Alain Duboust

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Transfer chamber metrology for improved device yield
- Patent number 9,076,827
- Issue date Jul 7, 2015
- Applied Materials, Inc.
- David P. Bour
- G01 - MEASURING TESTING
Information Patent Grant
Endpoint control of multiple substrates of varying thickness on the...
- Patent number 8,694,144
- Issue date Apr 8, 2014
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making and apparatus having windowless polishing pad and...
- Patent number 8,465,342
- Issue date Jun 18, 2013
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making and apparatus having windowless polishing pad and...
- Patent number 8,157,614
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-layer polishing pad for low-pressure polishing
- Patent number 8,066,552
- Issue date Nov 29, 2011
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for local polishing control
- Patent number 7,842,169
- Issue date Nov 30, 2010
- Applied Materials, Inc.
- Stan Tsai
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint for electroprocessing
- Patent number 7,790,015
- Issue date Sep 7, 2010
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroprocessing profile control
- Patent number 7,709,382
- Issue date May 4, 2010
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrochemical mechanical processing
- Patent number 7,678,245
- Issue date Mar 16, 2010
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroprocessing profile control
- Patent number 7,655,565
- Issue date Feb 2, 2010
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Algorithm for real-time process control of electro-polishing
- Patent number 7,628,905
- Issue date Dec 8, 2009
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biased retaining ring
- Patent number 7,608,173
- Issue date Oct 27, 2009
- Applied Materials, Inc.
- Antoine P. Manens
- B24 - GRINDING POLISHING
Information Patent Grant
Grooved retaining ring
- Patent number 7,520,795
- Issue date Apr 21, 2009
- Applied Materials, Inc.
- Shi-Ping Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,422,516
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for electrochemical mechanical polishing pro...
- Patent number 7,390,429
- Issue date Jun 24, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pad with ion exchange membrane for electrochemical mecha...
- Patent number 7,344,432
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Liang-Yun Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,323,416
- Issue date Jan 29, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,311,592
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Edge bead removal by an electro polishing process
- Patent number 7,303,462
- Issue date Dec 4, 2007
- Applied Materials, Inc.
- Alain Duboust
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad assembly for electrochemical mechanical polishing
- Patent number 7,285,036
- Issue date Oct 23, 2007
- Applied Materials, Inc.
- Shou-Sung Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,278,911
- Issue date Oct 9, 2007
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retaining ring with conductive portion
- Patent number 7,276,743
- Issue date Oct 2, 2007
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,232,514
- Issue date Jun 19, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hydrogen bubble reduction on the cathode using double-cell designs
- Patent number 7,229,535
- Issue date Jun 12, 2007
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,207,878
- Issue date Apr 24, 2007
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,160,432
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad assembly for electrochemical mechanical processing
- Patent number 7,137,868
- Issue date Nov 21, 2006
- Applied Materials, Inc.
- Shou-Sung Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,137,879
- Issue date Nov 21, 2006
- Applied Materials, Inc.
- Liang-Yuh Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,128,825
- Issue date Oct 31, 2006
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...
- Publication number 20170151647
- Publication date Jun 1, 2017
- Applied Materials, Inc.
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER CHAMBER METROLOGY FOR IMPROVED DEVICE YIELD
- Publication number 20150263222
- Publication date Sep 17, 2015
- Applied Materials, Inc.
- David P. Bour
- C30 - CRYSTAL GROWTH
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20140222188
- Publication date Aug 7, 2014
- Applied Materials, Inc.
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Making and Apparatus Having Windowless Polishing Pad and...
- Publication number 20120258649
- Publication date Oct 11, 2012
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE CARRIER WITH MULTIPLE EMISSIVITY COEFFICIENTS FOR THIN FI...
- Publication number 20120227667
- Publication date Sep 13, 2012
- Applied Materials, Inc.
- Juno Yu-Ting HUANG
- C30 - CRYSTAL GROWTH
Information Patent Application
TRANSFER CHAMBER METROLOGY FOR IMPROVED DEVICE YIELD
- Publication number 20120118224
- Publication date May 17, 2012
- Applied Materials, Inc.
- David P. Bour
- C30 - CRYSTAL GROWTH
Information Patent Application
EPITAXIAL GROWTH TEMPERATURE CONTROL IN LED MANUFACTURE
- Publication number 20120118225
- Publication date May 17, 2012
- Applied Materials, Inc.
- Wei-Yung HSU
- C30 - CRYSTAL GROWTH
Information Patent Application
APPARATUS HAVING IMPROVED SUBSTRATE TEMPERATURE UNIFORMITY USING DI...
- Publication number 20120108081
- Publication date May 3, 2012
- Applied Materials, Inc.
- Donald J.K. OLGADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20120053717
- Publication date Mar 1, 2012
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL
- Publication number 20110053465
- Publication date Mar 3, 2011
- STAN TSAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING AND APPARATUS HAVING WINDOWLESS POLISHING PAD AND...
- Publication number 20100279585
- Publication date Nov 4, 2010
- APPLIED MATERIALS, INC.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH PROJECTING PORTION
- Publication number 20100267318
- Publication date Oct 21, 2010
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING
- Publication number 20100130013
- Publication date May 27, 2010
- Applied Materials, Inc.
- Feng Q. Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20090088050
- Publication date Apr 2, 2009
- WEI-YUNG HSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE
- Publication number 20090061741
- Publication date Mar 5, 2009
- Zhihong Wang
- B24 - GRINDING POLISHING
Information Patent Application
EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY
- Publication number 20090061617
- Publication date Mar 5, 2009
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTR...
- Publication number 20080277787
- Publication date Nov 13, 2008
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Polishing Article for Electrochemical Mechanical Polishing
- Publication number 20080108288
- Publication date May 8, 2008
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPROCESSING PROFILE CONTROL
- Publication number 20080047841
- Publication date Feb 28, 2008
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENDPOINT FOR ELECTROPROCESSING
- Publication number 20080051009
- Publication date Feb 28, 2008
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPROCESSING PROFILE CONTROL
- Publication number 20080045012
- Publication date Feb 21, 2008
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RETAINING RING WITH CONDUCTIVE PORTION
- Publication number 20080038999
- Publication date Feb 14, 2008
- Applied Materials, Inc.
- Antoine P. Manens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20080026681
- Publication date Jan 31, 2008
- PAUL D. BUTTERFIELD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
- Publication number 20080003931
- Publication date Jan 3, 2008
- Antoine P. Manens
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20070295611
- Publication date Dec 27, 2007
- FENG Q. LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20070290166
- Publication date Dec 20, 2007
- Feng Q. Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for electrochemical mechanical polishing of cu...
- Publication number 20070251832
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Tianbao Du
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Planarization of substrates at a high polishing rate using electroc...
- Publication number 20070243709
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Alain Duboust
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Removal profile tuning by adjusting conditioning sweep profile on a...
- Publication number 20070227902
- Publication date Oct 4, 2007
- APPLIED MATERIALS, INC.
- Tianbao Du
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Novel rinse solution to remove cross-contamination
- Publication number 20070219103
- Publication date Sep 20, 2007
- APPLIED MATERIALS, INC.
- Tianbao Du
- H01 - BASIC ELECTRIC ELEMENTS

