INVENSAS BONDING TECHNOLOGIES, INC

Organization

SAN JOSE, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures without intervening adhesive
- Patent number 11,476,213
- Issue date Oct 18, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,462,419
- Issue date Oct 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Large metal pads over TSV
- Patent number 11,393,779
- Issue date Jul 19, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security circuitry for bonded structures
- Patent number 11,385,278
- Issue date Jul 12, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- G01 - MEASURING TESTING
Information Patent Grant
Bonded structures
- Patent number 11,380,597
- Issue date Jul 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,373,963
- Issue date Jun 28, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mitigating surface damage of probe pads in preparation for direct b...
- Patent number 11,355,404
- Issue date Jun 7, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing stacked substrates
- Patent number 11,348,801
- Issue date May 31, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,296,053
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,276,676
- Issue date Mar 15, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded lamination for improved image clarity in optical devices
- Patent number 11,256,004
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature bonded structures
- Patent number 11,244,916
- Issue date Feb 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for low temperature device bonding
- Patent number 11,244,920
- Issue date Feb 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level bonding of obstructive elements
- Patent number 11,205,625
- Issue date Dec 21, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical waveguides, direct-bonded waveguide interface jo...
- Patent number 11,169,326
- Issue date Nov 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- G02 - OPTICS
Information Patent Grant
Interlayer connection of stacked microelectronic components
- Patent number 11,171,117
- Issue date Nov 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,158,606
- Issue date Oct 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,158,573
- Issue date Oct 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding surfaces for microelectronics
- Patent number 11,056,348
- Issue date Jul 6, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for processing devices
- Patent number 11,037,919
- Issue date Jun 15, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 11,031,285
- Issue date Jun 8, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded optoelectronic interconnect for high-density integrat...
- Patent number 11,011,503
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIAS WITH METAL PLANE LAYERS AND METHODS OF MANUF...
- Publication number 20230352369
- Publication date Nov 2, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEQUENCES AND EQUIPMENT FOR DIRECT BONDING
- Publication number 20230067677
- Publication date Mar 2, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Bongsub Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20230036441
- Publication date Feb 2, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY OCCLUSIVE PROTECTIVE ELEMENT FOR BONDED STRUCTURES
- Publication number 20230019869
- Publication date Jan 19, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Laura Wills Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING STACKED SUBSTRATES
- Publication number 20230008039
- Publication date Jan 12, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT WITH ROUTING STRUCTURE IN BONDING LAYER
- Publication number 20230005850
- Publication date Jan 5, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20220373593
- Publication date Nov 24, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT BONDING AND DEBONDING OF CARRIER
- Publication number 20220319901
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Dominik Suwito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING AND DEBONDING OF CARRIER
- Publication number 20220320036
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PADS OVER TSV
- Publication number 20220302058
- Publication date Sep 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20220302048
- Publication date Sep 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20220293567
- Publication date Sep 15, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20220285213
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
- Publication number 20220285236
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR DIRECT BONDING
- Publication number 20220285303
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Laura Wills Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE...
- Publication number 20220246497
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE...
- Publication number 20220208650
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME
- Publication number 20220208702
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED STRUCTURES
- Publication number 20220208723
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
- Publication number 20220199560
- Publication date Jun 23, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20220189941
- Publication date Jun 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20220165692
- Publication date May 26, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES
- Publication number 20220155490
- Publication date May 19, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem HABA
- G02 - OPTICS
Information Patent Application
WAFER-LEVEL BONDING OF OBSTRUCTIVE ELEMENTS
- Publication number 20220139849
- Publication date May 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

INVENSAS BONDING TECHNOLOGIES, INC

Organization

Patents Grantslast 30 patents

Bonded structures without intervening adhesive

Microelectronic assemblies

Seal for microelectronic assembly

Large metal pads over TSV

Security circuitry for bonded structures

Bonded structures

Protective elements for bonded structures

Microelectronic assembly from processed substrate

Mitigating surface damage of probe pads in preparation for direct b...

Processing stacked substrates

Bond enhancement structure in microelectronics for trapping contami...

Direct bonded stack structures for increased reliability and improv...

3D IC method and device

Stacked devices and methods of fabrication

Conductive barrier direct hybrid bonding

Direct-bonded lamination for improved image clarity in optical devices

Seal for microelectronic assembly

Low temperature bonded structures

Method and structures for low temperature device bonding

Wafer-level bonding of obstructive elements

Integrated optical waveguides, direct-bonded waveguide interface jo...

Interlayer connection of stacked microelectronic components

Molded direct bonded and interconnected stack

Interconnect structures

Multi-metal contact structure in microelectronic component

Bonding surfaces for microelectronics

Techniques for processing devices

Diffusion barrier collar for interconnects

3D IC method and device

Direct-bonded optoelectronic interconnect for high-density integrat...

Patents Applicationslast 30 patents

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

THROUGH-SUBSTRATE VIAS WITH METAL PLANE LAYERS AND METHODS OF MANUF...

SEQUENCES AND EQUIPMENT FOR DIRECT BONDING

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

OPTICALLY OCCLUSIVE PROTECTIVE ELEMENT FOR BONDED STRUCTURES

PROCESSING STACKED SUBSTRATES

ELEMENT WITH ROUTING STRUCTURE IN BONDING LAYER

SEAL FOR MICROELECTRONIC ASSEMBLY

SECURITY CIRCUITRY FOR BONDED STRUCTURES

BONDED STRUCTURES

DIRECT BONDING AND DEBONDING OF CARRIER

DIRECT BONDING AND DEBONDING OF CARRIER

DIRECT BONDING METHODS AND STRUCTURES

METAL PADS OVER TSV

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...

CONTACT STRUCTURES FOR DIRECT BONDING

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE...

STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE...

STRUCTURE WITH CONDUCTIVE FEATURE AND METHOD OF FORMING SAME

DIRECTLY BONDED STRUCTURES

BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE

STACKED DEVICES AND METHODS OF FABRICATION

LOW TEMPERATURE BONDED STRUCTURES

DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES

WAFER-LEVEL BONDING OF OBSTRUCTIVE ELEMENTS