Ningbo Semiconductor International Corporation (Shanghai Branch)

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging method of a film bulk acoustic resonator
- Patent number 12,081,191
- Issue date Sep 3, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Air gap type semiconductor device package structure and fabrication...
- Patent number 11,695,387
- Issue date Jul 4, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Yunxiang Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF
- Publication number 20230353118
- Publication date Nov 2, 2023
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FORMING FILM BULK ACOUSTIC RESONATOR
- Publication number 20220231651
- Publication date Jul 21, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
- Publication number 20220200568
- Publication date Jun 23, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220112075
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220112076
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112077
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220106186
- Publication date Apr 7, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integration Method and Integration Structure for Control Circuit an...
- Publication number 20220094337
- Publication date Mar 24, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
- Publication number 20220085788
- Publication date Mar 17, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
- Publication number 20220085789
- Publication date Mar 17, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CRYSTAL RESONATOR, AND INTEGRATED STRUCTURE OF CONTROL CIRCUIT AND...
- Publication number 20220085785
- Publication date Mar 17, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATION METHOD AND INTEGRATION STRUCTURE FOR CONTROL CIRCUIT AN...
- Publication number 20220077844
- Publication date Mar 10, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATION STRUCTURE OF CRYSTAL OSCILIATOR AND CONTROL CIRCUIT AND...
- Publication number 20220077231
- Publication date Mar 10, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20220063987
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220063988
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATING STRUCTURE FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT, AN...
- Publication number 20220069008
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR, FILTER AND RADIO FREQUENCY COMMUNICAT...
- Publication number 20220029603
- Publication date Jan 27, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
- Publication number 20210391382
- Publication date Dec 16, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...
- Publication number 20210242855
- Publication date Aug 5, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSISTOR MANUFACTURING METHOD AND GATE-ALL-AROUND DEVICE STRUCTURE
- Publication number 20210234035
- Publication date Jul 29, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR AND FABRICATION METHOD THEREOF
- Publication number 20210226600
- Publication date Jul 22, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Guohuang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF
- Publication number 20210218384
- Publication date Jul 15, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Huan SUI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...
- Publication number 20210218381
- Publication date Jul 15, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FBAR
- Publication number 20210194456
- Publication date Jun 24, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR
- Publication number 20210184645
- Publication date Jun 17, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION...
- Publication number 20200366267
- Publication date Nov 19, 2020
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Yunxiang DI
- H01 - BASIC ELECTRIC ELEMENTS

Ningbo Semiconductor International Corporation (Shanghai Branch)

Organization

Patents Grantslast 30 patents

Packaging method of a film bulk acoustic resonator

Air gap type semiconductor device package structure and fabrication...

MEMS packaging structure and manufacturing method therefor

Patents Applicationslast 30 patents

FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF

METHOD FOR FORMING FILM BULK ACOUSTIC RESONATOR

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

MEMS PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR

MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Integration Method and Integration Structure for Control Circuit an...

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

CRYSTAL RESONATOR, AND INTEGRATED STRUCTURE OF CONTROL CIRCUIT AND...

INTEGRATION METHOD AND INTEGRATION STRUCTURE FOR CONTROL CIRCUIT AN...

INTEGRATION STRUCTURE OF CRYSTAL OSCILIATOR AND CONTROL CIRCUIT AND...

MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

INTEGRATING STRUCTURE FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT, AN...

BULK ACOUSTIC WAVE RESONATOR, FILTER AND RADIO FREQUENCY COMMUNICAT...

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...

TRANSISTOR MANUFACTURING METHOD AND GATE-ALL-AROUND DEVICE STRUCTURE

RESONATOR AND FABRICATION METHOD THEREOF

FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF

PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...

PACKAGING METHOD AND PACKAGING STRUCTURE OF FBAR

PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR

AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION...

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