wire whipping and other wire instability issues may a rise. Further, this type of problem may be compounded because of the machine to machine tension variation (and perhaps the wire to wire tension variation) that will result.
According to the certain exemplary embodiments of the present invention, a wire feed system (e.g., including various control schemes and corresponding hardware designs) is provided that provides a variable tension to the wire depending upon the portion of the wire bonding cycle. More specifically, the tension level may be controlled by software in the control scheme based on which part of the wire cycle the bonder is going through.
An exemplary wire feed system provides the variable tension by controlling the wire location inside a device called an air guide. Such a wire feed system may include, for example, sensors (e.g., optical sensors), capstans, and a motor controlled wire spool turning mechanism that is configured to (1) feed wire and (2) pull back wire.
Exemplary steps of operating such a system are now summarized. First, before the start of the reset motion, the wire spool will turn to pull back wire until the wire has entered a high tension zone close to the air inlet. A feed sensor located near the air inlet will control the motor controlled wire spool, thereby controlling the wire position. The wire will be kept in the high tension zone until the z-position reaches 1st bond. Second, at the start of the 1st bond, wire spool will turn to feed wire so that the wire will approach a stop feed sensor of the air guide which is further away from the air inlet in comparison to the feed sensor. Thus, the wire enters the low tension zone where the wire will be kept during looping (e.g., until 2nd bond is completed). Third, prior to the start of the z reset motion, the first step may be repeated (i.e., the wire spool will turn to pull back wire until the wire is entered into a high tension zone close to the air inlet). Using this exemplary method, the amount of the wire spool turning can be calculated so that the right amount of wire is fed out or pulled in to enter the desired tension zone. For example, this can be a parameter in the wire bonding machine. Many variations of this exemplary system/method are possible, for example, a capstan can be added to the top of the air guide so that during looping motion, the wire touches the capstan which further reduces the air tension.
Another exemplary wire feed system according to the present invention provides the variable wire tension by switching a valve between an “on” and an “off” position. For example, when the valve is on (i.e., open) a higher flow is provided, and thus, a higher tension is generated. When the valve is off (i.e., closed) a lower flow is provided, and thus, a lower tension is generated.
Wire feed system 102 (of which certain components are omitted for clarity) includes wire spool mount 116 (configured to receive a wire supply such as a wire spool), wire guide bar 124 (e.g., diverter bar 124), air guide 118, air guide gauge 120, and tensioner gauge 122. These components are stationary elements of wire bonding machine 100 and do not travel with optics housing/bondhead 104. As illustrated in
As provided above, in certain exemplary embodiments, the present invention relates to a wire feed system with variable tension. For example, the wire feed system may define multiple tension zones (e.g., high and low tension zones). Further, a fluid pressure (e.g., pressurized air) may be applied to the wire path of the wire feed system. By providing variable wire tension at the wire feed system of a wire bonding machine according to the present invention, a number of advantages are achieved. For example, the wire tension may be adjusted at the wire feed system based on the timing of the wire bonding cycle. Further, because the variable wire tension system is provided at the wire feed system, in contrast to being provided at the wire tensioning device, additional weight/mass may not be applied to the bond head carrying the wire tensioning device.
Also shown in
While the sensors are illustrated in a given position, a wire may not necessarily need to be in contact with the sensor to define the position/zone of the sensor for use in the control scheme: the sensor may detect the position of the sensor without contact, where the detected position is used in the control scheme (e.g., to cause rotation of the wire spool mount motor).
In various exemplary embodiments of the present invention “capstans” are provided. As used herein the term “capstan” refers to a rotatable or a non-rotatable (e.g., fixed) member. In any event, whether rotatable or not, the capstans are intended to define a boundary for a wire.
As will be explained below with reference to
Referring now to
Conversely, if it is desired to move wire 220 from high tension zone 208 as shown in
The positions of the sensors, and the position of the wire detected by the sensors as being in the high or low tension zone, may be optimized as is desired in a given configuration. Further, the sensors may even be located outside of the air guide while still providing the desired function. In a wire feed system having an air guide with a high tension zone and a low tension zone (such as the system illustrated in
While wire feed system 200 is described in terms of (1) a clockwise rotation of wire spool 202 to move from low tension zone 210 to high tension zone 208, and (2) a counterclockwise rotation of wire spool 202 to move from high tension zone 208 to low tension zone 210, this design in exemplary in nature. Depending upon the design of the wire feed system the rotations may be used to provide the opposite result.
Also illustrated in
As is described above with respect to the exemplary embodiment of the present invention illustrated in
Also illustrated in
As is described above with respect to the exemplary embodiments of the present invention illustrated in
According to certain exemplary embodiments of the present invention, the location of the capstans (e.g., capstans 318a and 318b in
In the exemplary embodiments of the present invention illustrated in
When in the “on” or “open valve” position, air inlets 602a, 602b, and 602c may be configured to have the same or different air pressures associated therewith. For example, in the exemplary embodiment of the present invention shown in
Of course, alternate valve schemes are contemplated. For example, not all inlets need to receive the pressurized fluid in order for the system to be in a high tension mode. More specifically, certain inlet(s) may receive pressurized fluid in low tension mode, while other inlet(s) may receive pressurized fluid in high tension mode. Thus, the valves associated with the inlets may be “switched.”
Further, it is understood that
Further still, a single inlet (or group of inlets) may be provided to be used for both high and low tension, but the fluid pressure passing through those inlets may be varied based upon the portion of the wire bonding cycle.
Thus, according to the various exemplary variable tension systems and methods described herein, a number of advantages are achieved. A different (e.g., desired) tension level can be provided for each part of the wire bonding cycle, thereby providing improved bonding results. For example, the speed used during certain non-looping motions (e.g., z reset, descent to 1st speed, etc.) may be increased because of the increased wire tension during these motions. Often, these non-looping motions are performed at a reduced speed to provide better looping and ball seating. Additionally, the potential for wire damage and/or wire leaning may also be reduced because if a low tension is used during high speed motions wire whipping and/or wire buckle (amongst other potential issues) may result between the wire clamp and the tensioner.
Further still, the present invention may provide a reduced machine to machine looping variation. This is because when high tension is used on a wire bonding machine, the looping profile tends to be sensitive to variation of the tension which could be caused by machine to machine differences or wire location in the air guide. Through the present invention, by keeping the tension relatively low during looping motions, the looping will be more consistent.
While the present invention has been described primarily with respect to air, any of a number of pressurized fluids may be used as is desired.
While the present invention has been illustrated with respect to certain exemplary configurations (having a certain number and position of sensors and/or capstans), alternative configurations (having more or less, or differently positioned, sensors and/or capstans) are contemplated.
Any of a number of sensors may be used within the scope of the present invention, including but not limited to: proximity sensors, contact sensors, motion sensors, etc.
While certain exemplary embodiments of the present invention have been described with respect to a high tension zone and a low tension zone, the present invention is not limited thereto. For example, there may be more than two tension zones within a wire feed system of the present invention.
While the present invention has been described primarily in connection with wire feed systems and methods of operating wire feed systems, it is not limited thereto. For example, the present invention may be embodied in a wire bonding machine including a wire feed system as described herein, amongst other components such as a control system for operating the wire feed system. Alternatively, the present invention may be embodied as a method of operating a wire bonding machine.
Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US06/43760 | 11/9/2006 | WO | 00 | 12/11/2007 |