Alain Duboust

Person

Patents Grantslast 30 patents

Endpoint control of multiple substrate zones of varying thickness i...

Transfer chamber metrology for improved device yield

Endpoint control of multiple substrates of varying thickness on the...

Method of making and apparatus having windowless polishing pad and...

Method of making and apparatus having windowless polishing pad and...

Multi-layer polishing pad for low-pressure polishing

Method and apparatus for local polishing control

Endpoint for electroprocessing

Electroprocessing profile control

Method and apparatus for electrochemical mechanical processing

Electroprocessing profile control

Algorithm for real-time process control of electro-polishing

Biased retaining ring

Grooved retaining ring

Conductive polishing article for electrochemical mechanical polishing

Method and composition for electrochemical mechanical polishing pro...

Conductive pad with ion exchange membrane for electrochemical mecha...

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Edge bead removal by an electro polishing process

Pad assembly for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Retaining ring with conductive portion

Method and composition for polishing a substrate

Hydrogen bubble reduction on the cathode using double-cell designs

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Patents Applicationslast 30 patents

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...

TRANSFER CHAMBER METROLOGY FOR IMPROVED DEVICE YIELD

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

Method of Making and Apparatus Having Windowless Polishing Pad and...

SUBSTRATE CARRIER WITH MULTIPLE EMISSIVITY COEFFICIENTS FOR THIN FI...

TRANSFER CHAMBER METROLOGY FOR IMPROVED DEVICE YIELD

EPITAXIAL GROWTH TEMPERATURE CONTROL IN LED MANUFACTURE

APPARATUS HAVING IMPROVED SUBSTRATE TEMPERATURE UNIFORMITY USING DI...

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL

METHOD OF MAKING AND APPARATUS HAVING WINDOWLESS POLISHING PAD AND...

POLISHING PAD WITH PROJECTING PORTION

SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE

EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY

METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTR...

Conductive Polishing Article for Electrochemical Mechanical Polishing

ELECTROPROCESSING PROFILE CONTROL

ENDPOINT FOR ELECTROPROCESSING

ELECTROPROCESSING PROFILE CONTROL

RETAINING RING WITH CONDUCTIVE PORTION

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

SYSTEM AND METHOD FOR IN-SITU HEAD RINSE

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

Method and apparatus for electrochemical mechanical polishing of cu...

Planarization of substrates at a high polishing rate using electroc...

Removal profile tuning by adjusting conditioning sweep profile on a...

Novel rinse solution to remove cross-contamination