TANAKA DENSHI KOGYO K.K.

Organization

Chiyoda-ku, Tokyo, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-coated silver bonding wire and manufacturing method thereof, a...
- Patent number 11,289,442
- Issue date Mar 29, 2022
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding, and semiconductor...
- Patent number 11,251,153
- Issue date Feb 15, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium (Pd)-coated copper wire for ball bonding
- Patent number 10,195,697
- Issue date Feb 5, 2019
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver—gold alloy bonding wire
- Patent number 9,362,249
- Issue date Jun 7, 2016
- Tanaka Denshi Kogyo K.K.
- Kazuhiko Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag—Au—Pd ternary alloy bonding wire
- Patent number 9,103,001
- Issue date Aug 11, 2015
- Tanaka Denshi Kogyo K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Au bonding wire for semiconductor device
- Patent number 8,440,137
- Issue date May 14, 2013
- Tanaka Denshi Kogyo K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold alloy wire for ball bonding
- Patent number 8,147,750
- Issue date Apr 3, 2012
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold alloy wire for bonding wire having high initial bondability, h...
- Patent number 7,857,189
- Issue date Dec 28, 2010
- Tanaka Denshi Kogyo K.K.
- Kazunari Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold alloy wire for bonding wire having high bonding reliability, h...
- Patent number 7,678,999
- Issue date Mar 16, 2010
- Tanaka Denshi Kogyo K.K.
- Kazunari Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold wire for semiconductor element connection and semiconductor el...
- Patent number 6,492,593
- Issue date Dec 10, 2002
- Tanaka Denshi Kogyo K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spool case of bonding wire
- Patent number 6,241,094
- Issue date Jun 5, 2001
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Tadao Anjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a bump
- Patent number 6,213,382
- Issue date Apr 10, 2001
- Tanaka Denshi Kogyo K.K.
- Hideyuki Akimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and electronic part using the same
- Patent number 6,187,114
- Issue date Feb 13, 2001
- Matsushita Electric Industrial Co. Ltd.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold alloy wire and method for making a bump
- Patent number 6,159,420
- Issue date Dec 12, 2000
- Tanaka Denshi Kogyo K.K.
- Hideyuki Akimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for wedge bonding using a gold alloy wire
- Patent number 5,945,065
- Issue date Aug 31, 1999
- Tanaka Denshi Kogyo
- Teruo Kikuchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold wire for bonding
- Patent number 5,702,814
- Issue date Dec 30, 1997
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Shinichi Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an aluminum alloy wiring line
- Patent number 5,550,407
- Issue date Aug 27, 1996
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium bonding wire for semiconductor device
- Patent number 5,538,685
- Issue date Jul 23, 1996
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Fine lead alloy wire for forming bump electrodes
- Patent number 5,514,334
- Issue date May 7, 1996
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting semiconductor material and semiconductor devi...
- Patent number 5,514,912
- Issue date May 7, 1996
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine wire for forming bump electrodes using a wire bonder
- Patent number 5,384,090
- Issue date Jan 24, 1995
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alloy connecting materials for semiconductors
- Patent number 5,366,692
- Issue date Nov 22, 1994
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clad bonding wire for semiconductor device
- Patent number 5,364,706
- Issue date Nov 15, 1994
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- B32 - LAYERED PRODUCTS
Information Patent Grant
High purity gold bonding wire for semiconductor device
- Patent number 5,298,219
- Issue date Mar 29, 1994
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold line for bonding semiconductor element
- Patent number 4,775,512
- Issue date Oct 4, 1988
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Yasuo Fukui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

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Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220122937
- Publication date Apr 21, 2022
- TANAKA DENSHI KOGYO K.K.
- Mitsuo TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220005781
- Publication date Jan 6, 2022
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20200395330
- Publication date Dec 17, 2020
- TANAKA DENSHI KOGYO K.K.
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...
- Publication number 20200350273
- Publication date Nov 5, 2020
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170125135
- Publication date May 4, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170057020
- Publication date Mar 2, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-GOLD ALLOY BONDING WIRE
- Publication number 20160093586
- Publication date Mar 31, 2016
- TANAKA DENSHI KOGYO K.K.
- Kazuhiko YASUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM RIBBON FOR ULTRASONIC BONDING
- Publication number 20130164559
- Publication date Jun 27, 2013
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE
- Publication number 20120312428
- Publication date Dec 13, 2012
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM FOR ULTRASONIC BONDING
- Publication number 20110236697
- Publication date Sep 29, 2011
- TANAKA DENSHI KOGYO, K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE
- Publication number 20110058979
- Publication date Mar 10, 2011
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AU ALLOY WIRE FOR BALL BONDING
- Publication number 20100314156
- Publication date Dec 16, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
GOLD ALLOY WIRE FOR BALL BONDING
- Publication number 20100226816
- Publication date Sep 9, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF...
- Publication number 20100171222
- Publication date Jul 8, 2010
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, H...
- Publication number 20090120665
- Publication date May 14, 2009
- TANAKA DENSHI KOGYO K.K.
- Kazunari Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, H...
- Publication number 20090101695
- Publication date Apr 23, 2009
- TANAKA DENSHI KOGYO K.K.
- Kazunari Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Bump Material
- Publication number 20080075626
- Publication date Mar 27, 2008
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au Bonding Wire For Semiconductor Device
- Publication number 20070298276
- Publication date Dec 27, 2007
- TANAKA DENSHI KOGYO K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

TANAKA DENSHI KOGYO K.K.

Organization

Patents Grantslast 30 patents

Palladium-coated copper bonding wire and method for manufacturing same

Palladium-coated copper bonding wire, manufacturing method of palla...

Palladium-coated copper bonding wire, wire bonding structure, semic...

Noble metal-coated silver wire for ball bonding and method for prod...

Gold-coated silver bonding wire and manufacturing method thereof, a...

Noble metal-coated silver wire for ball bonding, and semiconductor...

Palladium (Pd)-coated copper wire for ball bonding

Bonding wire for high-speed signal line

Silver—gold alloy bonding wire

Ag—Au—Pd ternary alloy bonding wire

Au bonding wire for semiconductor device

Gold alloy wire for ball bonding

Gold alloy wire for bonding wire having high initial bondability, h...

Gold alloy wire for bonding wire having high bonding reliability, h...

Gold wire for semiconductor element connection and semiconductor el...

Spool case of bonding wire

Method for making a bump

Solder material and electronic part using the same

Gold alloy wire and method for making a bump

Method for wedge bonding using a gold alloy wire

Gold wire for bonding

Semiconductor device having an aluminum alloy wiring line

Palladium bonding wire for semiconductor device

Fine lead alloy wire for forming bump electrodes

Method for connecting semiconductor material and semiconductor devi...

Fine wire for forming bump electrodes using a wire bonder

Alloy connecting materials for semiconductors

Clad bonding wire for semiconductor device

High purity gold bonding wire for semiconductor device

Gold line for bonding semiconductor element

Patents Applicationslast 30 patents

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...

PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...

NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING

PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING

SILVER-GOLD ALLOY BONDING WIRE

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

ALUMINUM RIBBON FOR ULTRASONIC BONDING

HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE

Ag-Au-Pd TERNARY ALLOY BONDING WIRE

ALUMINUM FOR ULTRASONIC BONDING

BONDING WIRE

AU ALLOY WIRE FOR BALL BONDING

GOLD ALLOY WIRE FOR BALL BONDING

HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF...

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, H...

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, H...

Wire Bump Material

Au Bonding Wire For Semiconductor Device