Number | Name | Date | Kind |
---|---|---|---|
4783722 | Osaki et al. | Nov 1988 | |
5130779 | Agarwala et al. | Jul 1992 | |
5225634 | Petroz | Jul 1993 | |
5640052 | Tsukamoto | Jun 1997 | |
5854514 | Roldan et al. | Dec 1998 |
Entry |
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“Super CSP: The Wafer Level Package”, Semiconductor Packaging Symposium, Session V: Chipscale Packaging, SEMI (1988), pp. F-1-F-10. |